公开(公告)号：JPH10190183A

公开(公告)日：1998-07-21

申请号：JP34237397

申请日：1997-12-12

Applicant: MACDERMID INC ,  HADCO CORP

Inventor： BENGSTON JON ,  LARSON GARY B ,  KOLOGE DONNA ,  SCHWEIKHER WILLIAM ,  DEREGO TODD ,  RAABERG BRUCE S ,  SORENSON BRUCE

IPC: H01C17/18 ,  H05K1/16 ,  H05K3/18

Abstract: PROBLEM TO BE SOLVED: To make a resistor to be printed and plated as the integrated part of the circuit of a printed circuit board by plating a resistive material to an insulating substrate existing between conductive areas so that the resistive material may connect the conductive areas to each other. SOLUTION: After exposed copper is etched off and an etch resist is removed, the exposed surface is activated and a mask for plating which substantially covers the entire exposed surface except an area where a resistor 16 is to be plated is applied to the surface. Then the exposed surface is plated with a resistive material and the mask for plating is removed. After the mask is removed, the surface of a bare dielectric substrate 10 is activated so that the surface may accept plating. Then a mask for plating is applied to the substrate 10 so that a desired circuit may be demarcated in a negative state and the area between the circuit and a position related to the resistor 16 may be demarcated in a positive state. Thereafter, the desired circuit is plated and a resist 15 is removed.

公开(公告)号：JPH10135608A

公开(公告)日：1998-05-22

申请号：JP28324097

申请日：1997-10-16

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  LARSON GARY B ,  BENGSTON JON ,  SCHWEIKHER WILLIAM

IPC: C23C18/18 ,  H01C17/065 ,  H01C17/18 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To form a printed circuit board provided with a plated resistor which is unified in a body with a circuit, by eliminating exposed copper by etching, plating an exposed region by using a mask for plating, and eliminating the mask for plating by stripping. SOLUTION: The surface of a copper-coated laminate having an insulating dielectric substratum 10 and a stuck copper foil 11 is eliminated by etching. By stripping resist 12, the surface of an arbitrarily exposed dielectric material surface is made uniform. Thereon a mask for plating is so applied that resist 15 for plating covers the whole surface except the region where a resistor 16 is to be plated. By stripping the mask for plating, the surface of a printed circuit board is arbitrarily cleaned, and a plated resistor 16 is covered with a protective film. Thereby the printed circuit board provided with a plated resistor 16 unified in a body with a circuit can be formed.

公开(公告)号：US3647568A

公开(公告)日：1972-03-07

申请号：US3647568D

申请日：1969-10-28

Applicant: MACDERMID INC

Inventor： LARSON GARY B

IPC: C23C22/73 ,  C23F7/10

CPC classification number: C23C22/73

Abstract: PHOSPHATE COMPOSITIONS CONTAINING AT LEAST ONE COPPER SALT ARE UTLILIZED FOR COATING SURFACES OF FERROUS METALS. THE PHOSPHATE COATINGS ACHIEVED, WHICH POSSESS A REDDISH COLOR, SERVER AS AN EXCELLENT MEANS OF IDENTIFICATION OF THE ARTICLES THIS COATED AND, IN ADDITION, THE FINISH IS OF GOOD CORROSION RESISTANCE.

公开(公告)号：WO9416120A3

公开(公告)日：1994-09-01

申请号：PCT/US9311013

申请日：1993-11-15

Applicant: MACDERMID INC ,  PPG INDUSTRIES INC ,  LARSON GARY B ,  JOBSON BRIAN ,  JOHNSON JAMES A ,  STURNI LANCE C

Inventor： LARSON GARY B ,  JOBSON BRIAN ,  JOHNSON JAMES A ,  STURNI LANCE C

IPC: G03F7/09 ,  C23C22/07 ,  C23C22/08 ,  C23C22/42 ,  G03F7/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38 ,  C23L ,  C23F ,  H05K ,  C23C

CPC classification number: H05K3/0079 ,  C23C22/08 ,  C23C22/42 ,  G03F7/11 ,  H05K3/383 ,  H05K3/385 ,  H05K2203/135

Abstract: Composition and methods for providing a phosphate conversion coating on a metal surface, particularly a copper surface, characterized in that the phosphating composition includes at least one composition-soluble compound containing vanadium, niobium, tungsten or tantalum. The phosphate conversion coatings so produced are thicker, more durable and more uniform than those produced by known phosphating compositions. The compositions and processes are especially useful for providing a passivating/uniformizing coating layer on copper surfaces to which organic resin is thereafter deposited to serve as a resist in printed circuit fabrication sequences, particularly when the organic resin is an electrophoretically deposited organic resin. Also described is the microetching of copper surfaces with a phosphoric acid/peroxide microetchant preparatory to deposit thereon (or after a further provision of a phosphate conversion coating) of a photoresist which is then imagewise exposed and developed to provide a patterned resist.

