公开(公告)号：EP2704537A4

公开(公告)日：2014-10-08

申请号：EP12777596

申请日：2012-02-01

Applicant: NGK SPARK PLUG CO

Inventor： HASEGAWA MASAMI ,  HIRAYAMA SATOSHI ,  KITO NAOKI

IPC: H05K1/02 ,  H01L23/12 ,  H05K3/00

CPC classification number: H05K1/0306 ,  C04B41/0036 ,  H01L23/10 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/14 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/017 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09154 ,  H01L2924/00

Abstract: Provided are a wiring substrate including a substrate main body and a metalized layer provided on the front surface of the substrate main body so as to extend along side surfaces thereof, in which a plating film and a brazing material layer covering the surface of the metalized layer are not damaged; a multi-piece wiring substrate array for simultaneously providing a plurality of the wiring substrates; and a method for producing the multi-piece wiring substrate array. The wiring substrate 1a includes a substrate main body 2 which is formed of a ceramic laminate S and has a rectangular shape in plan view, and which has a front surface 3 and a back surface 4 and has four side surfaces 5, each being located between the front surface 3 and the back surface 4, and having a groove surface 7 located on a side toward the front surface 3 and a fracture surface 6 located on a side toward the back surface 4; and a metalized layer 11 which is formed on the front surface 3 of the substrate main body 2 so as to extend along the four side surfaces 5, and which has a rectangular frame shape in plan view, wherein a horizontal surface 13 of the ceramic laminate S of the substrate main body 2 is exposed between the metalized layer 11 and the groove surface 7 of each side surface 5 of the substrate main body 2.

公开(公告)号：EP2712281A4

公开(公告)日：2015-06-24

申请号：EP12785591

申请日：2012-02-01

Applicant: NGK SPARK PLUG CO

Inventor： HASEGAWA MASAMI ,  HIRAYAMA SATOSHI ,  KITO NAOKI

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0306 ,  H05K1/113 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/381 ,  H05K3/403 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2203/107 ,  Y10T29/49124 ,  Y10T428/24479 ,  Y10T428/24612

Abstract: Provided are a wiring substrate having few burrs in the vicinity of a notch located on a side surface of a substrate main body, in which breakage of a conductor layer provided on the inner wall of the notch is suppressed; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate 1a includes a substrate main body kp which is formed of a plurality of stacked ceramic layers S, which has a rectangular shape in plan view, which has a pair of opposite first and second main surfaces 3 and 2, and which has side surfaces 4 each being located between the paired main surfaces 3 and 2, and having a groove surface 6 located on a side toward the first main surface (back surface) 3 and a fracture surface 5 located between the groove surface 6 and the second main surface 2; and a notch 11 which has a concave shape in plan view, and which is provided on a side surface 4 only on a side toward the first main surface 3 so as to extend in a thickness direction of the side surface 4, wherein, in the side surface 4 having the notch 11, the boundary 7 between the groove surface 6 and the fracture surface 5 has first curved portions R1 on opposite sides of the notch 11, the first curved portions R1 being convex toward the first main surface 3 of the substrate main body kp in side view; and also has a second curved portion R2 on a second-main-surface side of the notch 11, the second curved portion R2 being convex toward the second main surface (front surface) 2 of the substrate main body kp in side view.

公开(公告)号：EP2701469A4

公开(公告)日：2015-03-18

申请号：EP12773834

申请日：2012-02-01

Applicant: NGK SPARK PLUG CO

Inventor： HASEGAWA MASAMI ,  HIRAYAMA SATOSHI ,  KITO NAOKI

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0298 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/46 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2203/0346 ,  Y10T29/49155

Abstract: Provided are a ceramic wiring substrate having few burrs in the vicinity of a notch provided on a side surface of a substrate main body, in which a conductor layer provided on the inner wall of the notch exhibits excellent solderability; a multi-piece ceramic wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the wiring substrate array. The ceramic wiring substrate 1a includes a substrate main body 2a which has a rectangular shape in plan view, and which has a front surface 3 and a back surface 4 and has side surfaces 5, each being located between the front surface 3 and the back surface 4, and having a groove surface 8a located on a side toward the front surface 3 and a fracture surface 7 located on a side toward the back surface 4; and a notch 6 which has a concave shape in plan view, and which is provided on at least one of the side surfaces 5 so as to extend between the front surface 3 and the back surface 4, wherein, in the side surface 5 having the notch 6, the boundary 11 between the groove surface 8a and the fracture surface 7 has curved portions 11r on opposite sides of the notch 6, the curved portions 11r being convex toward the front surface 3 of the substrate main body 2a in side view.

