公开(公告)号：JP2009218319A

公开(公告)日：2009-09-24

申请号：JP2008059152

申请日：2008-03-10

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HASEGAWA MASAMI ,  ITAI MOTOHIKO ,  SHIRAISHI MITSUO ,  KATO ONORI ,  SUZUKI ATSUSHI ,  FUKUNAGA KAZUNORI

IPC: H05K3/00 ,  H01L23/12 ,  H05K1/02

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a multiply-produced wiring board with a plurality of green sheets laminated hard to generate a waste material or the like of a metalized layer formed on the surface after the split.
SOLUTION: A base green sheet bg comprises: a product area composed with a plurality of green sheets g1 to g4 laminated, and continuously having lengthwise and breadthwise a plurality of product parts p which become the wiring board after the split having the surface 3 and the rear surface 4; and a rear surface side concave part 7 opening at the rear surface 4, formed in intersecting with a cutting-planned surface c comparting the adjacent product parts p, not exposing to the surface 3, and having an unbaked metalization layer 9 on the inner wall surface. The method for manufacturing the multiply-produced wiring board 1 comprises a step of inserting a blade B1 having a blade angle θ1 of not less than 22° nor more than 30° along the cutting-planned surface c comparting each product part p from the surface 3 side of the sheet bg to form a first break groove v1 having the cross section of the angle same as the blade angle θ1.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 解决问题的方案：提供一种制造多层生片的方法，所述多层生片层压硬化以产生分裂后在表面上形成的金属化层的废料等。 基底生片bg包括：由多个生片g1至g4层压的产品区域，并且在具有表面的分割后成为布线板的多个产品部分p连续地纵向和纵向连续 3和后表面4; 以及在后表面4上开口的后表面侧凹部7，与与相邻的产品部分p相邻的切割预定表面c相交，不暴露于表面3，并且在内壁上具有未烘烤的金属化层9 表面。 制造多层布线板1的方法包括沿着从每个产品部分p分开的切割预定表面c从表面插入具有不小于22°并且不大于30°的叶片角度θ1的叶片B1的步骤 3侧，以形成具有与叶片角度θ1相同角度的横截面的第一断裂槽v1。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2004186269A

公开(公告)日：2004-07-02

申请号：JP2002349242

申请日：2002-11-29

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HASEGAWA MASAMI

IPC: H01L23/02

Abstract: PROBLEM TO BE SOLVED: To eliminate the characteristic deterioration of an electronic parts body in a method for manufacturing ceramic electronic parts obtained by housing the electronic parts body in a ceramic package and sealing the ceramic package with a cover.
SOLUTION: A crystal oscillator 1 is obtained by housing the electronic parts body of a crystal piece 2, etc. in the ceramic package 7 and connecting by brazing a lid 3 to the peripheral edge 7b of the opening of the ceramic package 7. As the lid 3, a lid having a recess 3a is used. The lid 3 is disposed on the ceramic package 7 so that the recess 3a is bridged between both the peripheral edge 7b of the opening and a cavity 7c, and the both are connected by brazing.
COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JP2020009932A

公开(公告)日：2020-01-16

申请号：JP2018130340

申请日：2018-07-10

Applicant: NGK SPARK PLUG CO

Inventor： SUZUKI ATSUSHI ,  HASEGAWA MASAMI ,  SUZUKI TETSUO ,  DEGUCHI HIROYUKI

IPC: H01L21/683 ,  H01L21/205

Abstract: 【課題】板状部材の第1の表面における温度分布を制御する。【解決手段】保持装置は、第1の方向に略垂直な略平面状の第1の表面を有する板状部材と、板状部材の表面側に設けられた複数の外部端子と、板状部材の内部に配置され、複数の外部端子の内の少なくとも一対の外部端子に電気的に接続されているヒータ電極と、を備え、板状部材の第1の表面上に対象物を保持する保持装置において、板状部材は、複数の外部端子の内の1つのみに電気的に接続されている、または、複数の外部端子のいずれにも電気的に接続されていないダミービアであって、板状部材の形成材料より熱伝導率の高い材料により形成され、第1の方向において第1の表面とヒータ電極との間に配置され、かつ、第1の方向に略平行な方向に延びているダミービアを備えている。【選択図】図5

公开(公告)号：JP2012227299A

公开(公告)日：2012-11-15

申请号：JP2011092556

申请日：2011-04-19

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HASEGAWA MASAMI ,  HIRAYAMA SATOSHI ,  KITO NAOKI

IPC: H05K1/02 ,  H01L23/12 ,  H01L23/13 ,  H05K3/00

CPC classification number: H05K1/0298 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/46 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2203/0346 ,  Y10T29/49155

