公开(公告)号：WO2007002956A1

公开(公告)日：2007-01-04

申请号：PCT/US2006/026217

申请日：2006-06-28

Applicant: INTEL CORPORATION ,  WORWAG, Wojciech ,  MUTHUKUMAR, Sriram

Inventor： WORWAG, Wojciech ,  MUTHUKUMAR, Sriram

IPC: C25D15/02 ,  C25D7/12 ,  H01L21/768 ,  H05K3/42

CPC classification number: H01L21/76877 ,  C25D7/12 ,  C25D15/02 ,  H01L21/288 ,  H01L21/2885 ,  H01L23/53209 ,  H01L2924/0002 ,  H05K3/423 ,  H01L2924/00

Abstract: A method for forming a composite metal layer on a substrate comprises providing nanocrystalline particles of a first metal, adding the nanocrystalline particles to a plating bath that contains ions of a second metal to form a colloid-like suspension, immersing the substrate in the plating bath, and causing a co-deposition of the second metal and the nanocrystalline particles of the first metal on the substrate to form the composite metal layer. The co-deposition may be caused by inducing a negative bias on the substrate and applying an electric current to the plating bath to induce an electroplating process. In the electroplating process, the ions of the second metal are reduced by the substrate and become co-deposited on the substrate with the nanocrystalline particles of the first metal to form the composite metal layer.

Abstract translation: 在基板上形成复合金属层的方法包括提供第一金属的纳米晶体颗粒，将纳米晶体颗粒添加到含有第二金属离子的镀液中以形成胶体样悬浮液，将基板浸入镀浴 并且使第一金属的第二金属和纳米晶体颗粒在基底上共沉淀形成复合金属层。 可以通过在衬底上引起负偏压并将电流施加到电镀槽以引起电镀工艺来引起共沉积。 在电镀工艺中，第二金属的离子被衬底还原，并与第一金属的纳米晶体颗粒共同沉积在衬底上以形成复合金属层。

公开(公告)号：WO2012135395A3

公开(公告)日：2013-02-07

申请号：PCT/US2012031043

申请日：2012-03-28

Applicant: SOLEXEL INC ,  MOSLEHI MEHRDAD M ,  KRAMER KARL-JOSEF ,  SEUTTER SEAN ,  KAPUR PAWAN ,  STALCUP THOM ,  WANG DAVID XUAN-QI ,  KAMIAN GEORGE D ,  MANTEGHI KAMRAN ,  SU YEN-SHENG ,  ANBALAGAN PRANAV ,  RANA VIRENDRA V ,  CALCATERRA ANTHONY ,  OLSEN GERRY ,  WORWAG WOJCIECH

Inventor： MOSLEHI MEHRDAD M ,  KRAMER KARL-JOSEF ,  SEUTTER SEAN ,  KAPUR PAWAN ,  STALCUP THOM ,  WANG DAVID XUAN-QI ,  KAMIAN GEORGE D ,  MANTEGHI KAMRAN ,  SU YEN-SHENG ,  ANBALAGAN PRANAV ,  RANA VIRENDRA V ,  CALCATERRA ANTHONY ,  OLSEN GERRY ,  WORWAG WOJCIECH

IPC: H01L31/042 ,  H01L31/0216 ,  H01L31/18

CPC classification number: H01L31/022441 ,  H01L31/0516 ,  H01L31/0682 ,  H01L31/1892 ,  Y02E10/547

Abstract: Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects are described. The method comprises depositing an interdigitated pattern of base electrodes and emitter electrodes on a backside surface of a semiconductor substrate, attaching a prepeg backplane to the interdigitated pattern of base electrodes and emitter electrodes, forming holes in the prepeg backplane which provide access to the first layer of electrically conductive metal, and depositing a second layer of electrically conductive metal on the backside surface of the prepeg backplane forming an electrical interconnect with the first layer of electrically conductive metal through the holes in the prepeg backplane.

Abstract translation: 描述了提供太阳能电池基板加强和电互连的背接触太阳能电池背板的制造方法和结构。 该方法包括在半导体衬底的背面上沉积基底电极和发射电极的交错图形，将预制电路背板连接到基极和发射电极的交错图案，在预制电路背板上形成提供对第一层 的导电金属，并且在所述预制底板的背面上沉积第二导电金属层，通过所述预制底板中的所述孔与所述第一导电金属层形成电互连。

公开(公告)号：WO2012135395A2

公开(公告)日：2012-10-04

申请号：PCT/US2012/031043

申请日：2012-03-28

Applicant: SOLEXEL, INC. ,  MOSLEHI, Mehrdad, M. ,  KRAMER, Karl-josef ,  SEUTTER, Sean ,  KAPUR, Pawan ,  STALCUP, Thom ,  WANG, David, Xuan-qi ,  KAMIAN, George, D. ,  MANTEGHI, Kamran ,  SU, Yen-sheng ,  ANBALAGAN, Pranav ,  RANA, Virendra, V ,  CALCATERRA, Anthony ,  OLSEN, Gerry ,  WORWAG, Wojciech

Inventor： MOSLEHI, Mehrdad, M. ,  KRAMER, Karl-josef ,  SEUTTER, Sean ,  KAPUR, Pawan ,  STALCUP, Thom ,  WANG, David, Xuan-qi ,  KAMIAN, George, D. ,  MANTEGHI, Kamran ,  SU, Yen-sheng ,  ANBALAGAN, Pranav ,  RANA, Virendra, V ,  CALCATERRA, Anthony ,  OLSEN, Gerry ,  WORWAG, Wojciech

IPC: H01L31/042 ,  H01L31/0216 ,  H01L31/18

CPC classification number: H01L31/022441 ,  H01L31/0516 ,  H01L31/0682 ,  H01L31/1892 ,  Y02E10/547

Abstract: Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects are described. The method comprises depositing an interdigitated pattern of base electrodes and emitter electrodes on a backside surface of a semiconductor substrate, attaching a prepeg backplane to the interdigitated pattern of base electrodes and emitter electrodes, forming holes in the prepeg backplane which provide access to the first layer of electrically conductive metal, and depositing a second layer of electrically conductive metal on the backside surface of the prepeg backplane forming an electrical interconnect with the first layer of electrically conductive metal through the holes in the prepeg backplane.

Abstract translation: 描述了提供太阳能电池基板加强和电互连的背接触太阳能电池背板的制造方法和结构。 该方法包括在半导体衬底的背面上沉积基底电极和发射电极的交错图形，将预制电路背板连接到基极和发射电极的交错图案，在预制电路背板上形成提供对第一层 的导电金属，并且在所述预制底板的背面上沉积第二导电金属层，通过所述预制底板中的所述孔与所述第一导电金属层形成电互连。