公开(公告)号：EP2701470A4

公开(公告)日：2015-01-14

申请号：EP12774076

申请日：2012-02-01

Applicant: NGK SPARK PLUG CO

Inventor： HASEGAWA MASAMI ,  HIRAYAMA SATOSHI ,  KITO NAOKI

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/02 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/10 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2203/1476 ,  Y10T29/49162

Abstract: Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate 1a is formed of a ceramic material S, has a square (rectangular) shape in plan view, and which has a front surface 2, a back surface 3, and side surfaces 4 each being located between the front surface 2 and the back surface 3, wherein each side surface 4 has a belt-like uneven surface 5 including a plurality of alternate and parallel convex portions 7 and concave portions 6 which are formed so as to extend along the front surface 2, and also has a fracture surface 8 located on a side toward the back surface 3.

公开(公告)号：JP2013168630A

公开(公告)日：2013-08-29

申请号：JP2012257394

申请日：2012-11-26

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： SUZUKI ATSUSHI ,  HASEGAWA MASAMI ,  KITO NAOKI

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a ceramic multilayer substrate manufacturing method capable of restraining warpage or dimensional variation of a ceramic multilayer substrate.SOLUTION: A ceramic green sheet 31 molded into a sheet form using a ceramic material is prepared. An adhering ceramic sheet 35 containing at least the ceramic material, an adhesive and an organic compound molten by heating, and molded into a sheet form is prepared. After plural ceramic green sheets 31 are laminated via the adhering ceramic sheet 35, they are heated to a temperature equal to or higher than a melting point of the organic compound, and each of the sheets 31, 35 is pressurized in a lamination direction while the adhering ceramic sheet 35 expresses viscosity of 50 gF or more at tensile strength. As a result, an unbaked ceramic laminate 42 in which respective ceramic green sheets 31 are integrated via the adhering ceramic sheet 35 is formed.

Abstract translation: 要解决的问题：提供一种能够抑制陶瓷多层基板的翘曲或尺寸变化的陶瓷多层基板的制造方法。解决方案：制备使用陶瓷材料成型为片状的陶瓷生片31。 制备至少含有陶瓷材料，粘合剂和通过加热熔融并成型为片状的有机化合物的粘附陶瓷片35。 在通过粘接陶瓷片35层叠多个陶瓷生片31之后，将其加热至有机化合物的熔点以上的温度，将片31,35分别在层叠方向加压， 粘附陶瓷片35以拉伸强度表示50gF以上的粘度。 结果，形成了通过粘附陶瓷片35将各陶瓷生片31一体化的未烘烤的陶瓷层叠体42。

公开(公告)号：JP2013134996A

公开(公告)日：2013-07-08

申请号：JP2011282435

申请日：2011-12-23

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HASEGAWA MASAMI ,  HIRAYAMA SATOSHI ,  KITO NAOKI

IPC: H05K3/00 ,  B23K26/00 ,  B23K26/14 ,  B23K26/16

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a multi-piece wiring board in which ceramic fine powder or the like is hard to stick to the inner wall of a through hole or the surface of a laminate, which rarely obstacles plating in a post step, when radiating laser across a through hole in radial direction that is formed at a green sheet laminate.SOLUTION: The method of manufacturing a multi-piece wiring board includes the steps of forming a laminate gs made from green sheets g1-g3, forming a plurality of through holes h1 and h2 by punching out the laminate gs, and forming a division groove on a surface 3 by radiating laser L so as to cross the plurality of through holes h1 and h2 along the surface 3 of the laminate gs. In the step of forming the division groove, the laser L is radiated while shifted along the surface 3 of the green sheet laminate gs where the plurality of through holes h1 and h2 are formed, and in the through holes h1 and h2 across a locus of the laser L, gas (Air) which is directed opposite to the radiation direction of the laser L is jetted.