Abstract: PROBLEM TO BE SOLVED: To provide a ceramic wiring board with little burr near a notch part on a side face of a board body and with an excellent solder mounting property of a conductor layer provided on an inner wall of the notch part, a multi-piece ceramic wiring board for obtaining such plural boards, and a manufacturing method for reliably obtaining the wiring board.SOLUTION: A ceramic wiring board 1a comprises a board body 2a having a surface 3 and a rear face 4 with a rectangular shape in a plane view, and side faces 5 positioned between the surface 3 and the rear face 4 and having a grooving face 8a on the surface 3 side and a broken face 7 on the rear face 4 side; and a notch part 6 with a concave shape in a plane view between the surface 3 and the rear face 4 on at least one of the side faces 5. On the side face 5 having the notch part 6, a boundary line 11 of the grooving face 8a and the broken face 7 has curve parts 11r projecting on the surface 3 side of the board body 2a in a side view on both sides of the notch part 6.

Abstract translation: 要解决的问题：为了在板体的侧面的切口部附近提供具有小毛刺的陶瓷布线板，并且具有优良的设置在切口部分的内壁上的导体层的焊接安装性能， 用于获得这种多个板的多件式陶瓷布线板以及可靠地获得布线板的制造方法。 ＆lt; P＆gt;解决方案：陶瓷接线板1a包括具有表面3和平面图中矩形形状的后表面4的板体2a和位于表面3和后表面4之间的侧面5，并且具有 表面3侧的开槽面8a和背面4侧的断面7; 以及在至少一个侧面5之间的表面3和背面4之间的平面图中具有凹形形状的切口部分6.在具有切口部分6的侧面5上，切槽的边界线11 面8a和断面7具有在切口部6的两侧的侧视图中在基板主体2a的表面3侧突出的曲线部11r。（C）2013，JPO＆INPIT

公开(公告)号：JP2012243942A

公开(公告)日：2012-12-10

申请号：JP2011112398

申请日：2011-05-19

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HASEGAWA MASAMI ,  HIRAYAMA SATOSHI ,  KITO NAOKI

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0306 ,  H05K1/113 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/381 ,  H05K3/403 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2203/107 ,  Y10T29/49124 ,  Y10T428/24479 ,  Y10T428/24612

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board with less burrs near a notched part positioned on a side face of a board body and tear-off of a conductor layer provided on an inner wall surface of the notched part.SOLUTION: A wiring board 1a comprises: a board body formed by laminating a plurality of ceramic layers, and provided with a pair of main surfaces 2 and 3 that are rectangular in a plan view and face each other, and a side face 4 positioned between the pair of main surfaces 2 and 3 and having a groove forming surface 6 positioned along the side of one main surface (back surface) 3 and a breaking surface 5 positioned between the groove forming surface 6 and the other main surface 2; and a notched part 11 formed only on the side of one main surface 3 of the side face 4, in a concave shape in the plan view in a thickness direction of the side face 4. On the side face 4 having the notched part 11, a boundary line 7 of the groove forming surface 6 and the breaking surface 5 has first curve parts R1 convex to the side of one main surface 3 in the board body in a side view on both sides of the notched part 11, and a second curve part R2 convex to the side of the other main surface (front surface) 2 in the board body on the side of the other main surface 2 in the notched part 11.

Abstract translation: 要解决的问题：提供一种在位于板体的侧面上的缺口部分附近具有较少毛刺的布线板，以及设置在凹口部分的内壁表面上的导体层的撕裂。 解决方案：布线板1a包括：板体，其通过层叠多个陶瓷层而形成，并且设置有在俯视图中彼此相对的矩形的一对主表面2,3;以及侧面 4，位于一对主表面2和3之间，并且具有沿着一个主表面（后表面）3的侧面定位的槽形成表面6和位于槽形成表面6和另一个主表面2之间的断裂表面5; 以及仅在侧面4的一个主面3的一侧形成的凹口部11，在侧面4的厚度方向的俯视图中呈凹状。在具有缺口部11的侧面4上， 槽形成表面6和断裂表面5的边界线7具有在切口部分11的两侧的侧视图中在板体中的一个主表面3的侧面凸起的第一弯曲部分R1，以及第二曲线 部分R2在切口部分11中的另一个主表面2侧的板体中另一个主表面（前表面）2的侧面凸出。（C）2013，JPO＆INPIT

