SYSTEMS AND METHODS FOR MONOLITHICALLY ISLED SOLAR PHOTOVOLTAIC CELLS AND MODULES
    12.
    发明申请
    SYSTEMS AND METHODS FOR MONOLITHICALLY ISLED SOLAR PHOTOVOLTAIC CELLS AND MODULES 审中-公开
    全单元太阳光伏电池和模块的系统和方法

    公开(公告)号:WO2014071417A3

    公开(公告)日:2014-11-06

    申请号:PCT/US2013068599

    申请日:2013-11-05

    Abstract: According to one aspect of the disclosed subject matter, a monolithically isled solar cell is provided. The solar cell comprises a semiconductor layer having a light receiving frontside and a backside opposite the frontside and attached to an electrically insulating backplane. A trench isolation pattern partitions the semiconductor layer into electrically isolated isles on the electrically insulating backplane. A first metal layer having base and emitter electrodes is positioned on the semiconductor layer backside. A patterned second metal layer providing cell interconnection and connected to the first metal layer by via plugs is positioned on the backplane.

    Abstract translation: 根据所公开的主题的一个方面,提供了一种单片式太阳能电池。 该太阳能电池包括具有光接收正面的半导体层和与正面相对并且附接到电绝缘背板的背面。 沟槽隔离图案将半导体层分隔成电绝缘背板上的电隔离岛。 具有基极和发射极电极的第一金属层位于半导体层背面上。 提供电池互连且通过通孔插塞连接到第一金属层的图案化的第二金属层位于背板上。

    LASER PROCESSING FOR HIGH-EFFICIENCY THIN CRYSTALLINE SILICON SOLAR CELL FABRICATION
    14.
    发明申请
    LASER PROCESSING FOR HIGH-EFFICIENCY THIN CRYSTALLINE SILICON SOLAR CELL FABRICATION 审中-公开
    激光加工用于高效晶体硅太阳能电池制造

    公开(公告)号:WO2011150397A3

    公开(公告)日:2012-04-05

    申请号:PCT/US2011038444

    申请日:2011-05-27

    Abstract: Laser processing schemes are disclosed for producing various types of hetero-junction and homo-junction solar cells. The methods include base and emitter contact opening, selective doping, and metal ablation. Also, laser processing schemes are disclosed that are suitable for selective amorphous silicon ablation and selective doping for hetero-junction solar cells. These laser processing techniques may be applied to semiconductor substrates, including crystalline silicon substrates, and further including crystalline silicon substrates which are manufactured either through wire saw wafering methods or via epitaxial deposition processes, that are either planar or textured/three-dimensional. These techniques are highly suited to thin crystalline semiconductor, including thin crystalline silicon films.

    Abstract translation: 公开了用于生产各种类型的异质结和同质结太阳能电池的激光加工方案。 这些方法包括基极和发射极接触开口,选择性掺杂和金属烧蚀。 此外,公开了适用于异质结太阳能电池的选择性非晶硅消融和选择性掺杂的激光加工方案。 这些激光处理技术可以应用于包括晶体硅衬底的半导体衬底,并且还包括通过线锯晶片化方法或通过外延沉积工艺制造的晶体硅衬底,其是平面的或纹理的/三维的。 这些技术非常适合于薄晶体半导体,包括薄晶体硅薄膜。

    METHODS FOR LIQUID TRANSFER COATING OF THREE-DIMENSIONAL SUBSTRATES
    16.
    发明申请
    METHODS FOR LIQUID TRANSFER COATING OF THREE-DIMENSIONAL SUBSTRATES 审中-公开
    三维基底液体转移涂层的方法

    公开(公告)号:WO2009026240A1

    公开(公告)日:2009-02-26

    申请号:PCT/US2008073499

    申请日:2008-08-18

    Abstract: Methods here disclosed provide for selectively coating the top surfaces or ridges of a 3-D substrate while avoiding liquid coating material wicking into micro cavities on 3-D substrates. The substrate includes holes formed in a three-dimensional substrate by forming a sacrificial layer on a template. The template includes a template substrate with posts and trenches between the posts. The steps include subsequently depositing a semiconductor layer and selectively etching the sacrificial layer. Then, the steps include releasing the semiconductor layer from the template and coating the 3-D substrate using a liquid transfer coating step for applying a liquid coating material to a surface of the 3-D substrate. The method may further include coating the 3-D substrate by selectively coating the top ridges or surfaces of the substrate. Additional features may include filling the micro cavities of the substrate with a filling material, removing the filling material to expose only the substrate surfaces to be coated, coating the substrate with a layer of liquid coating material, and removing said filling material from the micro cavities of the substrate.

    Abstract translation: 本文公开的方法提供了选择性涂覆3-D衬底的顶表面或脊,同时避免液体涂层材料芯吸到3-D衬底上的微空腔中。 衬底包括通过在模板上形成牺牲层而形成在三维衬底中的孔。 该模板包括一个模板衬底,在柱子之间有柱子和沟槽。 该步骤包括随后沉积半导体层并选择性地蚀刻牺牲层。 然后,这些步骤包括从模板释放半导体层并且使用液体转移涂覆步骤涂覆3D基板,以将液体涂覆材料涂覆到3D基板的表面。 该方法可以进一步包括通过选择性地涂覆衬底的顶脊或表面来涂覆3D衬底。 另外的特征可以包括用填充材料填充基板的微腔,除去填充材料以仅暴露待涂覆的基板表面,用液体涂层材料涂覆基板,并且从微腔除去所述填充材料 的底物。

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