APERTURE PLATE PERIMETER ROUTING USING ENCAPSULATED SPACER CONTACT
    11.
    发明申请
    APERTURE PLATE PERIMETER ROUTING USING ENCAPSULATED SPACER CONTACT 审中-公开
    使用加密间距接触器进行孔板周边布线

    公开(公告)号:WO2016036480A1

    公开(公告)日:2016-03-10

    申请号:PCT/US2015/044510

    申请日:2015-08-10

    Abstract: This disclosure provides systems, methods and apparatus for locating at least a portion of the routing interconnects on the aperture plate to reduce or completely eliminate bezel space, reduce line resistance, reduce line capacitance and increase power savings. In some implementations, one aspect, the routing interconnects may electrically connect row interconnects from an array of pixels to a row voltage driver. In some implementations, a conductive spacer may be coupled between an aperture plate and a light modulator substrate and may electrically connect at least one row interconnect on the light modulator substrate to at least one routing interconnect on the aperture plate. Some or all of the routing interconnects may run through the display area of the electromechanical device. Some or all of the conductive spacers may make contact with a row interconnect and a routing interconnected within the display area, for example via a conductive contact pad.

    Abstract translation: 本公开提供了用于定位孔板上的路由互连的至少一部分的系统,方法和装置,以减少或完全消除边框空间,降低线路电阻,降低线路电容并增加功率节省。 在一些实施方式中,一个方面,路由互连可以将行互连从像素阵列电连接到行电压驱动器。 在一些实施方案中,导电间隔物可以联接在孔板和光调制器基底之间,并且可以将光调制器基板上的至少一个行互连电连接到孔板上的至少一个路由互连。 部分或全部路由互连可以穿过机电设备的显示区域。 导电间隔物中的一些或全部可以与行互连和在显示区内互连的布线接触,例如经由导电接触垫。

    ELECTROMECHANICAL DEVICE, GLASS-BASED DRIVER CHIP THEREFOR AND METHOD OF MANUFACTURING THE DEVICE
    12.
    发明申请
    ELECTROMECHANICAL DEVICE, GLASS-BASED DRIVER CHIP THEREFOR AND METHOD OF MANUFACTURING THE DEVICE 审中-公开
    机电装置,基于玻璃的驱动器芯片及其制造方法

    公开(公告)号:WO2015199833A1

    公开(公告)日:2015-12-30

    申请号:PCT/US2015/030809

    申请日:2015-05-14

    Abstract: A device includes a first substrate formed of a first material and a plurality of electromechanical devices formed upon a surface of the first substrate. The device also includes an integrated circuit (IC) chip bonded to the surface of the first substrate where the integrated circuit chip is formed of a material selected from a group consisting of the first material or a material having a coefficient of thermal expansion (CTE) that is substantially similar to the CTE of the first material. In particular, both the first substrate and the chip substrate may be glass.

    Abstract translation: 一种器件包括由第一材料形成的第一衬底和形成在第一衬底的表面上的多个机电器件。 该装置还包括结合到第一基板的表面的集成电路(IC)芯片,其中集成电路芯片由选自第一材料或具有热膨胀系数(CTE)的材料组成的组中的材料形成, 其基本上类似于第一材料的CTE。 特别地,第一基板和芯片基板都可以是玻璃。

    DISPLAY APPARATUS INCORPORATING VERTICALLY ORIENTED ELECTRICAL INTERCONNECTS
    13.
    发明申请
    DISPLAY APPARATUS INCORPORATING VERTICALLY ORIENTED ELECTRICAL INTERCONNECTS 审中-公开
    显示设备包括垂直的电气互连

    公开(公告)号:WO2014042991A1

    公开(公告)日:2014-03-20

    申请号:PCT/US2013/058509

    申请日:2013-09-06

    Abstract: This disclosure provides systems, methods and apparatus for enabling a display to have a faster switching rate and an increased aperture ratio by using vertically oriented electrical interconnects with a reduced footprint. In one aspect, a display apparatus includes an array of display elements and an electrical interconnect connected to at least one display element in the array of display elements. A cross sectional aspect ratio of the electrical interconnect can be up to 1:1 or greater than 1:1.

    Abstract translation: 本公开提供了通过使用具有减小的占地面积的垂直取向的电互连使得显示器具有更快的开关速率和增加的开口率的系统,方法和装置。 一方面,显示装置包括显示元件阵列和连接到显示元件阵列中的至少一个显示元件的电互连。 电互连的截面纵横比可以高达1:1或大于1:1。

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