-
公开(公告)号：US20240429623A1
公开(公告)日：2024-12-26
申请号：US18734973
申请日：2024-06-05
Applicant: LG ELECTRONICS INC.
Inventor： Yusuhk SUH , Dongik LEE , Seungmin WOO
Abstract: An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; and an array antenna portion having a plurality of antenna elements disposed on the PCB. Each of the plurality of antenna elements is configured in a two-patch antenna structure, and a plurality of first patch antennas disposed on a first surface of the PCB are disposed to be spaced apart by a third gap. An area between the plurality of second patch antennas disposed inside the PCB includes a first region in which a plurality of second patch antennas are disposed to be spaced apart by a first gap, and a second region in which the plurality of second patch antennas are disposed to be spaced apart by a second gap.
-
公开(公告)号：US20240429621A1
公开(公告)日：2024-12-26
申请号：US18645299
申请日：2024-04-24
Applicant: LG ELECTRONICS INC.
Inventor： Yusuhk SUH , Dongik LEE , Seungmin WOO
Abstract: An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; an array antenna portion including a plurality of antenna elements disposed on the PCB; a radio frequency integrated circuit (RFIC) chip bonded to a second surface of the PCB, the second surface being another outermost surface of the PCB; and a plurality of signal connection lines connected from the RFIC chip to the array antenna portion. A length of each of the plurality of signal connection lines may be a length of a connection line connected between the RFIC chip and the array antenna portion, and the plurality of signal connection lines may have the same length.
-
公开(公告)号：US20240421496A1
公开(公告)日：2024-12-19
申请号：US18633090
申请日：2024-04-11
Applicant: LG ELECTRONICS INC.
Inventor： Yusuhk SUH , Dongik LEE , Seungmin WOO
Abstract: An electronic device may include a display; and first and second antenna structures disposed around the display. The first antenna structure may include a first PCB, first and second array antennas, and a first wireless communication circuit. The second antenna structure may include a second PCB, third and fourth array antennas, and a second wireless communication circuit. The second and fourth array antennas may form a beam pattern in a first direction, which is a bottom direction. The first and third array antennas may form a beam pattern in a third direction, which is a front direction.
-
公开(公告)号：US20220407233A1
公开(公告)日：2022-12-22
申请号：US17773008
申请日：2019-10-30
Applicant: LG ELECTRONICS INC.
Inventor： Seungmin WOO
IPC: H01Q9/06 , H04B7/06 , H04B1/40 , H04B7/0413 , H01Q21/06 , H01Q23/00 , H01Q1/48 , H01Q5/385 , H01Q1/24
Abstract: Provided is an electronic device comprising an antenna for 5G communication according to the present invention. The electronic device comprises an array antenna which is implemented as a multi-layer substrate inside the electronic device and includes multiple antenna elements. Each of the multiple antenna elements of the array antenna may comprise: a patch antenna disposed on a specific layer of the multi-layer substrate and including a first patch and a second patch which are spaced a predetermined distance apart from each other; and a ground layer disposed under the patch antenna and having a slot. Meanwhile, the first patch and the second patch may be connected to the ground layer through multiple vias, and the multiple vias may be arranged in the longitudinal direction of the slot while being adjacent to the slot.
-
公开(公告)号：US20210219040A1
公开(公告)日：2021-07-15
申请号：US16967540
申请日：2018-04-10
Applicant: LG ELECTRONICS INC.
Inventor： Seungmin WOO
Abstract: The present invention relates to a wireless sound device comprising: a housing having a sound hole formed on one side thereof; a sound output unit provided to the housing so as to output sound via the sound hole; a substrate provided to the housing so as to be positioned on the other side of the sound output unit; a battery provided to the housing so as to be positioned on the other side of the substrate, and comprising a pair of electrodes; a wireless communication unit provided to the substrate and carrying out wireless communication by supplying an RF signal; a pair of power terminals for connecting the pair of electrodes with the substrate so as to receive power from the battery; and a feed line connected to at least one of the pair of electrodes so as to supply the RF signal from the wireless communication unit to the at least one of the pair of electrodes, wherein the electrode connected to the feed line is an antenna for radiating the RF signal.
