公开(公告)号：EP3231268A1

公开(公告)日：2017-10-18

申请号：EP15784522.3

申请日：2015-10-07

Applicant: Raytheon Company

Inventor： PAINE, Waid ,  WILSON, James S. ,  KYHL, Cary C. ,  ISOM, Robert S.

IPC: H05K7/20 ,  H01Q21/00

CPC classification number: H05K1/0204 ,  H01Q21/0025 ,  H01R12/72 ,  H05K1/0237 ,  H05K1/111 ,  H05K1/183 ,  H05K7/20509 ,  H05K2201/06 ,  H05K2201/09036 ,  H05K2201/10098

Abstract: A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

Abstract translation: 具有多个通道的射频（RF）模块包括具有至少一个锥形边缘的散热器; 设置在散热器的表面上方的衬底，使得散热器的锥形边缘延伸超过衬底的边界。 RF，逻辑和电源电路设置在衬底上，并且一个或多个RF信号端口形成在衬底的边缘上，以允许RF模块用于具有砖结构的阵列天线。 锥形边缘散热器提供用于RF信号分量的接地平面和用于设置在衬底中的发热电路的热路径。