Abstract:
A METHOD INCLUDING COATING ON A SUPPORT SURFACE A PATTERN OF DEPOSITS COMPRISED OF FILM-FORMING BINDER MATERIAL CONTAINING PHOSPHOR PARTICLES; ELECTROLESSLY PLATING ONLY THE UNCOATED SURFACE AREAS BETWEEN THE DEPOSITS WITH AT LEAST ONE METAL OF THE GROUP; NICKEL, COBLAT, AND COPPER; AND THEN CHEMICALLY CONVERTING THE PLATED METAL TO A DARK-COLORED COMPOUND MATERIAL.
Abstract:
METHOD FOR AUTOCATALYTICALLY ELECTROLESSLY PLATING A DIELECTRIC SURFACE WITH A METAL SUCH AS NICKEL, COBALT OR COPPER COMPRISING SENSITIZING THE SURFACE WITH AN IMPORVED SENSITIZING SOLUTION COMPRISING BOTH DIVALENT TIN ION AND TETRAVALENT TIN ION, THE SOLUTION HAVING A PH LESS THAN ABOUT 1.5, TREATING THE SENSITIZED SURFACE WITH A CATALYZING SOLUTION TO PROVIDE CATALYTIC NUCLEATING CENTERS, AND PLATING THE METAL ON THE CATALYZED SURFACE. THE IMPROVED SENSITIZING SOLUTION PERMITS PLATING ON SMOOTH, DENSE, WATER REPELLENT PLASTIC SURFACES SUCH AS TEFLON, LUCITE, SILICONE RUBBERS AND MYLAR.
Abstract:
A LAYER OF A RESINOUS ADHESIVE HAVING A METAL FORMATE SALT DISPERSED THERIN IS APPLIED TO THE INSULATING SURFACE. THE LAYER IS THEN HEATED TO DECOMPOSE THE METAL FORMATE SALT AND TO PRODUCE DECOMPOSITION PRODUCTS OF THE METAL OF THE SALT AND GASES, WHICH FORM MICROPORES IN THE LAYER AT THE SURFACE. THE SURFACE OF THE LAYER IS THEN ELECTROLESSLY PLATED WITH A METAL FOR WHICH THE METAL OF THE FORMATE SALT IS A CATALYST.
Abstract:
METHOD OF MAKING A LARGE-AREA METAL-COATED GLASS ARTICLE OF THE TYPE WHICH MUST RESIST ABRASION, COMPRISING FORMING A RELATIVELY THICK PATTERN OF METAL ON A TRANSPARENT GLASS SUBSTRATE BY AN ELECTROLESS DEPOSITION OF NICKEL-PHOSPHORUS ON THE SUBSTRATE AND HARDENING THE NICKEL-PHOSPHORUS LAYER BY HEAT TREATMENT AT TEMPERATURES NOT HIGHER THAN ABOUT 250*C.
Abstract:
A method for producing a color kinescope having an image screen and a color selection mask having final-size apertures that are temporarily reduced in size for use as a photographic master in producing the image screen. The method includes providing a substrate having apertures of final size; providing at one surface of the substrate a perforated layer of electroless deposition-initiating material, portions of the layer partially extending across the apertures; electrolessly depositing a suitable material at these portions of the layer to produce opaque light-barriers that define respective light-transmitting corridors; providing the image screen by photographic exposure through the corridors; removal of the light-barriers to restore the apertures to their original condition and provide the final mask; and incorporation of the mask and image screen into a kinescope.
Abstract:
A PROCESS FOR DEPOSITING NICKEL ONTO A SUBSTRATE FROM A ROOM TEMPERATURE ELECTROLESS PLATING BATH; THE BATH INITIALLY INCLUDES (I) A NICKEL SALT, (II) SODIUM HYPOPHOSPHITE, (III) SODIUM PYROPHOSPHATE, AND (IV) AMMONIUM HYDROXIDE. THE CONCENTRATION OF AMMONIUM HYDROXIDE IS CHOSEN SO AS TO ADJUST THE PH OF THE BATH TO AN INITIAL VALUE (BETWEEN 9.0 AND 11.5) CORRESPONDING TO THE DESIRED PLATING RATE. A STRONG BASE SUCH AS SODIUM HYDROXIDE IS THEN ADDED TO INCREASE THE PH OF THE BATH ABOVE THE INITIAL VALUE WITHOUT SUBSTANTIALLY AFFECTING THE PLATING RATE. IN USE, THE PH OF THE BATH DECREASES, BUT THE PLATING RATE REMAINS RELATIVELY UNAFFECTED SO LONG AS THE PH DOES NOT DROP BELOW THE INITIAL VALUE SET BY THE AMMONIUM HYDROXIDE. THIS PERMITS WIDER TOLERANCES IN PH CONTROL OF THE BATH AND ALLEVIATES THE NEED FOR ADDING AN ACCURATELY CONTROLLED AMOUNT OF HYDROXYL ION WHEN THE BATH IS REGENERATED.
Abstract:
1452116 Photomasks RCA CORPORATION 18 Dec 1973 [29 Dec 1972] 58555/73 Heading G2X [Also in Division C7] A photomask is formed by depositing a Ni or Ni alloy layer by vapour or electroless deposition or by sputtering on a glass or plastics substrate, applying a pattern of a photo-resist, electrolessly depositing a Ni, Co or Cu layer and then heating in air to form Ni oxides and make the first layer at least 70% transparent to visible or ultraviolet light.
Abstract:
1452116 Photomasks RCA CORPORATION 18 Dec 1973 [29 Dec 1972] 58555/73 Heading G2X [Also in Division C7] A photomask is formed by depositing a Ni or Ni alloy layer by vapour or electroless deposition or by sputtering on a glass or plastics substrate, applying a pattern of a photo-resist, electrolessly depositing a Ni, Co or Cu layer and then heating in air to form Ni oxides and make the first layer at least 70% transparent to visible or ultraviolet light.