公开(公告)号：US20150260519A1

公开(公告)日：2015-09-17

申请号：US14622548

申请日：2015-02-13

Applicant: Motion Engine Inc.

Inventor： Robert Mark Boysel ,  Louis Ross

IPC: G01C19/5712 ,  G01C25/00

CPC classification number: G01C19/5712 ,  G01C19/5755 ,  G01C19/5769

Abstract: A MEMS motion sensor and its manufacturing method are provided. The sensor includes a MEMS wafer including a proof mass and flexible springs suspending the proof mass and enabling the proof mass to move relative to an outer frame along mutually orthogonal x, y and z axes. The sensor includes top and bottom cap wafers including top and bottom cap electrodes forming capacitors with the proof mass, the electrodes being configured to detect a motion of the proof mass. Electrical contacts are provided on the top cap wafer, some of which are connected to the respective top cap electrodes, while others are connected to the respective bottom cap electrodes by way of insulated conducting pathways, extending along the z axis from one of the respective bottom cap electrodes and upward successively through the bottom cap wafer, the outer frame of the MEMS wafer and the top cap wafer.

Abstract translation: 提供了MEMS运动传感器及其制造方法。 该传感器包括一个MEMS晶片，其中包括一个检测质量块和一个弹性弹簧，悬挂该质量块，并使检测质量块可以沿相互正交的x，y和z轴相对于外框架移动。 传感器包括顶盖和底盖晶片，其包括顶盖电极和底盖电极，形成具有检测质量的电容器，电极被配置为检测检测质量块的运动。 电触头设置在顶盖晶片上，其中一些连接到相应的顶盖电极，而另一些则通过绝缘导电路径连接到相应的底盖电极，绝缘导电路径沿着z轴从相应的底部电极之一延伸 帽电极并且依次通过底盖晶片，MEMS晶片的外框架和顶盖晶片。

公开(公告)号：US20240210174A1

公开(公告)日：2024-06-27

申请号：US18393460

申请日：2023-12-21

Applicant: Motion Engine Inc.

Inventor： Robert Mark Boysel ,  Louis Ross

IPC: G01C19/5712 ,  G01C19/5755 ,  G01C19/5769 ,  G01C25/00

CPC classification number: G01C19/5712 ,  G01C19/5755 ,  G01C19/5769 ,  G01C25/00

Abstract: A MEMS motion sensor and its manufacturing method are provided. The sensor includes a MEMS wafer including a proof mass and flexible springs suspending the proof mass and enabling the proof mass to move relative to an outer frame along mutually orthogonal x, y and z axes. The sensor includes top and bottom cap wafers including top and bottom cap electrodes forming capacitors with the proof mass, the electrodes being configured to detect a motion of the proof mass. Electrical contacts are provided on the top cap wafer, some of which are connected to the respective top cap electrodes, while others are connected to the respective bottom cap electrodes by way of insulated conducting pathways, extending along the z axis from one of the respective bottom cap electrodes and upward successively through the bottom cap wafer, the outer frame of the MEMS wafer and the top cap wafer.

公开(公告)号：US20170108336A1

公开(公告)日：2017-04-20

申请号：US15315894

申请日：2015-01-12

Applicant: Motion Engine Inc.

Inventor： Robert Mark Boysel ,  Louis Ross

IPC: G01C19/5712 ,  G01P15/18 ,  G01C19/5733

CPC classification number: G01C19/5712 ,  G01C19/5719 ,  G01C19/5733 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/084

Abstract: A micro-electro-mechanical system (MEMS) motion sensor is provided that includes a MEMS wafer having a frame structure, a plurality of proof masses suspended to the frame structure, movable in three dimensions, and enclosed in one or more cavities. The MEMS sensor includes top and bottom cap wafers bonded to the MEMS wafer and top and bottom electrodes provided in the top and bottom cap wafers, forming capacitors with the plurality of proof masses, and being together configured to detect motions of the plurality of proof masses. The MEMS sensor further includes first electrical contacts provided on the top cap wafer and electrically connected to the top electrodes, and a second electrical contacts provided on the top cap wafer and electrically connected to the bottom electrodes by way of vertically extending insulated conducting pathways. A method for measuring acceleration and angular rate along three mutually orthogonal axes is also provided.

公开(公告)号：US20150191345A1

公开(公告)日：2015-07-09

申请号：US14622619

申请日：2015-02-13

Applicant: Motion Engine Inc.

Inventor： Robert Mark Boysel ,  Louis Ross

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B2207/095 ,  B81B2207/096 ,  B81C1/00301 ,  H01L2224/94

Abstract: A MEMS device is provided. The device includes a MEMS wafer, a top cap wafer and a bottom cap wafer. The top and bottom cap wafers are respectively bonded to first and second sides of the MEMS wafer, the MEMS and cap wafers being electrically conductive. The outer side of the top cap wafer is provided with electrical contacts. The MEMS wafer, the top cap wafer and the bottom cap wafer define a cavity for housing a MEMS structure. The device includes insulated conducting pathways extending from within the bottom cap wafer, through the MEMS wafer and through the top cap wafer. The pathways are connected to the respective electrical contacts on the top cap wafer, for routing electrical signals from the bottom cap wafer to the electrical contacts on the top cap wafer. A method of manufacturing the MEMS device is also provided.

Abstract translation: 提供了一种MEMS器件。 该器件包括MEMS晶片，顶盖晶片和底盖晶片。 顶盖和底盖晶片分别结合到MEMS晶片的第一和第二侧，MEMS和盖晶片是导电的。 顶盖晶片的外侧设有电触点。 MEMS晶片，顶盖晶片和底盖晶片限定用于容纳MEMS结构的空腔。 该器件包括从底盖晶片内部穿过MEMS晶片并穿过顶盖晶片延伸的绝缘导电通路。 通路连接到顶盖晶片上的各个电触点，用于将电信号从底盖晶片转移到顶盖晶片上的电触点。 还提供了一种制造MEMS器件的方法。