公开(公告)号：WO2018081398A1

公开(公告)日：2018-05-03

申请号：PCT/US2017/058493

申请日：2017-10-26

Applicant: SAMTEC INC.

Inventor： SHAH, Jignesh ,  WILLIAMS BARNETT, Jean Karlo ,  ZBINDEN, Eric

IPC: H01R12/51 ,  H01R13/24 ,  H01R13/629

Abstract: An interconnect module, such as a transceiver is configured to mate with a host module that includes first and second electrical connectors. The interconnect module includes first and second pluralities of lands that are spaced from each other. The interconnect module can be mated with the host module such that the first lands mate with the first electrical connector, and the second lands mate with the second electrical connector. As the interconnect module is mated with the host module, the first lands can pass over mating regions of the electrical contacts of the second electrical connector without wiping against the mating regions. The interconnect module can be used in both front panel mount and mid board mount applications.

Abstract translation: 诸如收发器的互连模块被配置为与包括第一和第二电连接器的主模块配对。 互连模块包括彼此间隔开的第一和第二多个焊盘。 互连模块可以与主机模块配合，使得第一焊盘与第一电连接器配合，并且第二焊盘与第二电连接器配合。 当互连模块与主机模块配合时，第一焊盘可以越过第二电连接器的电触点的配合区域而不擦拭配合区域。 互连模块可用于前面板安装和中板安装应用。

公开(公告)号：WO2022081683A1

公开(公告)日：2022-04-21

申请号：PCT/US2021/054749

申请日：2021-10-13

Applicant: SAMTEC, INC.

Inventor： ZBINDEN, Eric

IPC: H01R12/88 ,  H01R13/11 ,  H01R12/71

Abstract: An interconnect module and mating ring connector are described. The interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.

公开(公告)号：WO2020028737A1

公开(公告)日：2020-02-06

申请号：PCT/US2019/044773

申请日：2019-08-02

Applicant: SAMTEC, INC.

Inventor： BETTMAN, R., Brad ,  CARMONA ARAYA, Josue, Alfredo ,  NIGHTINGALE, John, Lawrence ,  WILLIAMS BARNETT, Jean Carlo ,  ZBINDEN, Eric

IPC: G02B6/42

Abstract: A variety of methods and arrangements for latching a transceiver to a host printed circuit board (PCB) are described. The transceiver is secured to its electrical sockets by a latch that does not extend or only minimally extends beyond the transceiver footprint and height. In some embodiments the latch includes a thermal bridge that provides a heat transfer path between the transceiver and host substrate.

公开(公告)号：WO2018081340A1

公开(公告)日：2018-05-03

申请号：PCT/US2017/058402

申请日：2017-10-26

Applicant: SAMTEC INC.

Inventor： EPITAUX, Marc ,  ZBINDEN, Eric ,  NIGHTINGALE, John, L.

IPC: G02B6/36

CPC classification number: G02B6/423 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/4246 ,  G02B6/4249

Abstract: An optical transceiver includes a photonic integrated circuit that is configured to be placed in alignment with an alignment module that is configured to carry a plurality of optical fibers. When the photonic integrated circuit is aligned with the alignment module, the optical fibers are placed in optical alignment with respective waveguides of the photonic integrated circuit.

Abstract translation: 光收发器包括光子集成电路，该光子集成电路被配置成与被配置为承载多根光纤的对准模块对准放置。 当光子集成电路与对准模块对准时，光纤放置在与光子集成电路的各个波导光学对准的位置。

公开(公告)号：WO2018035108A1

公开(公告)日：2018-02-22

申请号：PCT/US2017/046918

申请日：2017-08-15

Applicant: SAMTEC INC.

Inventor： PARKES, Liam ,  ZBINDEN, Eric ,  GUETIG, Keith ,  SHAH, Jignesh, H. ,  BARNETT, Jean Karlo, Wiliams ,  FAITH, Chadrick, Paul ,  BETTMAN, R., Brad

IPC: H01R13/639 ,  G02B6/42 ,  H01R13/629

Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.

Abstract translation: 互连系统包括可在接合位置和脱离位置之间移动的各种防退出闩锁。 当处于接合位置时，防退出闩锁可以被配置为防止诸如光收发器的互连模块从主模块变得不配对。 当处于分离位置时，防退出闩锁允许互连模块从主模块变成未配对的。 还公开了将散热片固定到互连模块的模块外壳上的采购成员。