Abstract:
An apparatus and method wherein the apparatus comprises: a deformable substrate;a curved support structure; at least one support configured to space the curved support structure from the substrate so that when the deformable substrate is deformed the curved support structure is not deformed in the same way; and a capacitive sensor comprising a protruding electrode capacitively coupled to an overlaying electrode;wherein the protruding electrode protrudes from a side of the curved support structure.
Abstract:
An apparatus comprising: a flexible substrate; and an overhanging electronic component island, the electronic component island configured to be less flexible than the flexible substrate and comprising one or more electronic components, wherein the electronic component island comprises a substrate-face with a connection portion and an overhang portion, the connection portion being mechanically coupled to a surface of the flexible substrate via a single connection-support pad and the overhang portion configured to overhang and be substantially free of the underlying flexible substrate such that the underlying flexible substrate can be strained independently from the overhang portion under operational strains of the flexible substrate.