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    16.
    发明专利
    未知

    公开(公告)号：AT501805T

    公开(公告)日：2011-04-15

    申请号：AT07008559

    申请日：2007-04-26

    Applicant: LINDE AG

    Inventor： MAESTELE JOHANN ,  WANDKE ERNST

    IPC: B23K3/06 ,  B23K1/08

    Abstract: The instant invention relates to a device for wave soldering workpieces, encompassing means for moving the workpiece, which is to be soldered, along a specific path across at least one solder wave generated above a solder reservoir, with a protective and/or active gas atmosphere of a first composition being located above the solder reservoir so as to exclude oxygen and with means for introducing the protective and/or active gas as well as an enclosure being provided, with the enclosure being configured in such a manner that it encloses at least the essential parts of a solder zone.

    18.
    发明专利
    未知

    公开(公告)号：AT499173T

    公开(公告)日：2011-03-15

    申请号：AT08000685

    申请日：2008-01-15

    Applicant: LINDE AG

    Inventor： HIEW PANG LING ,  LAUMEN CHRISTOPH ,  TAN BOON ANN ,  WANDKE ERNST

    IPC: B23K20/00 ,  H01L21/00 ,  H01L21/60 ,  H01L21/603 ,  H01L21/607

    Abstract: The device for wire bonding with a copper containing contact wire (2) for connecting a component (9) with a carrier (7), comprises a guide for the contact wire, an arrangement (3) for melting a part of the contact wire for connecting with bond pads (4), a first plasma nozzle by which the part of the contact wire, the bond pad and/or the bond area is subjected with plasma for connecting with the bond pad, and a second plasma nozzle arranged vertically on the bond pad. The guide is formed so that the melted part of the contact wire is subjected in a bonding area with each of the bond pad. The device for wire bonding with a copper containing contact wire (2) for connecting a component (9) with a carrier (7), comprises a guide for the contact wire, an arrangement (3) for melting a part of the contact wire for connecting with a bond pad (4), a first plasma nozzle by which the part of the contact wire, the bond pad and/or the bond area is subjected with plasma for connecting with the bond pad, and a second plasma nozzle arranged vertically on the bond pad. The guide is formed so that the melted part of the contact wire is subjected in a bonding area with each of the bond pad. The bond pad is arranged both at the component and at the carrier. The plasma nozzle is adjustable in its bias so that a plasma beam exiting from the nozzle reaches to an adjustable area as target. The plasma nozzle is mounted in the area, in which the contact wire leaves the guide. An independent claim is included for a method for wire bonding with copper containing contact wire for connecting a component with carrier.

    PROCEDIMIENTO Y DISPOSITIVO PARA ENFRIAR RAPIDAMENTE PIEZAS DE TRABAJO.
    20.
    发明专利
    PROCEDIMIENTO Y DISPOSITIVO PARA ENFRIAR RAPIDAMENTE PIEZAS DE TRABAJO. 未知

    公开(公告)号：ES2332811T3

    公开(公告)日：2010-02-12

    申请号：ES06015701

    申请日：2006-07-27

    Applicant: LINDE AG

    Inventor： ASTROM ANDERS ,  WANDKE ERNST

    IPC: C21D1/613 ,  C21D1/667 ,  C21D9/08 ,  F25B9/00 ,  F25B19/00 ,  F25D3/10 ,  F25D3/12

    Abstract: Procedimiento para enfriar una pieza de trabajo (1), en el que se introduce la pieza de trabajo (1) en una zona de refrigeración (10) que limita con una caja fría (3), y en el que se alimenta un medio refrigerante a la caja fría (3), comprendiendo el medio refrigerante un gas licuado o una mezcla de gases licuados, cuyo calor de evaporación se emplea para refrigerar la caja fría (3) y para refrigerar la superficie de la pieza de trabajo (1), caracterizado porque el medio refrigerante sale de la caja fría (3) por una o varias boquillas (5) y es conducido a la zona de refrigeración (10) a través de dicha boquilla o boquillas (5).

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