公开(公告)号：DE502007006711D1

公开(公告)日：2011-04-28

申请号：DE502007006711

申请日：2007-04-26

Applicant: LINDE AG

Inventor： MAESTELE JOHANN ,  WANDKE ERNST DR

IPC: B23K3/06 ,  B23K1/08

公开(公告)号：DE102006024192A1

公开(公告)日：2007-11-29

申请号：DE102006024192

申请日：2006-05-23

Applicant: LINDE AG

Inventor： WANDKE ERNST ,  MAESTELE JOHANN

IPC: B23K1/08

Abstract: Device for wave soldering a workpiece (2) comprises a soldering zone (15), further zones (5, 6) for holding a workpiece before or after solder treatment for a short time, a housing (3) surrounding the further zones and a unit (4) for feeding a protective and/or active gas atmosphere into the housing. An independent claim is also included for a method for wave soldering a workpiece using the above device.

公开(公告)号：AT501805T

公开(公告)日：2011-04-15

申请号：AT07008559

申请日：2007-04-26

Applicant: LINDE AG

Inventor： MAESTELE JOHANN ,  WANDKE ERNST

IPC: B23K3/06 ,  B23K1/08

Abstract: The instant invention relates to a device for wave soldering workpieces, encompassing means for moving the workpiece, which is to be soldered, along a specific path across at least one solder wave generated above a solder reservoir, with a protective and/or active gas atmosphere of a first composition being located above the solder reservoir so as to exclude oxygen and with means for introducing the protective and/or active gas as well as an enclosure being provided, with the enclosure being configured in such a manner that it encloses at least the essential parts of a solder zone.