公开(公告)号：US20240210174A1

公开(公告)日：2024-06-27

申请号：US18393460

申请日：2023-12-21

Applicant: Motion Engine Inc.

Inventor： Robert Mark Boysel ,  Louis Ross

IPC: G01C19/5712 ,  G01C19/5755 ,  G01C19/5769 ,  G01C25/00

CPC classification number: G01C19/5712 ,  G01C19/5755 ,  G01C19/5769 ,  G01C25/00

Abstract: A MEMS motion sensor and its manufacturing method are provided. The sensor includes a MEMS wafer including a proof mass and flexible springs suspending the proof mass and enabling the proof mass to move relative to an outer frame along mutually orthogonal x, y and z axes. The sensor includes top and bottom cap wafers including top and bottom cap electrodes forming capacitors with the proof mass, the electrodes being configured to detect a motion of the proof mass. Electrical contacts are provided on the top cap wafer, some of which are connected to the respective top cap electrodes, while others are connected to the respective bottom cap electrodes by way of insulated conducting pathways, extending along the z axis from one of the respective bottom cap electrodes and upward successively through the bottom cap wafer, the outer frame of the MEMS wafer and the top cap wafer.

公开(公告)号：US10273147B2

公开(公告)日：2019-04-30

申请号：US15024711

申请日：2014-09-19

Applicant: Motion Engine Inc.

Inventor： Robert Mark Boysel

IPC: G01P15/08 ,  B81B7/00 ,  B81C1/00

Abstract: A MEMS and a method of manufacturing MEMS components are provided. The method includes providing a MEMS wafer stack including a top cap wafer, a MEMS wafer and optionally a bottom cap wafer. The MEMS wafer has MEMS structures patterned therein. The MEMS wafer and the cap wafers include insulated conducting channels forming insulated conducting pathways extending within the wafer stack. The wafer stack is bonded to an integrated circuit wafer having electrical contacts on its top side, such that the insulated conducting pathways extend from the integrated circuit wafer to the outer side of the top cap wafer. Electrical contacts on the outer side of the top cap wafer are formed and are electrically connected to the respective insulated conducting channels of the top cap wafer. The MEMS wafer stack and the integrated circuit wafer are then diced into components having respective sealed chambers and MEMS structures housed therein.

公开(公告)号：US20170108336A1

公开(公告)日：2017-04-20

申请号：US15315894

申请日：2015-01-12

Applicant: Motion Engine Inc.

Inventor： Robert Mark Boysel ,  Louis Ross

IPC: G01C19/5712 ,  G01P15/18 ,  G01C19/5733

CPC classification number: G01C19/5712 ,  G01C19/5719 ,  G01C19/5733 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/084

Abstract: A micro-electro-mechanical system (MEMS) motion sensor is provided that includes a MEMS wafer having a frame structure, a plurality of proof masses suspended to the frame structure, movable in three dimensions, and enclosed in one or more cavities. The MEMS sensor includes top and bottom cap wafers bonded to the MEMS wafer and top and bottom electrodes provided in the top and bottom cap wafers, forming capacitors with the plurality of proof masses, and being together configured to detect motions of the plurality of proof masses. The MEMS sensor further includes first electrical contacts provided on the top cap wafer and electrically connected to the top electrodes, and a second electrical contacts provided on the top cap wafer and electrically connected to the bottom electrodes by way of vertically extending insulated conducting pathways. A method for measuring acceleration and angular rate along three mutually orthogonal axes is also provided.

公开(公告)号：US20150191345A1

公开(公告)日：2015-07-09

申请号：US14622619

申请日：2015-02-13

Applicant: Motion Engine Inc.

Inventor： Robert Mark Boysel ,  Louis Ross

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B2207/095 ,  B81B2207/096 ,  B81C1/00301 ,  H01L2224/94

Abstract: A MEMS device is provided. The device includes a MEMS wafer, a top cap wafer and a bottom cap wafer. The top and bottom cap wafers are respectively bonded to first and second sides of the MEMS wafer, the MEMS and cap wafers being electrically conductive. The outer side of the top cap wafer is provided with electrical contacts. The MEMS wafer, the top cap wafer and the bottom cap wafer define a cavity for housing a MEMS structure. The device includes insulated conducting pathways extending from within the bottom cap wafer, through the MEMS wafer and through the top cap wafer. The pathways are connected to the respective electrical contacts on the top cap wafer, for routing electrical signals from the bottom cap wafer to the electrical contacts on the top cap wafer. A method of manufacturing the MEMS device is also provided.