-
Patent Agency Ranking
公开(公告)号：US20210168932A1
公开(公告)日：2021-06-03
申请号：US17154209
申请日：2021-01-21
Applicant: LG ELECTRONICS INC.
Inventor： Seungmin WOO
Abstract: The present disclosure relates to an electronic device, and the electronic device may include a circuit board provided within a main body of the electronic device, on which a conductive layer made of a conductive material and a dielectric layer made of an insulating material are alternately laminated; at least one or more patch antennas disposed on the circuit board; a core layer located at a central portion inside the circuit board, and configured with any one of the dielectric layers; a ground layer disposed below the core layer; and an EBG structure located inside the circuit board in a symmetrical shape at the top and bottom with respect to the core layer, and the EBG structure restricts operating frequency signals radiated from the respective patch antennas from being interfered with each other.
-
公开(公告)号：US20240429622A1
公开(公告)日：2024-12-26
申请号：US18660877
申请日：2024-05-10
Applicant: LG ELECTRONICS INC.
Inventor： Yusuhk SUH , Dongik LEE , Seungmin WOO
Abstract: An antenna module includes a substrate having a first surface, a second surface, and a periphery between the first and second surfaces, a first array antenna disposed on the first surface of the substrate and forming a beam pattern toward a front area, a second array antenna disposed on a first part of the periphery of the substrate and forming a beam pattern toward a bottom area, and third and fourth array antennas disposed on second and third parts of the periphery of the substrate and forming beam patterns toward side areas.
-
公开(公告)号：US20230246326A1
公开(公告)日：2023-08-03
申请号：US18002957
申请日：2020-07-22
Applicant: LG ELECTRONICS INC.
Inventor： Seungmin WOO , Yusuhk SUH , Dongik LEE
CPC classification number: H01Q1/243 , H01Q1/48 , H01Q9/0407 , H01Q3/36 , H01Q9/28
Abstract: Provided is an electronic device having a multilayer substrate according to an embodiment. The electronic device may include a multilayer substrate on which an antenna is disposed and which includes a front layer, a back layer, a plurality of middle layers, and a plurality of ground layers. The antenna may include a lower patch that is disposed on a layer different from an upper ground among the plurality of ground layers and is electrically connected to the upper ground at a plurality of offset points; and an upper patch disposed spaced apart from the lower patch by a predetermined distance.
-
9.发明公开公开(公告)号：US20230163802A1
公开(公告)日：2023-05-25
申请号：US17922969
申请日：2021-07-20
Applicant: LG ELECTRONICS INC.
Inventor： Seungmin WOO , Yusuhk SUH , Dongik LEE
CPC classification number: H04B1/40 , H01Q1/2291 , H01Q9/045 , H01P3/081
Abstract: Provided is an electronic device having an antenna module according to one embodiment. The electronic device comprises: a transceiver circuit disposed in the antenna module composed of a multi-layer substrate; a first transmission line disposed on the first layer of the antenna module and configured to be electrically connected to the transceiver circuit; a second transmission line disposed on the second layer of the antenna module and configured to be electrically connected to the antenna; and a vertical via configured to vertically connect the first transmission line and the second transmission line, wherein at least one of the first and second transmission lines connected to the vertical via has an impedance converter.
-
10.发明申请公开(公告)号：US20220330160A1
公开(公告)日：2022-10-13
申请号：US17597275
申请日：2020-06-16
Applicant: LG ELECTRONICS INC.
Inventor： Jinyup HWANG , Ilnam CHO , Yoonoh YANG , Sangwook LEE , Seungmin WOO
Abstract: One disclosure of the present specification provides a method by which a communication device, which performs a measurement through multiple antenna panels, reports the measurement. The method may include the steps of: transmitting capability information to a base station; receiving measurement setting information from the base station; powering on a powered-off antenna panel among the multiple antennal panels in order to perform a measurement; performing the measurement through the multiple antenna panels; and transmitting a measurement report message including information indicating whether the corresponding antenna panel was in a powered-on state or a powered-off state prior to the measurement, and information on the measurement result.
-
-
-
-
-
-
-
-
-
Search Results
39
records
(took 0.033 seconds)
