公开(公告)号：DE69027530T2

公开(公告)日：1996-11-28

申请号：DE69027530

申请日：1990-07-26

Applicant: MACDERMID INC

Inventor： LETIZE RAYMOND A ,  THOMAS WILLIAM R ,  SULLIVAN DAVID D ,  MURRY THOMAS D

IPC: C23F1/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/26 ,  H05K3/22

Abstract: After the etching away of copper to selectively expose surface areas of insulating material in a printed circuit process based upon copper foil-clad insulating substrate material, the exposed surface areas of insulating material are contacted with an aqueous alkaline permanganate solution to remove from the areas residual metal species associated therewith so as to improve the electrical resistance afforded by those areas in the printed circuit.

公开(公告)号：CA2022400C

公开(公告)日：1993-10-05

申请号：CA2022400

申请日：1990-07-31

Applicant: MACDERMID INC

Inventor： LETIZE RAYMOND A ,  SULLIVAN DAVID D ,  THOMAS WILLIAM R ,  MURRY THOMAS D

IPC: C23F1/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/26 ,  C23F4/00

Abstract: After the etching away of copper to selectively expose surface areas of insulating material in a printed circuit process based upon copper foil-clad insulating substrate material, the exposed surface areas of insulating material are contacted with an aqueous alkaline permanganate solution to remove from the areas residual metal species associated therewith so as to improve the electrical resistance afforded by those areas in the printed circuit.

公开(公告)号：AU7586887A

公开(公告)日：1988-01-12

申请号：AU7586887

申请日：1987-06-17

Applicant: MACDERMID INC

Inventor： LARSON GARY B ,  LETIZE RAYMOND A ,  WILLIAMS ANN S

IPC: H05K3/28 ,  H05K3/06 ,  H05K3/10 ,  H05K3/24 ,  H05K3/34 ,  H05K3/38 ,  H05K3/42 ,  H01L21/306

Abstract: A method of preparing printed circuit boards is described in which the solder mask is applied over a thin layer of copper oxide covering the copper circuit traces, the copper oxide layer being that which remains after stripping the tin or tin-lead allow etch resist.

公开(公告)号：DE69027530D1

公开(公告)日：1996-07-25

申请号：DE69027530

申请日：1990-07-26

Applicant: MACDERMID INC

Inventor： LETIZE RAYMOND A ,  THOMAS WILLIAM R ,  SULLIVAN DAVID D ,  MURRY THOMAS D

IPC: C23F1/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/26 ,  H05K3/22

Abstract: After the etching away of copper to selectively expose surface areas of insulating material in a printed circuit process based upon copper foil-clad insulating substrate material, the exposed surface areas of insulating material are contacted with an aqueous alkaline permanganate solution to remove from the areas residual metal species associated therewith so as to improve the electrical resistance afforded by those areas in the printed circuit.

公开(公告)号：CA2022400A1

公开(公告)日：1991-09-21

申请号：CA2022400

申请日：1990-07-31

Applicant: MACDERMID INC

Inventor： LETIZE RAYMOND A ,  SULLIVAN DAVID D ,  THOMAS WILLIAM R ,  MURRY THOMAS D

IPC: C23F1/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/26 ,  C23F4/00

Abstract: After the etching away of copper to selectively expose surface areas of insulating material in a printed circuit process based upon copper foil-clad insulating substrate material, the exposed surface areas of insulating material are contacted with an aqueous alkaline permanganate solution to remove from the areas residual metal species associated therewith so as to improve the electrical resistance afforded by those areas in the printed circuit.

公开(公告)号：CA2007608A1

公开(公告)日：1990-10-07

申请号：CA2007608

申请日：1990-01-11

Applicant: MACDERMID INC

Inventor： CORDANI JOHN L ,  LANE KARL ,  BIRAN ZVI ,  LETIZE RAYMOND A

IPC: C09K13/04 ,  C09K13/06 ,  C23F1/30 ,  C23F1/44 ,  H05K3/06 ,  C23G1/18 ,  C07C309/04 ,  C01B21/50

Abstract: A composition for stripping tin or solder, as well as any underlying copper-tin alloy, from copper surfaces, containing an alkane sulfonic acid, preferably methane sulfonic acid, and an inorganic nitrate, preferably ferric nitrate. The composition effects stripping without any appreciable formation of sludge or precipitate or suspended particles.

公开(公告)号：DE2548914A1

公开(公告)日：1976-08-26

申请号：DE2548914

申请日：1975-10-31

Applicant: MACDERMID INC

Inventor： LARSON GARY B ,  LETIZE RAYMOND A

IPC: C23C18/40 ,  C23C3/02

公开(公告)号：EP0349600A4

公开(公告)日：1990-04-10

申请号：EP88906802

申请日：1988-07-20

Applicant: MACDERMID INC

Inventor： CORDANI JOHN L ,  LETIZE RAYMOND A

IPC: B23D71/00 ,  C23F1/34 ,  H05K3/06

CPC classification number: C23F1/34

公开(公告)号：EP1487646A4

公开(公告)日：2010-01-13

申请号：EP03713509

申请日：2003-02-18

Applicant: MACDERMID INC

Inventor： KOLOGE DONNA M ,  LETIZE RAYMOND A ,  LARSON BRIAN

IPC: C23F1/00 ,  C23F1/40 ,  C23F1/44 ,  H05K3/06 ,  H05K3/20 ,  H05K3/26 ,  B44C1/22

CPC classification number: C23F1/40 ,  C23F1/44 ,  H05K3/067 ,  H05K2203/0361 ,  H05K2203/0796