公开(公告)号：WO2005010566A3

公开(公告)日：2007-01-18

申请号：PCT/US2004023139

申请日：2004-07-19

Applicant: REFLECTIVITY INC ,  PATEL SATYADEV R ,  HUIBERS ANDREW G

Inventor： PATEL SATYADEV R ,  HUIBERS ANDREW G

IPC: G02B26/00 ,  G02B20060101 ,  G02B26/08 ,  G02F1/29 ,  H01L20060101 ,  H01L21/00

CPC classification number: G02B26/0841 ,  B82Y30/00

Abstract: A spatial light modulator is disclosed, along with a method for making such a modulator that comprises an array of micromirror devices. The center-to-center distance and the gap between adjacent micromirror devices are determined corresponding to the light source being used so as to optimize optical efficiency and performance quality. The micromirror device comprises a hinge support formed on a substrate and a hinge that is held by the hinge support. A mirror plate is connected to the hinge via a contact, and the distance between the mirror plate and the hinge is determined according to desired maximum rotation angle of the mirror plate, the optimum gap and pitch between the adjacent micromirrors. In a method of fabricating such spatial light modulator, one sacrificial layer is deposited on a substrate followed by forming the mirror plates, and another sacrificial layer is deposited on the mirror plates followed by forming the hinge supports. The two sacrificial layers are removed via the small gap between adjacent mirror devices with spontaneous vapor phase chemical etchant. Also disclosed is a projection system that comprises such a spatial light modulator, as well as a light source, condensing optics, wherein light from the light source is focused onto the array of micromirrors, projection optics for projecting light selectively reflected from the array of micromirrors onto a target, and a controller for selectively actuating the micromirrors in the array.

Abstract translation: 公开了一种空间光调制器，以及用于制造这种调制器的方法，该调制器包括微镜器件阵列。 根据所使用的光源确定中心到中心距离和相邻微镜器件之间的间隙，以优化光学效率和性能质量。 微反射镜装置包括形成在基底上的铰链支撑件和由铰链支撑件保持的铰链。 镜板通过触点连接到铰链，并且根据镜板的期望的最大旋转角度，相邻微镜之间的最佳间隙和间距来确定镜板和铰链之间的距离。 在制造这种空间光调制器的方法中，将一个牺牲层沉积在衬底上，随后形成镜板，并且另一牺牲层沉积在镜板上，随后形成铰链支架。 两个牺牲层通过具有自发气相化学蚀刻剂的相邻反射镜装置之间的小间隙去除。 还公开了一种投影系统，其包括这样的空间光调制器以及光源，聚光光学器件，其中来自光源的光聚焦到微镜阵列上，用于投射从微镜阵列反射的光的投影光学器件 以及用于选择性地致动阵列中的微镜的控制器。

公开(公告)号：WO2005010571A3

公开(公告)日：2005-11-17

申请号：PCT/US2004024039

申请日：2004-07-26

Applicant: REFLECTIVITY INC ,  PATEL SATYADEV R ,  HUIBERS ANDREW G

Inventor： PATEL SATYADEV R ,  HUIBERS ANDREW G

IPC: G02B26/08 ,  H04N5/74 ,  H01L31/0232 ,  G02B26/00 ,  H01L21/00

CPC classification number: B82Y30/00 ,  G02B26/0841 ,  H04N5/7458

Abstract: A spatial light modulator is disclosed, along with a method for making such a modulator that comprises an array of micromirror devices. The center-to-center distance and the gap between adjacent micromirror devices are determined corresponding to the light source being used so as to optimize optical efficiency and performance quality. The micromirror device comprises a hinge support (218) formed on a substrate (210) and a hinge (22) that is held by the hinge support (218). A mirror plate (212) is connected to the hinge (222) via a contact (224), and the distance between the mirror plate (212) and the hinge (222) is determined according to desired maximum rotation angle of the mirror plate (212), the optimum gap and pitch between the adjacent micromirrors. In a method of fabricating such spatial light modulator, one sacrificial layer is deposited on a substrate (210) followed by forming the mirror plates (212), and another sacrificial layer is deposited on the mirror plates (212) followed by forming the hinge supports (218). The two sacrificial layers are removed via the small gap between adjacent mirror devices with spontaneous vapor phase chemical etchant. Also disclosed is a projection system that comprises such a spatial light modulator, as well as a light source, condensing optics, wherein light from the light source is focused onto the array of micromirrors, projection optics for projecting light selectively reflected from the array of micromirrors onto a target, and a controller for selectively actuating the micromirrors in the array.

Abstract translation: 公开了一种空间光调制器，以及用于制造这种调制器的方法，该调制器包括微镜器件阵列。 根据所使用的光源确定中心到中心距离和相邻微镜器件之间的间隙，以优化光学效率和性能质量。 微镜装置包括形成在基底（210）上的铰链支撑（218）和由铰链支撑（218）保持的铰链（22）。 镜板（212）经由触点（224）连接到铰链（222），并且根据镜板的期望的最大旋转角度来确定镜板（212）和铰链（222）之间的距离 212），相邻微镜之间的最佳间隙和间距。 在制造这种空间光调制器的方法中，将一个牺牲层沉积在衬底（210）上，随后形成镜板（212），并且另一牺牲层沉积在镜板（212）上，随后形成铰链支架 （218）。 两个牺牲层通过具有自发气相化学蚀刻剂的相邻反射镜装置之间的小间隙去除。 还公开了一种投影系统，其包括这样的空间光调制器以及光源，聚光光学器件，其中来自光源的光聚焦到微镜阵列上，用于投射从微镜阵列反射的光的投影光学器件 以及用于选择性地致动阵列中的微镜的控制器。

公开(公告)号：WO2004087563A3

公开(公告)日：2005-06-30

申请号：PCT/US2004009231

申请日：2004-03-24

Applicant: REFLECTIVITY INC ,  PATEL SATYADEV R ,  DOAN JONATHAN

Inventor： PATEL SATYADEV R ,  DOAN JONATHAN

IPC: B81B7/00 ,  B81C20060101 ,  B81C1/00 ,  H01L21/00 ,  H01L21/76

CPC classification number: B81C1/00793 ,  B81B2201/042 ,  B81C2201/053

Abstract: A method for processing microelectromechanical devices is disclosed herein. The method prevents the diffusion and interaction between sacrificial layers and structure layers of the microelectromechanical devices by providing selected barrier layers between consecutive sacrificial and structure layers.