Abstract translation: 提供了一种MEMS器件。 该器件包括MEMS晶片，顶盖晶片和底盖晶片。 顶盖和底盖晶片分别结合到MEMS晶片的第一和第二侧，MEMS和盖晶片是导电的。 顶盖晶片的外侧设有电触点。 MEMS晶片，顶盖晶片和底盖晶片限定用于容纳MEMS结构的空腔。 该器件包括从底盖晶片内部穿过MEMS晶片并穿过顶盖晶片延伸的绝缘导电通路。 通路连接到顶盖晶片上的各个电触点，用于将电信号从底盖晶片转移到顶盖晶片上的电触点。 还提供了一种制造MEMS器件的方法。

公开(公告)号：US11852481B2

公开(公告)日：2023-12-26

申请号：US14622548

申请日：2015-02-13

Applicant: Motion Engine Inc.

Inventor： Robert Mark Boysel ,  Louis Ross

IPC: G01C19/5712 ,  G01C19/5755 ,  G01C19/5769

CPC classification number: G01C19/5712 ,  G01C19/5755 ,  G01C19/5769

Abstract: A MEMS motion sensor and its manufacturing method are provided. The sensor includes a MEMS wafer including a proof mass and flexible springs suspending the proof mass and enabling the proof mass to move relative to an outer frame along mutually orthogonal x, y and z axes. The sensor includes top and bottom cap wafers including top and bottom cap electrodes forming capacitors with the proof mass, the electrodes being configured to detect a motion of the proof mass. Electrical contacts are provided on the top cap wafer, some of which are connected to the respective top cap electrodes, while others are connected to the respective bottom cap electrodes by way of insulated conducting pathways, extending along the z axis from one of the respective bottom cap electrodes and upward successively through the bottom cap wafer, the outer frame of the MEMS wafer and the top cap wafer.

公开(公告)号：US11287486B2

公开(公告)日：2022-03-29

申请号：US15534702

申请日：2015-12-02

Applicant: MOTION ENGINE INC.

Inventor： Robert Mark Boysel

IPC: G01R33/26 ,  G01R33/028 ,  G01R33/02

Abstract: A micro-electro-mechanical system (MEMS) magnetometer is provided for measuring magnetic field components along three orthogonal axes. The MEMS magnetometer includes a top cap wafer, a bottom cap wafer and a MEMS wafer having opposed top and bottom sides bonded respectively to the top and bottom cap wafers. The MEMS wafer includes a frame structure and current-carrying first, second and third magnetic field transducers. The top cap, bottom cap and MEMS wafer are electrically conductive and stacked along the third axis. The top cap wafer, bottom cap wafer and frame structure together form one or more cavities enclosing the magnetic field transducers. The MEMS magnetometer further includes first, second and third electrode assemblies, the first and second electrode assemblies being formed in the top and/or bottom cap wafers. Each electrode assembly is configured to sense an output of a respective magnetic field transducer induced by a respective magnetic field component.

公开(公告)号：US20230304797A9

公开(公告)日：2023-09-28

申请号：US14622548

申请日：2015-02-13

Applicant: Motion Engine Inc.

Inventor： Robert Mark Boysel ,  Louis Ross

IPC: G01C19/5712 ,  G01C25/00

CPC classification number: G01C19/5712 ,  G01C25/00

Abstract: A MEMS motion sensor and its manufacturing method are provided. The sensor includes a MEMS wafer including a proof mass and flexible springs suspending the proof mass and enabling the proof mass to move relative to an outer frame along mutually orthogonal x, y and z axes. The sensor includes top and bottom cap wafers including top and bottom cap electrodes forming capacitors with the proof mass, the electrodes being configured to detect a motion of the proof mass. Electrical contacts are provided on the top cap wafer, some of which are connected to the respective top cap electrodes, while others are connected to the respective bottom cap electrodes by way of insulated conducting pathways, extending along the z axis from one of the respective bottom cap electrodes and upward successively through the bottom cap wafer, the outer frame of the MEMS wafer and the top cap wafer.