Abstract translation: 要解决的问题：提供一种制造多片式布线基板的方法，其中陶瓷细粉末等难以粘附到通孔的内壁或层压板的表面，这几乎不会在 在通过在生片层叠体上形成的径向的通孔上照射激光时的后续步骤。解决方案：制造多片式布线板的方法包括以下步骤：形成由生片g1-g3制成的层压体gs， 通过冲压层压体gs形成多个通孔h1和h2，并且通过辐射激光L在表面3上形成分隔槽，以沿层压体gs的表面3穿过多个通孔h1和h2。 在形成分割槽的步骤中，沿着形成有多个通孔h1和h2的生片层叠体gs的表面3偏移激光L，并且穿过贯穿孔h1和h2的通孔 喷射与激光L的辐射方向相反的激光L，气体（Air）。

公开(公告)号：JP2012256731A

公开(公告)日：2012-12-27

申请号：JP2011129139

申请日：2011-06-09

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HIRAYAMA SATOSHI ,  HASEGAWA MASAMI ,  KITO NAOKI

IPC: H05K1/02 ,  H05K3/00

Abstract: PROBLEM TO BE SOLVED: To provide a multi-piece wiring board made from ceramic, and a method of manufacturing the same, in which a plurality of wiring board parts are provided vertically, horizontally, and adjacently, and breakage is never caused by a division groove formed on a surface or the like.SOLUTION: The multi-piece wiring board is made from ceramic and includes a product region 4 in which a plurality of wiring board parts 5, being square when viewed from above, are provided vertically, horizontally, and adjacently, an ear part 6 which has a square frame shape when viewed from above and is positioned around the product region 4, and a division groove 8 formed on a surface 2 as a lattice when viewed from above along the border between wiring board parts 5 adjoining each other and the boarder between the product region 4 and the ear part 6. An end part 9 of the division groove 8, which extends closer to the ear part 6 than to the border between the product region 4 and the ear part 6 among the end parts 9 of the division groove 8, contains a convergence part 10 in which a groove width w gradually becomes narrower, for convergence, when advances from the product region 4 side to the ear part 6 side in top view, and also contains a terminal part in which a bottom part gradually becomes shallower when advances from the product region 4 side to the ear part 6 side in side view.

Abstract translation: 解决的问题：为了提供一种由陶瓷制成的多件式布线板及其制造方法，其中多个布线板部分垂直，水平和相邻地设置，并且不会引起断裂 通过形成在表面等上的分隔槽。 ＆lt; P＆gt;解决方案：多片式布线板由陶瓷制成，并且包括产品区域4，其中从上方观察为正方形的多个布线板部件5垂直地，水平地并相邻地设置有耳部 6，其从上方观察并且位于产品区域4周围;以及分隔槽8，其形成在作为格子的表面2上，沿着从上方观察的沿着彼此邻接的布线板部分5之间的边界和 在产品区域4和耳朵部分6之间的边缘。分隔槽8的端部9在端部9的端部9之间更靠近耳朵部分6延伸到产品区域4和耳朵部分6之间的边界 分割槽8包含在顶视图中从产品区域4侧到耳朵部6侧前进时槽宽度w逐渐变窄的会聚部10，用于会聚，并且还包含端子部，其中， 底部毕业 当在侧视图中从产品区域4侧向耳部6侧进展时，会变浅。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2012230945A

公开(公告)日：2012-11-22

申请号：JP2011096829

申请日：2011-04-25

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HASEGAWA MASAMI ,  HIRAYAMA SATOSHI ,  KITO NAOKI

IPC: H05K3/00 ,  H01L23/12 ,  H05K1/02

CPC classification number: H05K1/0306 ,  C04B41/0036 ,  H01L23/10 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/14 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/017 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09154 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a wiring substrate free of flaws in the plated film or soldered material covering the surface of a metalized layer which is formed on the surface of the substrate body along each side surface side, a multi-piece wiring substrate for producing a plurality of the wiring substrates at the same time, and a manufacturing method thereof.SOLUTION: A wiring substrate 1a includes: a substrate body 2 which comprises a surface 3 and a reverse face 4 consisting of ceramic S and being shaped like a rectangle in a plan view and quadrilateral side faces 5 located between the surface 3 and the reverse face 4 and consisting of grooved faces 7 located on the surface 3 side and fracture surfaces 6 located on the reverse face 4; and a metalized layer 11 which is formed along the quadrilateral side faces 5 on the surface 3 of the substrate body 2 and which is shaped like a rectangular frame in a plan view. In the wiring substrate 1a, a horizontal surface 13 consisting of the ceramic S of the substrate body 2 exposed to the outside is located between the grooved face 7 and the metalized layer 11 every side faces 5 of the substrate body 2.