公开(公告)号：JP2011040662A

公开(公告)日：2011-02-24

申请号：JP2009188826

申请日：2009-08-18

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HASEGAWA MASAMI ,  SHIBATA JUNKICHI ,  MIZUNO ATSUSHI

IPC: H05K1/02 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board in which conduction between a wiring layer formed at least on one of a top surface and a reverse surface of a ceramic layer and a via conductor or through-hole conductor penetrating ceramic is stable and satisfactory, and to provide a method of manufacturing the wiring board that securely provides the wiring board through simple processes.
SOLUTION: The wiring board includes the ceramic layer S having the top surface Sa and reverse surface Sb, wiring layers P1, P4 formed on the top surface Sa and reverse surface Sb of the ceramic layer, and the via conductors V penetrating the ceramic layer S and having ends (v) connected to the wiring layers P1, P4. The ends (v) of the via conductors V protrude outward (upward or downward) from surfaces of the wiring layers P1, P4, and connection surfaces F (f1) which are annular in plane view are provided between the via conductors V and the surfaces of the wiring layers P1, P4.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种布线板，其中形成在陶瓷层的顶表面和反面中的至少一个上的布线层和通孔导体或贯穿陶瓷的通孔导体是稳定的布线板 并且令人满意，并且提供一种制造布线板的方法，其通过简单的工艺可靠地提供布线板。 解决方案：布线板包括具有顶表面Sa和反面Sb的陶瓷层S，形成在陶瓷层的顶表面Sa和反面Sb上的布线层P1，P4，以及穿过该陶瓷层的通孔导体V 陶瓷层S并且具有连接到布线层P1，P4的端部（v）。 通孔导体V的端部（v）从布线层P1，P4的表面向外（向上或向下）突出，并且平面图中环形的连接表面F（f1）设置在通孔导体V和表面 的布线层P1，P4。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010073713A

公开(公告)日：2010-04-02

申请号：JP2008236003

申请日：2008-09-16

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HASEGAWA MASAMI ,  MIZUNO ATSUSHI

IPC: H01L23/12 ,  H05K3/46

CPC classification number: H01L2224/16225 ,  H01L2924/15174

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic component that can accurately form an internal wiring conductor in a ceramic base part without any position shift.
SOLUTION: In a recessed part forming stage, a recessed part 44 having a bottom part 43 is formed in an unsintered ceramic molding 41, and in a conductor charging stage, an unsintered conductor 49 is charged in the recessed part 44. In a laser processing stage, the unsintered conductor 49 is partially removed by laser irradiation while left on the bottom part 43 to form a hollow 50 in the unsintered conductor 49. In a ceramic material charging stage, an unsintered ceramic material 51 is charged in the hollow 50. Then a baking stage is carried out to sinter the unsintered ceramic molding 41, unsintered ceramic material 51, and unsintered conductor 49 at the same time, thereby forming the internal wiring conductor embedded in the ceramic base part and also forming a non-through via conductor connecting with the internal wiring conductor in the ceramic base part 14.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 解决的问题：提供一种制造陶瓷部件的方法，其可以在没有任何位置偏移的情况下在陶瓷基体部分中精确地形成内部布线导体。 解决方案：在凹陷部分形成阶段中，在未烧结的陶瓷模制件41中形成具有底部43的凹入部分44，并且在导体充电阶段中，将未烧结导体49装入凹部44中。 在激光加工阶段，通过激光照射部分去除未烧结的导体49，同时留在底部43上，以在未烧结的导体49中形成中空部分50.在陶瓷材料充电阶段，将未烧结的陶瓷材料51装入中空 然后，进行烧成阶段，同时烧结未烧结陶瓷成型体41，未烧结陶瓷材料51和未烧结导体49，由此形成嵌入陶瓷基部的内部配线导体，并且还形成非贯通 通孔导体与陶瓷基底部分14中的内部布线导体连接。版权所有：（C）2010，JPO＆INPIT

公开(公告)号：JP2003324170A

公开(公告)日：2003-11-14

申请号：JP2002127486

申请日：2002-04-26

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HAYANO HISAO ,  HASEGAWA MASAMI ,  MARUYAMA KAZUYUKI

IPC: C04B35/622 ,  H01L23/13

Abstract: PROBLEM TO BE SOLVED: To provide a ceramic substrate and the manufacturing method of the same high in an yield and reliability. SOLUTION: The ceramic substrate 101 is provided with a main surface 102, a rear surface 103, solder dumps 127 formed on the main surface 102, a main surface metallized layer 123 formed on the main surface 102, and a rear surface metallized layer 125 formed on the rear surface 103. In this case, the summit of the solder bump 127 is flattened and the main surface metalized layer 123 is formed so as to be thinner than the rear surface metallized layer 125. Further, the warpage of the substrate is specified within a range from -1 μm/mm to +4 μm/mm with the direction of the warpage wherein the rear surface 103 side is projected as a positive direction, while the direction of the warpage wherein the main surface 102 side is projected as a negative direction. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：提供陶瓷基板和其产率和可靠性高的制造方法。 解决方案：陶瓷基板101设置有主表面102，后表面103，形成在主表面102上的焊料倾倒127，形成在主表面102上的主表面金属化层123和后表面金属化 在这种情况下，焊料凸块127的顶点变平，并且主表面金属化层123形成为比后表面金属化层125薄。此外， 衬底被指定在-1μm/ mm至+4μm/ mm的范围内，其中后表面103侧作为正方向突出的翘曲方向，而主表面102侧为翘曲方向 投射为负方向。 版权所有（C）2004，JPO

