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    SIDE CONNECTORS FOR RFID CHIP
    12.
    发明申请
    SIDE CONNECTORS FOR RFID CHIP 审中-公开

    公开(公告)号：WO2008021744A3

    公开(公告)日：2008-02-21

    申请号：PCT/US2007/075103

    申请日：2007-08-02

    Applicant: RCD TECHNOLOGY INC. ,  OBERLE, Robert, R.

    Inventor： OBERLE, Robert, R.

    IPC: G06K19/06

    Abstract: An RFID chip can have an RFID circuit having first and second initial bond pads and conductive paths on the RFID chip connecting the first and second bond pads to the different sides of the chip. The conductive paths including a first side connector on a first side of the chip electrically connected to the first bond pad and a second side connector on a second side of the chip connected to the second bond pad. The first and second side connectors can cover at least half of the first and second side length respectively.

    ELECTROLESS/ELECTROLYTIC SEED LAYER PROCESS
    15.
    发明申请
    ELECTROLESS/ELECTROLYTIC SEED LAYER PROCESS 审中-公开
    电解/电沉积层工艺

    公开(公告)号：WO2009064598A1

    公开(公告)日：2009-05-22

    申请号：PCT/US2008/081013

    申请日：2008-10-23

    Applicant: RCD TECHNOLOGY INC. ,  OBERLE, Robert, R.

    Inventor： OBERLE, Robert, R.

    IPC: C25D5/00

    CPC classification number: C25D5/022 ,  C23C18/1608 ,  C23C18/1653 ,  C23C18/30 ,  C25D7/00 ,  H01Q1/2208 ,  H01Q1/36 ,  H01Q1/38

    Abstract: An electroless metallization catalyst layer can be formed in a RFID antenna pattern. A first metallic layer can be deposited over top of the electroless metallization catalyst layer. An electrical short layer connecting regions of the metallic layer can be formed. A portion of electrical short layer can be covered with a non-conductive layer. The first metallic layer can be electroplated with a second metallic layer.

    Abstract translation: 无电金属化催化剂层可以以RFID天线图案形成。 可以在无电金属化催化剂层的顶部上沉积第一金属层。 可以形成连接金属层的区域的电短层。 电短层的一部分可以被非导电层覆盖。 第一金属层可以用第二金属层电镀。

    METHOD FOR FORMING RADIO FREQUENCY ANTENNA USING CONDUCTIVE INKS
    17.
    发明申请
    METHOD FOR FORMING RADIO FREQUENCY ANTENNA USING CONDUCTIVE INKS 审中-公开
    使用导电墨水形成无线电频率天线的方法

    公开(公告)号：WO2001069717A1

    公开(公告)日：2001-09-20

    申请号：PCT/US2001/007897

    申请日：2001-03-13

    Applicant: RCD TECHNOLOGY, INC. ,  OBERLE, Robert, R.

    Inventor： OBERLE, Robert, R.

    IPC: H01Q1/36

    CPC classification number: H01Q1/2225 ,  G06K19/07749 ,  H01Q1/22 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q9/27 ,  H05K1/095 ,  H05K1/165 ,  H05K3/242 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2203/0191 ,  H05K2203/0769 ,  Y10T29/49016

    Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate (52). The antenna coil pattern is formed using a conductive ink (42) which is patterned on the substrate. The conductive ink is cured and an electrical-short layer (46) is formed across the coils of the conductive ink pattern. An insulating layer (56) is formed over top of the electrical-short layer, a metal layer (58) electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.

    Abstract translation: 适用于射频天线的金属化电路通过在柔性基板（52）上形成天线线圈图案来制造。 使用在基板上图案化的导电油墨（42）形成天线线圈图案。 导电油墨固化，并且在导电油墨图案的线圈之间形成电 - 短层（46）。 绝缘层（56）形成在电短层的顶部上，电镀在导电层顶部上的金属层（58），然后去除电短层。 在电镀期间使用电 - 短层允许导电油墨层上不同点处的电压相对相似，使得在导电油墨层的顶部上形成均匀的电镀层。 这导致了降低成本的更好质量的射频天线。

    METHOD FOR FORMING RADIO FREQUENCY ANTENNA
    18.
    发明公开
    METHOD FOR FORMING RADIO FREQUENCY ANTENNA 审中-公开
    一种用于形成高频天线

    公开(公告)号：EP1932211A2

    公开(公告)日：2008-06-18

    申请号：EP06774571.1

    申请日：2006-07-10

    Applicant: RCD TECHNOLOGY INC.

    Inventor： OBERLE, Robert, R.

    IPC: H01Q1/38

    CPC classification number: H01Q7/00 ,  H01Q1/38 ,  H01Q9/27 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/165 ,  H05K3/242 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2203/1476 ,  H05K2203/1545

    Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.

    METHOD FOR FORMING RADIO FREQUENCY ANTENNA USING CONDUCTIVE INKS
    19.
    发明授权
    METHOD FOR FORMING RADIO FREQUENCY ANTENNA USING CONDUCTIVE INKS 有权
    一种用于形成高频天线FROM导电油墨

    公开(公告)号：EP1266426B1

    公开(公告)日：2007-08-29

    申请号：EP01920313.2

    申请日：2001-03-13

    Applicant: RCD Technology, Inc.

    Inventor： OBERLE, Robert, R.

    IPC: H01Q1/36

    CPC classification number: H01Q1/2225 ,  G06K19/07749 ,  H01Q1/22 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q9/27 ,  H05K1/095 ,  H05K1/165 ,  H05K3/242 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2203/0191 ,  H05K2203/0769 ,  Y10T29/49016

    Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate (52). The antenna coil pattern is formed using a conductive ink (42) which is patterned on the substrate. The conductive ink is cured and an electrical-short layer (46) is formed across the coils of the conductive ink pattern. An insulating layer (56) is formed over top of the electrical-short layer, a metal layer (58) electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.

    METHOD FOR FORMING RADIO FREQUENCY ANTENNA USING CONDUCTIVE INKS
    20.
    发明公开
    METHOD FOR FORMING RADIO FREQUENCY ANTENNA USING CONDUCTIVE INKS 有权
    一种用于形成高频天线FROM导电油墨

    公开(公告)号：EP1266426A1

    公开(公告)日：2002-12-18

    申请号：EP01920313.2

    申请日：2001-03-13

    Applicant: RCD Technology, Inc.

    Inventor： OBERLE, Robert, R.

    IPC: H01Q1/36

    CPC classification number: H01Q1/2225 ,  G06K19/07749 ,  H01Q1/22 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q9/27 ,  H05K1/095 ,  H05K1/165 ,  H05K3/242 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2203/0191 ,  H05K2203/0769 ,  Y10T29/49016

    Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate (52). The antenna coil pattern is formed using a conductive ink (42) which is patterned on the substrate. The conductive ink is cured and an electrical-short layer (46) is formed across the coils of the conductive ink pattern. An insulating layer (56) is formed over top of the electrical-short layer, a metal layer (58) electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.

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