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11.发明申请STRUCTURE FOR MULTI-ROW LEADFRAME AND SEMICONDUCTOR PACKAGE THEREOF AND MANUFACTURE METHOD THEREOF 审中-公开多行射线结构及其半导体封装及其制造方法
公开(公告)号：WO2010074510A2
公开(公告)日：2010-07-01
申请号：PCT/KR2009/007724
申请日：2009-12-23
Applicant: LG INNOTEK CO., LTD. , CHUN, Hyun A , CHOI, Jae Bong , LEE, Sung Won , RYU, Sung Wuk , LEE, Hyuk Soo , EOM, Sai Ran
Inventor： CHUN, Hyun A , CHOI, Jae Bong , LEE, Sung Won , RYU, Sung Wuk , LEE, Hyuk Soo , EOM, Sai Ran
IPC: H01L23/495
CPC classification number: H01L21/4832 , H01L23/49582 , H01L24/29 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/01029 , H01L2924/01046 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/181 , H01L2924/00 , H01L2924/01026 , H01L2924/01028 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.
Abstract translation: 本发明涉及一种用于半导体封装的多行引线框架，其特征在于：在引线框架材料上形成电镀图案（第一步骤）; 在电镀图案上形成保护图案（第二步骤）; 并通过使用保护图案作为掩模形成纳米图案（第三步骤），由此在电镀图案的上表面上形成保护图案，以通过防止由蚀刻溶液引起的由蚀刻溶液引起的对电镀层的损伤而提高产品的可靠性 形成引线框的图案，并由此解决使用镀层作为蚀刻掩模的问题。
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公开(公告)号：EP2656702A2
公开(公告)日：2013-10-30
申请号：EP11850595.7
申请日：2011-12-23
Applicant: LG Innotek Co., Ltd.
Inventor： LEE, Sang Myung , YOON, Sung Woon , LEE, Hyuk Soo , LEE, Sung Won , CHUN, Ki Do
CPC classification number: H05K1/0298 , H05K3/202 , H05K3/4647 , H05K3/465 , H05K3/4652 , H05K3/4682 , H05K2201/098 , H05K2203/0323 , H05K2203/0376
Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a center part having a first width and a contact part having a second width, the contact part makes contact with a surface of the core insulating layer, and the first width is larger than the second width. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.
Abstract translation: 公开了一种印刷电路板及其制造方法。 印刷电路板包括核心绝缘层，穿过核心绝缘层形成的至少一个通孔，埋在核心绝缘层中的内部电路层以及位于核心绝缘层的顶表面或底表面上的外部电路层 其中，所述过孔包括具有第一宽度的中心部分和具有第二宽度的接触部分，所述接触部分与所述芯绝缘层的表面接触，并且所述第一宽度大于所述第二宽度。 内部电路层和通孔同时形成，使得处理步骤减少。 由于提供了奇数电路层，印刷电路板具有轻薄的结构。
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公开(公告)号：EP2644010A2
公开(公告)日：2013-10-02
申请号：EP11852165.7
申请日：2011-12-23
Applicant: LG Innotek Co., Ltd.
Inventor： LEE, Sang Myung , YOON, Sung Woon , LEE, Hyuk Soo , LEE, Sung Won , CHUN, Ki Do
CPC classification number: H05K1/0298 , H05K3/46 , H05K3/4647 , H05K3/465 , H05K3/4652 , H05K3/4682 , H05K2201/0338 , H05K2203/0376
Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer. The via includes a first part, a second part below the first part, and a third part between the first and second parts, and the third part includes a metal different from a metal of the first and second parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.
Abstract translation: 公开了一种印刷电路板及其制造方法。 印刷电路板包括核心绝缘层，穿过核心绝缘层形成的至少一个通孔，埋在核心绝缘层中的内部电路层以及位于核心绝缘层的顶表面或底表面上的外部电路层 。 通孔包括第一部分，在第一部分下方的第二部分以及在第一和第二部分之间的第三部分，并且第三部分包括与第一和第二部分的金属不同的金属。 内部电路层和通孔同时形成，使得处理步骤减少。 由于提供了奇数电路层，印刷电路板具有轻薄的结构。
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Patent Agency Ranking
公开(公告)号：EP2656703A2
公开(公告)日：2013-10-30
申请号：EP11851645.9
申请日：2011-12-23
Applicant: LG Innotek Co., Ltd.
Inventor： LEE, Sang Myung , YOON, Sung Woon , LEE, Hyuk Soo , LEE, Sung Won , CHUN, Ki Do
CPC classification number: H05K1/0298 , H05K3/064 , H05K3/388 , H05K3/428 , H05K3/4647 , H05K3/4652 , H05K3/4682 , H05K2201/0341 , H05K2203/0376
Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.
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15.发明公开RADIANT HEAT CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, HEAT GENERATING DEVICE PACKAGE HAVING THE SAME, AND BACKLIGHT 审中-公开辐射热电路板，制造方法，具有发热装置及背光PACKAGE
公开(公告)号：EP2628176A2
公开(公告)日：2013-08-21
申请号：EP11832720.4
申请日：2011-10-10
Applicant: LG Innotek Co., Ltd.
Inventor： PARK, Hyun Gyu , CHO, In Hee , AN, Yun Ho , PARK, Jae Man , KIM, Eun Jin , KIM, Hae Yeon , LEE, Hyuk Soo
CPC classification number: H05K7/205 , F21V29/70 , G02F1/133615 , H01L23/3677 , H01L25/0753 , H01L33/647 , H01L2224/16225 , H05K1/0204 , H05K1/056 , H05K1/113 , H05K3/30 , H05K3/4608 , H05K13/00 , H05K2201/09054 , H05K2201/10106 , H05K2201/10969 , Y10T29/4913
Abstract: Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
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公开(公告)号：EP2644010B1
公开(公告)日：2020-03-11
申请号：EP11852165.7
申请日：2011-12-23
Applicant: LG Innotek Co., Ltd.
Inventor： LEE, Sang Myung , YOON, Sung Woon , LEE, Hyuk Soo , LEE, Sung Won , CHUN, Ki Do
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17.发明公开RADIANT HEAT CIRCUIT BOARD, HEAT GENERATING DEVICE PACKAGE HAVING THE SAME, AND BACKLIGHT UNIT 有权辐射热电路板，具有发热装置及背光单元封装
公开(公告)号：EP2625712A2
公开(公告)日：2013-08-14
申请号：EP11830887.3
申请日：2011-10-05
Applicant: LG Innotek Co., Ltd.
Inventor： PARK, Hyun Gyu , CHO, In Hee , AN, Yun Ho , PARK, Jae Man , KIM, Eun Jin , KIM, Hae Yeon , LEE, Hyuk Soo
CPC classification number: H05K1/021 , H01L23/3677 , H01L23/49838 , H01L25/0753 , H01L33/642 , H01L2224/73203 , H05K1/0204 , H05K1/056 , H05K2201/09054 , H05K2201/10106
Abstract: Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
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公开(公告)号：EP2596691A2
公开(公告)日：2013-05-29
申请号：EP11809828.4
申请日：2011-07-15
Applicant: LG Innotek Co., Ltd.
Inventor： AN, Yun Ho , KIM, Eun Jin , LEE, Hyuk Soo , PARK, Jae Man , CHO, In Hee , PARK, Hyun Gyu , KIM, Hae Yeon
CPC classification number: H05K1/181 , H01L23/3677 , H01L2224/48227 , H05K1/0204 , H05K1/03 , H05K1/09 , H05K3/0061 , H05K2201/10106 , H05K2203/0369
Abstract: Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.
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