公开(公告)号：WO2009002385A3

公开(公告)日：2010-01-21

申请号：PCT/US2008006692

申请日：2008-05-27

Applicant: MACDERMID INC ,  NIKOLOVA MARIA ,  LARSON GARY B

Inventor： NIKOLOVA MARIA ,  LARSON GARY B

IPC: C25D21/18

CPC classification number: C25D3/38 ,  H05K3/423

Abstract: An aqueous acidic copper electroplating composition containing an improved additive system for use at elevated temperatures. The improved additive system comprises (a) a suppressor comprising at least one high molecular weight polymer; (b) a brightener comprising at least one divalent sulfur compound; and (c) a leveler comprising a heterocyclic nitrogen compound. The improved electroplating composition is usable for plating through holes in printed circuit boards.

Abstract translation: 含有改进的在高温下使用的添加剂体系的酸性酸性电镀组合物。 改进的添加剂体系包括（a）包含至少一种高分子量聚合物的抑制剂; （b）包含至少一种二价硫化合物的增白剂; 和（c）包含杂环氮化合物的矫正剂。 改进的电镀组合物可用于通过印刷电路板中的孔进行电镀。

公开(公告)号：WO2007111671A8

公开(公告)日：2007-11-22

申请号：PCT/US2006049016

申请日：2006-12-21

Applicant: MACDERMID INC

Inventor： WOJTASZEK MARK ,  WATKOWSKI JAMES ,  LARSON GARY B ,  KUKANSKIS PETER

IPC: C25D5/10 ,  H05H1/00

CPC classification number: H05K3/181 ,  C08J7/12 ,  C08J7/123 ,  C08J2379/08 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/2006 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/32 ,  H05K1/0346 ,  H05K3/381 ,  H05K2201/0344 ,  H05K2203/0793 ,  H05K2203/095 ,  H05K2203/097

Abstract: The present invention is directed to an improved method for metallizing polymer substrates, such as polyimides. The present invention comprises the steps of surface treating the polymer substrate with a plasma jet or corona discharge surface treatment, conditioning and etching the polymer substrate with an etching solution comprising a hydroxide and ionic palladium, activating the polymer substrate with ionic palladium, reducing the palladium on the polymer substrate, plating an electroless nickel layer onto the prepared polymer substrate, arid plating an electroless copper layer over the electroless nickel layer. The process of the invention provides an improved method for preparing the polymer substrate for subsequent electrolytic plating thereon.

Abstract translation: 本发明涉及用于金属化聚合物基材例如聚酰亚胺的改进方法。 本发明包括以下步骤：用等离子体喷射或电晕放电表面处理对聚合物基材进行表面处理，用包含氢氧化物和离子钯的蚀刻溶液调节和蚀刻聚合物基材，用离子钯活化聚合物底物，还原钯 在聚合物基材上，将无电镍层电镀到制备的聚合物基材上，并在无电镍层上镀覆无电解铜层。 本发明的方法提供了一种改进的制备聚合物基质的方法，用于其后的电解电镀。

公开(公告)号：CA2405830A1

公开(公告)日：2002-01-03

申请号：CA2405830

申请日：2001-03-07

Applicant: MACDERMID INC

Inventor： SCHWEIKHER WILLIAM ,  BENGSTON JON ,  LARSON GARY B ,  KUKANSKIS PETER

IPC: C23C18/18 ,  H01C17/065 ,  H01C17/18 ,  H01L23/12 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18 ,  H05K3/24 ,  H05K3/26 ,  H05K3/38 ,  H01L23/48 ,  H01L21/20 ,  H01L21/302 ,  H01L21/31 ,  H01L29/40 ,  H01L21/44 ,  H01L21/461 ,  H01L21/469 ,  H01L23/52

Abstract: A process and product manufactured by the process is revealed whereby resistors (16) can be manufactured integral a printed circuit board (10, 13) by plating the resistors onto an insulative substrate (10). Uniformization o f the insulative substrate by etching and oxidation of the plated resistor are revealed as techniques for improving the uniformity and consistency of the plated resistors.