公开(公告)号：US11674803B2

公开(公告)日：2023-06-13

申请号：US15315894

申请日：2015-01-12

Applicant: Motion Engine Inc.

Inventor： Robert Mark Boysel ,  Louis Ross

IPC: G01C19/5712 ,  G01P15/18 ,  G01C19/5719 ,  G01P15/08 ,  G01P15/125 ,  G01C19/5733

CPC classification number: G01C19/5712 ,  G01C19/5719 ,  G01C19/5733 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  B81B2201/0235 ,  G01P2015/084

Abstract: A micro-electro-mechanical system (MEMS) motion sensor is provided that includes a MEMS wafer having a frame structure, a plurality of proof masses suspended to the frame structure, movable in three dimensions, and enclosed in one or more cavities. The MEMS sensor includes top and bottom cap wafers bonded to the MEMS wafer and top and bottom electrodes provided in the top and bottom cap wafers, forming capacitors with the plurality of proof masses, and being together configured to detect motions of the plurality of proof masses. The MEMS sensor further includes first electrical contacts provided on the top cap wafer and electrically connected to the top electrodes, and a second electrical contacts provided on the top cap wafer and electrically connected to the bottom electrodes by way of vertically extending insulated conducting pathways. A method for measuring acceleration and angular rate along three mutually orthogonal axes is also provided.

公开(公告)号：US20180074090A1

公开(公告)日：2018-03-15

申请号：US15558807

申请日：2016-03-17

Applicant: Motion Engine Inc.

Inventor： Robert Mark Boysel

IPC: G01P15/097 ,  G01P15/08 ,  G01P15/125 ,  G01C19/574 ,  G01C19/5712 ,  G01C19/5769 ,  B81B7/00 ,  B81C1/00 ,  G01L9/00

CPC classification number: G01P15/097 ,  B81B7/0061 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81C1/00238 ,  B81C1/00309 ,  G01C19/5712 ,  G01C19/574 ,  G01C19/5762 ,  G01C19/5769 ,  G01D21/02 ,  G01L9/0045 ,  G01L9/0073 ,  G01L19/0076 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01R33/028 ,  G01R33/0286

Abstract: A single Micro-Electro-Mechanical System (MEMS) sensor chip is provided, for measuring multiple parameters, referred to as multiple degrees of freedom (DOF). The sensor chip comprises a central MEMS wafer bonded to a top cap wafer and a bottom cap wafer, all three wafer being electrically conductive. The sensor comprises at least two distinct sensors, each patterned in the electrically conductive MEMS wafer and in at least one of the top and bottom cap wafer. Insulated conducting pathways extend from electrical connections on the top or bottom cap wafers, through at least one of the electrically conductive top cap and bottom cap wafers, and through the electrically conductive MEMS wafer, to the sensors, for conducting electrical signals between the sensors and the electrical connections. The two or more distinct sensors are enclosed by the top and bottom cap wafers and by the outer frame of MEMS wafer.

公开(公告)号：US20170363694A1

公开(公告)日：2017-12-21

申请号：US15534702

申请日：2015-12-02

Applicant: MOTION ENGINE INC.

Inventor： Robert Mark Boysel

IPC: G01R33/028 ,  G01R33/02

CPC classification number: G01R33/0286 ,  B81B2201/02 ,  G01R33/0206

Abstract: A micro-electro-mechanical system (MEMS) magnetometer is provided for measuring magnetic field components along three orthogonal axes. The MEMS magnetometer includes a top cap wafer, a bottom cap wafer and a MEMS wafer having opposed top and bottom sides bonded respectively to the top and bottom cap wafers. The MEMS wafer includes a frame structure and current-carrying first, second and third magnetic field transducers. The top cap, bottom cap and MEMS wafer are electrically conductive and stacked along the third axis. The top cap wafer, bottom cap wafer and frame structure together form one or more cavities enclosing the magnetic field transducers. The MEMS magnetometer further includes first, second and third electrode assemblies, the first and second electrode assemblies being formed in the top and/or bottom cap wafers. Each electrode assembly is configured to sense an output of a respective magnetic field transducer induced by a respective magnetic field component.