Abstract translation: 要解决的问题：为了提供一种布线基板，该布线基板在每个侧表面侧形成在基板主体表面上的金属化层的表面上的镀膜或焊接材料中没有缺陷，多片 同时制造多个布线基板的布线基板及其制造方法。 布线基板1a包括：基板主体2，其包括由陶瓷S构成的表面3和反面4，并且在平面图中形成为矩形，并且位于表面3和表面3之间的四边形侧面5 反面4并由位于表面3侧的开槽面7和位于反面4上的断裂面6组成; 以及金属化层11，其沿着基板主体2的表面3上的四边形侧面5形成，并且在俯视图中形成为矩形框架。 在布线基板1a中，由基板主体2的陶瓷S构成的水平面13在基板主体2的每个侧面5之间位于开槽面7与金属化层11之间。

COPYRIGHT （C）2013，JPO＆INPIT

公开(公告)号：JP2010073711A

公开(公告)日：2010-04-02

申请号：JP2008236000

申请日：2008-09-16

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HASEGAWA MASAMI ,  MIZUNO ATSUSHI ,  TANIMORI KENGO

IPC: H05K3/00 ,  B23K26/00 ,  B28D5/00 ,  H01L23/02 ,  H01L23/08 ,  H03H3/02

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing ceramic components, which can reliably form split grooves on a multipiece sintered ceramic body. SOLUTION: The present invention relates to the method of manufacturing ceramic components, in which the multipiece sintered ceramic body is manufactured and divided into a plurality of individual ceramic components. In a laser beam machining stage, the split grooves 51 and 52 are formed by machining an unsintered ceramic molding 50 by laser beam irradiation in a state where an unsintered conductor 49 is disposed in contact with the unsintered ceramic molding 50. In a baking stage after the laser beam machining stage, the unsintered ceramic molding 50 and unsintered conductor 49 are simultaneously heated and sintered to obtain the sintered ceramic body. In a splitting stage, the sintered ceramic body is divided along the split grooves 51 and 52 into the plurality of individual ceramic components. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种可以在多片烧结陶瓷体上可靠地形成分割槽的陶瓷部件的制造方法。 解决方案：本发明涉及制造陶瓷部件的方法，其中制造多片烧结陶瓷体并将其分成多个单独的陶瓷部件。 在激光加工阶段中，通过在未烧结的导体49与未烧结的陶瓷模制件50相接触的状态下通过激光束照射加工未烧结的陶瓷模制件50来形成分割槽51和52。 激光束加工阶段，未烧结陶瓷模制件50和未烧结的导体49被同时加热和烧结以获得烧结陶瓷体。 在分离阶段，烧结陶瓷体沿分割槽51和52分成多个单独的陶瓷部件。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010021386A

公开(公告)日：2010-01-28

申请号：JP2008181022

申请日：2008-07-11

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HASEGAWA MASAMI ,  MIZUNO ATSUSHI ,  TOJO TAKATOSHI

IPC: H05K3/46 ,  H01L23/12 ,  H05K3/00 ,  H05K3/10

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic part, which forms the interconnection of a fine pattern comparatively simply and securely, and furthermore at low cost.
SOLUTION: In a laser processing process, green ceramic shaped bodies 31, 32, 33 containing ceramic powder, and a non-sintered conductor 37 containing conductive metal powder are contactingly arranged. In such an arranged state, by removing a part of the non-sintered conductor 37 with a laser for the non-sintered conductor 37, a non-sintered conductor portion 38 in a predetermined shape is formed. In a sintering process after the laser processing process, the green ceramic shaped bodies 31, 32, 33 and the non-sintered conductor portion 37 are simultaneously heated and sintered.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种陶瓷部件的制造方法，其相对简单且可靠地形成精细图案的互连，并且进一步低成本。 解决方案：在激光加工工艺中，接触地布置包含陶瓷粉末的绿色陶瓷成形体31,32,33和含有导电金属粉末的非烧结导体37。 在这种布置状态下，通过用非烧结导体37的激光去除一部分非烧结导体37，形成预定形状的非烧结导体部分38。 在激光加工工序之后的烧结工序中，同时对生坯陶瓷体31,32,33和非烧结导体部37进行加热烧结。 版权所有（C）2010，JPO＆INPIT