Abstract translation: 本文公开了一种用于处理微机电装置的方法。 该方法通过在连续的牺牲层和结构层之间提供选定的阻挡层来防止牺牲层与微机电器件的结构层之间的扩散和相互作用。

公开(公告)号：WO02095800A3

公开(公告)日：2003-02-13

申请号：PCT/US0216224

申请日：2002-05-22

Applicant: REFLECTIVITY INC ,  PATEL SATYADEV R ,  HUIBERS ANDREW G ,  SCHAADT GREGORY P ,  HEUREUX PETER J

Inventor： PATEL SATYADEV R ,  HUIBERS ANDREW G ,  SCHAADT GREGORY P ,  HEUREUX PETER J

IPC: B81B3/00 ,  C23F1/00 ,  H01L21/00 ,  H01L21/302 ,  H01L21/306 ,  H01L21/461 ,  B81C5/00 ,  G02B26/08

CPC classification number: B81C1/00476 ,  B81C1/00547 ,  B81C2201/0109 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2201/112 ,  B82Y30/00

Abstract: An etching method, such as for forming a micromechanical device, is disclosed. One embodiment of the method is for releasing a micromechanical structure, comprising, providing a substrate (10); providing a sacrificial layer (20) directly or indirectly on the substrate; providing one or more micromechanical structural layers (30) on the sacrificial layer; performing a first etch to remove a portion of the sacrificial layer (20), the first etch comprising providing an etchant gas and energizing (42) the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of the sacrificial layer; performing a second etch to remove additional sacrificial material in the sacrificial layer, the second etch comprising providing a gas that chemically but not physically etches the additional sacrificial material.

Abstract translation: 公开了一种诸如用于形成微机械装置的蚀刻方法。 该方法的一个实施例是用于释放微机械结构，包括提供衬底（10）; 在衬底上直接或间接提供牺牲层（20）; 在牺牲层上提供一个或多个微机械结构层（30）; 执行第一蚀刻以去除牺牲层（20）的一部分，所述第一蚀刻包括提供蚀刻剂气体并激发（42）蚀刻剂气体，以便使蚀刻剂气体在物理或化学和物理上移除部分 的牺牲层; 执行第二蚀刻以去除牺牲层中的附加牺牲材料，第二蚀刻包括提供化学上但不物理蚀刻附加牺牲材料的气体。

公开(公告)号：WO02075794A3

公开(公告)日：2002-11-14

申请号：PCT/US0207761

申请日：2002-03-15

Applicant: REFLECTIVITY INC ,  PATEL SATYADEV R ,  HUIBERS ANDREW G

Inventor： PATEL SATYADEV R ,  HUIBERS ANDREW G

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  B81C99/00 ,  G02B26/08 ,  H01L21/00 ,  H01L21/30 ,  H01L21/301 ,  H01L21/46

CPC classification number: B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: A method is disclosed for forming a micromechanical device. The method includes fully or partially forming one or more micromechanical structures multiple times on first substrate (5a). A second substrate is bonded onto the first substrate so a to cover the multiple areas each having one or more micromechanical structures, so as to form a substrate assembly. The substrate assembly is then separated into individual dies, each die having the one or more micromechanical structures held on a portion (21) of the first substrate, with a portion of the second substrate bonded to the first substrate portion. Finally, the second substrate portion is removed from each die (3a-3d) to expose the one or more micromechanical structures on the first substrate portion. The invention is also directed to a method for forming a micromechanical device, including: forming one or more micromechanical structures in one or more areas on a first substrate; bonding caps onto the first substrate so as to cover the one or more areas each having one or more micromechanical structures, so as to form a substrate (10) assembly; after a period of time, removing the caps to expose the one or more micromechanical structures. During the period of time between bonding the caps and later removing the caps, the substrate assembly can be singulated, inspected, irradiated, annealed, die attached, shipped and/or stored.

Abstract translation: 公开了一种用于形成微机械装置的方法。 该方法包括在第一衬底（5a）上多次完全或部分地形成一个或多个微机械结构。 第二衬底被结合到第一衬底上以便覆盖每个具有一个或多个微机械结构的多个区域，以便形成衬底组件。 然后将基板组件分离成单独的模具，每个模具具有一个或多个微机械结构，其保持在第一基板的一部分（21）上，其中第二基板的一部分结合到第一基板部分。 最后，从每个管芯（3a-3d）移除第二衬底部分以露出第一衬底部分上的一个或多个微机械结构。 本发明还涉及一种用于形成微机械装置的方法，包括：在第一衬底上的一个或多个区域中形成一个或多个微机械结构; 将盖接合到第一基板上以覆盖每个具有一个或多个微机械结构的一个或多个区域，以便形成基板（10）组件; 在一段时间之后，移除盖以露出一个或多个微机械结构。 在接合盖子和稍后移除盖子之间的时间段期间，可以对基板组件进行单切割，检查，照射，退火，模具附接，运输和/或存储。