公开(公告)号：WO2017014872A3

公开(公告)日：2017-05-11

申请号：PCT/US2016037646

申请日：2016-06-15

Applicant: QUALCOMM INC

Inventor： SEZAN MUHAMMED IBRAHIM ,  DANTSKER EUGENE ,  KASKOUN KENNETH ,  NIZNIK BRIAN DAVID ,  TALBOT CHRISTOPHER ,  KLEIN ILENE

IPC: A61B1/00 ,  A61B1/227 ,  A61B5/00 ,  A61B5/01

CPC classification number: A61B1/227 ,  A61B1/00009 ,  A61B1/00016 ,  A61B1/05 ,  A61B1/07 ,  A61B5/0002 ,  A61B5/01 ,  A61B5/6803 ,  A61B5/6817 ,  A61B5/746 ,  A61B5/7465

Abstract: A wearable otoscope may be capable of wireless or wired communication with a second device, such as a smart phone. Some dual-ear otoscope implementations may be provided in a headphone-like configuration, which may include a headband attachable to earbuds of the dual-ear otoscope. However, some alternative implementations do not include a headband. At least a portion of the dual-ear otoscope may be a disposable component in some examples. In some implementations, functionality of the dual-ear otoscope (such as an illumination angle of light, imaging functionality, etc.) may be controlled according to commands received from the second device. Some examples may include one or more additional sensors, such as temperature sensors.

Abstract translation: 可佩戴耳镜可能能够与第二设备（例如智能手机）进行无线或有线通信。 一些双耳耳镜实现可以以耳机状配置提供，其可以包括可附接到双耳耳镜的耳塞的头带。 但是，一些替代实施不包括头带。 在一些示例中，双耳耳镜的至少一部分可以是一次性部件。 在一些实现中，可以根据从第二设备接收的命令来控制双耳耳镜的功能（诸如光的照射角度，成像功能等）。 一些示例可以包括一个或多个额外的传感器，诸如温度传感器。

公开(公告)号：WO2010062946A2

公开(公告)日：2010-06-03

申请号：PCT/US2009065898

申请日：2009-11-25

Applicant: QUALCOMM INC ,  CHANDRASEKARAN ARVIND ,  KASKOUN KENNETH ,  GU SHIQUN

Inventor： CHANDRASEKARAN ARVIND ,  KASKOUN KENNETH ,  GU SHIQUN

IPC: H04W72/12

CPC classification number: H01Q1/2283 ,  G06K19/07775 ,  G06K19/07779 ,  H01L23/481 ,  H01L23/585 ,  H01L23/645 ,  H01L23/66 ,  H01L25/0657 ,  H01L28/10 ,  H01L2223/6677 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/19015 ,  H01Q7/00 ,  Y10T29/49016 ,  H01L2924/00

Abstract: An antenna structure is integrated in a semiconductor chip. The antenna structure is formed by at least one of: a) one or more through-silicon vias (TSVs), and b) one or more crack stop structures. In certain embodiments, the antenna structure includes an antenna element formed by the TSVs. The antenna structure may further include a directional element formed by the crack stop structure. In certain other embodiments, the antenna structure includes an antenna element formed by the crack stop structure, and the antenna structure may further include a directional element formed by the TSVs.

Abstract translation: 天线结构集成在半导体芯片中。 天线结构由以下至少一种形成：a）一个或多个穿硅通孔（TSV），以及b）一个或多个裂纹停止结构。 在某些实施例中，天线结构包括由TSV形成的天线元件。 天线结构还可以包括由裂纹停止结构形成的方向元件。 在某些其他实施例中，天线结构包括由裂缝停止结构形成的天线元件，并且天线结构还可以包括由TSV形成的定向元件。