公开(公告)号：JP2013122979A

公开(公告)日：2013-06-20

申请号：JP2011270748

申请日：2011-12-10

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HASEGAWA MASAMI ,  HIRAYAMA SATOSHI ,  KITO NAOKI

IPC: H05K1/02 ,  H05K3/00

Abstract: PROBLEM TO BE SOLVED: To provide a multiple patterning wiring board which is less likely to be unexpectedly broken by external force and of which more wiring board regions can be arranged in a product region, and to provide a method for manufacturing the same.SOLUTION: A multiple patterning wiring board includes: a substrate body 2 which has a surface 3 and a rear surface 4 and is formed by stacking a plurality of ceramic layers s1 to s3; a product region which is positioned in the central side of the substrate body 2 and has a plurality of wiring board regions pa positioned adjacently to each other in vertical and horizontal directions; an ear portion 5 which is positioned in the peripheral side of the substrate body 2 and surrounds the periphery of the product region; and a plurality of division grooves 7 and 8 which are formed on the surface 3 of the substrate body 2 by laser processing and are provided along a boundary cf between the wiring board regions pa in the product region and a boundary cf between the product region and the ear portion 5. On both ends of the division grooves 7 and 8, a rounded portion 9 is positioned, which includes a wide portion 11 in the central side and a curved portion 12 in the outer side, which are positioned in the ear portion 5, have a depth deeper than those of the groove portions 7 and 8 in the product region PA except both end portions, and have a groove width wider than those of the groove portions 7 and 8 in the product region.

Abstract translation: 要解决的问题：提供一种不太可能被外力意外破坏并且可以在产品区域中布置更多布线板区域的多重图案化布线板，并提供其制造方法 。 解决方案：多重图形布线板包括：具有表面3和背面4并且通过堆叠多个陶瓷层s1至s3而形成的基板主体2; 产品区域位于基板主体2的中心侧，并且具有在垂直和水平方向上彼此相邻定位的多个布线板区域pa; 耳部5，其位于基板主体2的周边并且围绕产品区域的周边; 以及通过激光加工形成在基板主体2的表面3上的多个分割凹槽7和8，并且沿着产品区域中的布线板区域pa和产品区域与产品区域之间的边界 耳部5.在分割槽7和8的两端，定位有圆形部分9，该圆形部分9包括中央侧的宽部分11和外侧的弯曲部分12，其位于耳部部分 如图5所示，其深度比产品区域PA中除了两个端部之外的槽部7和8的深度更深，并且具有比产品区域中的槽部7和8的槽宽更宽的槽宽度。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2013102201A

公开(公告)日：2013-05-23

申请号：JP2013007962

申请日：2013-01-21

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HASEGAWA MASAMI ,  SHIBATA JUNKICHI ,  MIZUNO ATSUSHI

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board stable and excellent in conduction between a wiring layer formed on at least one of a surface and a rear face of a ceramic layer, and a via conductor or a through hole conductor, which penetrates the ceramic layer; and provide a manufacturing method of reliably manufacturing the wiring board in a simple process.SOLUTION: A wiring board 1e comprises: a ceramic layer S having a surface Sa and a rear face Sb; wiring layers P1, P4 formed on the surface Sa and the rear face Sb of the ceramic layer, respectively; and via conductors V each penetrating the ceramic layer S and each having ends v connected to the wiring layers P1, P4. The ends v of the via conductor V protrude outward (upward and downward) from surfaces of the wiring layers P1, P4, respectively, and have annular connection surfaces F(f1) when viewed from above, between the surfaces of the via conductor V and the wiring layers P1, P4, respectively.

Abstract translation: 要解决的问题：为了提供在形成在陶瓷层的表面和背面中的至少一个上的布线层和通孔导体或通孔导体之间稳定且优异的导线的布线板，其中 穿透陶瓷层; 并且提供以简单的方法可靠地制造布线板的制造方法。 解决方案：布线板1e包括：具有表面Sa和后表面Sb的陶瓷层S; 分别形成在陶瓷层的表面Sa和背面Sb上的布线层P1，P4; 以及贯通陶瓷层S并且各自具有与布线层P1，P4连接的端部v的通孔导体V. 通孔导体V的端部v分别从布线层P1，P4的表面向外（向上和向下）突出，并且当从上方观察时，在通孔导体V的表面之间具有环形连接表面F（f1） 布线层P1，P4。 版权所有（C）2013，JPO＆INPIT