公开(公告)号：CA2737066C

公开(公告)日：2017-07-11

申请号：CA2737066

申请日：2009-07-23

Applicant: OSRAM SYLVANIA INC

Inventor： HAMBY DAVID ,  SCOTCH ADAM M ,  SELVERIAN JOHN

IPC: H01L33/00

Abstract: A lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive traces on the base panel, which deliver a current to the LED chips. Various embodiments of this generally described lighting module are also presented. Additionally, methods of preparing such a lighting module, and system components of the lighting module are presented.

公开(公告)号：CA2737066A1

公开(公告)日：2010-03-25

申请号：CA2737066

申请日：2009-07-23

Applicant: OSRAM SYLVANIA INC

Inventor： HAMBY DAVID ,  SCOTCH ADAM M ,  SELVERIAN JOHN

IPC: H01L33/00

Abstract: A lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive traces on the base panel, which deliver a current to the LED chips. Various embodiments of this generally described lighting module are also presented. Additionally, methods of preparing such a lighting module, and system components of the lighting module are presented.

公开(公告)号：CA2735508A1

公开(公告)日：2010-03-25

申请号：CA2735508

申请日：2009-07-24

Applicant: OSRAM SYLVANIA INC

Inventor： SCOTCH ADAM M ,  SELVERIAN JOHN ,  HAMBY DAVID

IPC: H01L33/62 ,  H05B44/00

Abstract: A lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive traces on the base panel, which deliver a current to the LED chips. Various embodiments of this generally described lighting module are also presented. Additionally, methods of preparing such a lighting module, and system components of the lighting module are presented.

公开(公告)号：CA2735508C

公开(公告)日：2017-05-09

申请号：CA2735508

申请日：2009-07-24

Applicant: OSRAM SYLVANIA INC

Inventor： SCOTCH ADAM M ,  SELVERIAN JOHN ,  HAMBY DAVID

IPC: H01L33/62 ,  H05B44/00

Abstract: A lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive traces on the base panel, which deliver a current to the LED chips. Various embodiments of this generally described lighting module are also presented. Additionally, methods of preparing such a lighting module, and system components of the lighting module are presented.

公开(公告)号：DE112014004034T5

公开(公告)日：2016-08-04

申请号：DE112014004034

申请日：2014-08-19

Applicant: OSRAM SYLVANIA INC

Inventor： SPEER RICHARD S ,  HAMBY DAVID ,  SCOTCH ADAM M

IPC: H05K3/12 ,  H01L21/60 ,  H01L23/498 ,  H05K3/32

Abstract: Diese Offenbarung betrifft ein System zum Befestigen von Vorrichtungen an elastischen Substraten. Eine Vorrichtung kann auf eine Weise mit einem elastischen Substrat gekoppelt sein, die verhindert, dass ein Haftstoff eine leitfähige Tinte berührt, während der Haftstoff schädlich ist. Wenn leitfähiges Epoxidharz verwendet wird, um leitfähige Kontaktflächen in der Vorrichtung mit dem elastischen Substrat zu verhaften, kann das leitfähige Epoxidharz über den Rand der Vorrichtung hinaus aufgetragen werden, über welches die leitfähige Tinte aufgetragen werden kann, um elektrische Verbindungen zu erzeugen. Löcher können ebenfalls im elastischen Substrat ausgebildet werden, was dem leitfähigen Epoxidharz erlaubt, auf einer Oberfläche des elastischen Substrats gegenüber der Vorrichtungsposition freizuliegen, wobei die leitfähigen Tintenverbindungen auf der gegenüberliegenden Oberfläche erzeugt werden. Die leitfähige Tinte kann auch direkt auf die leitfähigen Kontaktflächen aufgetragen werden, wenn diese über den Rand der Vorrichtung hinaus erweitert werden. Das elastische Substrat kann mit Schaltkreispfaden vorbedruckt sein, wobei die leitfähige Tinte die Vorrichtung mit den Schaltkreispfaden koppelt.

公开(公告)号：EP2327109A4

公开(公告)日：2012-10-03

申请号：EP09814941

申请日：2009-07-23

Applicant: OSRAM SYLVANIA INC

Inventor： HAMBY DAVID ,  SCOTCH ADAM M ,  SELVERIAN JOHN

IPC: H01L33/00 ,  F21V19/04 ,  H01L27/15

CPC classification number: H01L25/0753 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F2001/133628 ,  H01L33/507 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive traces on the base panel, which deliver a current to the LED chips. Various embodiments of this generally described lighting module are also presented. Additionally, methods of preparing such a lighting module, and system components of the lighting module are presented.

公开(公告)号：EP2347457A4

公开(公告)日：2013-01-23

申请号：EP09814942

申请日：2009-07-24

Applicant: OSRAM SYLVANIA INC

Inventor： SCOTCH ADAM M ,  SELVERIAN JOHN ,  HAMBY DAVID

IPC: H01L33/62 ,  F21K99/00 ,  H01L33/58 ,  H01L33/60 ,  H05B33/08

CPC classification number: H05B33/0803 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/00014

公开(公告)号：EP2327112A4

公开(公告)日：2014-08-20

申请号：EP09814967

申请日：2009-08-21

Applicant: OSRAM SYLVANIA INC

Inventor： HAMBY DAVID ,  SCOTCH ADAM M ,  SELVERIAN JOHN ,  LAPATOVICH WALTER P

IPC: H01L33/50

CPC classification number: C09K11/02 ,  C09K11/08 ,  H01L33/501 ,  H01L33/505 ,  H01L33/507 ,  H01L2224/48091 ,  Y02B20/181 ,  H01L2924/00014

公开(公告)号：EP2327111A4

公开(公告)日：2011-10-05

申请号：EP09814972

申请日：2009-08-24

Applicant: OSRAM SYLVANIA INC

Inventor： SELVERIAN JOHN ,  HAMBY DAVID ,  SCOTCH ADAM M

IPC: H01L33/48 ,  G02B17/06

CPC classification number: H01L33/60 ,  F21K9/64 ,  F21V9/16 ,  F21V29/02 ,  F21Y2115/10 ,  G02B19/0014 ,  G02B19/0019 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0066 ,  H01L33/52 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive traces on the base panel, which deliver a current to the LED chips. Various embodiments of this generally described lighting module are also presented. Additionally, methods of preparing such a lighting module, and system components of the lighting module are presented.