公开(公告)号：ES2150480T3

公开(公告)日：2000-12-01

申请号：ES94902244

申请日：1993-11-15

Applicant: MACDERMID INC ,  PPG INDUSTRIES INC

Inventor： LARSON GARY B ,  JOBSON BRIAN ,  JOHNSON JAMES A ,  STURNI LANCE C

IPC: C23C22/07 ,  C23C22/08 ,  C23C22/42 ,  G03F7/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38 ,  G03F7/09 ,  C23F1/18

Abstract: Composition and methods for providing a phosphate conversion coating on a metal surface, particularly a copper surface, characterized in that the phosphating composition includes at least one composition-soluble compound containing vanadium, niobium, tungsten or tantalum. The phosphate conversion coatings so produced are thicker, more durable and more uniform than those produced by known phosphating compositions. The compositions and processes are especially useful for providing a passivating/uniformizing coating layer on copper surfaces to which organic resin is thereafter deposited to serve as a resist in printed circuit fabrication sequences, particularly when the organic resin is an electrophoretically deposited organic resin. Also described is the microetching of copper surfaces with a phosphoric acid/peroxide microetchant preparatory to deposit thereon (or after a further provision of a phosphate conversion coating) of a photoresist which is then imagewise exposed and developed to provide a patterned resist.

公开(公告)号：SK88295A3

公开(公告)日：1996-03-06

申请号：SK88295

申请日：1993-11-15

Applicant: MACDERMID INC ,  PPG INDUSTRIES INC

Inventor： LARSON GARY B ,  JOBSON BRIAN ,  JOHNSON JAMES A ,  STURNI LANCE C

IPC: C23C22/07 ,  C23C22/08 ,  C23C22/42 ,  G03F7/09 ,  G03F7/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38 ,  C23F1/18

Abstract: Composition and methods for providing a phosphate conversion coating on a metal surface, particularly a copper surface, characterized in that the phosphating composition includes at least one composition-soluble compound containing vanadium, niobium, tungsten or tantalum. The phosphate conversion coatings so produced are thicker, more durable and more uniform than those produced by known phosphating compositions. The compositions and processes are especially useful for providing a passivating/uniformizing coating layer on copper surfaces to which organic resin is thereafter deposited to serve as a resist in printed circuit fabrication sequences, particularly when the organic resin is an electrophoretically deposited organic resin. Also described is the microetching of copper surfaces with a phosphoric acid/peroxide microetchant preparatory to deposit thereon (or after a further provision of a phosphate conversion coating) of a photoresist which is then imagewise exposed and developed to provide a patterned resist.

公开(公告)号：FI953377A

公开(公告)日：1995-07-10

申请号：FI953377

申请日：1995-07-10

Applicant: MACDERMID INC ,  PPG INDUSTRIES INC

Inventor： LARSON GARY B ,  JOBSON BRIAN ,  JOHNSON JAMES A ,  STURNI LANCE C

IPC: C23C22/07 ,  G03F7/09 ,  C23C22/08 ,  C23C22/42 ,  G03F7/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38 ,  C23C

Abstract: Composition and methods for providing a phosphate conversion coating on a metal surface, particularly a copper surface, characterized in that the phosphating composition includes at least one composition-soluble compound containing vanadium, niobium, tungsten or tantalum. The phosphate conversion coatings so produced are thicker, more durable and more uniform than those produced by known phosphating compositions. The compositions and processes are especially useful for providing a passivating/uniformizing coating layer on copper surfaces to which organic resin is thereafter deposited to serve as a resist in printed circuit fabrication sequences, particularly when the organic resin is an electrophoretically deposited organic resin. Also described is the microetching of copper surfaces with a phosphoric acid/peroxide microetchant preparatory to deposit thereon (or after a further provision of a phosphate conversion coating) of a photoresist which is then imagewise exposed and developed to provide a patterned resist.