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    DATA COMMUNICATION LINE AND CONNECTOR
    4.
    发明申请
    DATA COMMUNICATION LINE AND CONNECTOR 审中-公开

    公开(公告)号：WO2022256671A1

    公开(公告)日：2022-12-08

    申请号：PCT/US2022/032191

    申请日：2022-06-03

    Applicant: SAMTEC, INC.

    Inventor： EPITAUX, Marc ,  HALL III, Thomas, Albert

    IPC: H01R13/646 ,  H01R24/38 ,  H01P3/16 ,  H01R13/6581

    Abstract: A data communication connector can include a dielectric waveguide that extends along a central axis, and a recess that is configured to receive an antenna. The data communication connector can include an electrically conductive body that receives the dielectric waveguide. The electrically conductive body can define the recess. The dielectric waveguide can include a dielectric core, a ground shield, and a jacket.

    OPTICAL TRANSCEIVER
    5.
    发明申请
    OPTICAL TRANSCEIVER 审中-公开
    光收发器

    公开(公告)号：WO2017132481A1

    公开(公告)日：2017-08-03

    申请号：PCT/US2017/015293

    申请日：2017-01-27

    Applicant: SAMTEC INC.

    Inventor： EPITAUX, Marc ,  NIGHTINGALE, John, L.

    IPC: G02B6/42 ,  G02B6/293 ,  G02B6/02 ,  G02B6/06

    CPC classification number: G02B6/4284 ,  G02B6/3518 ,  G02B6/4214 ,  G02B6/4226 ,  G02B6/4246

    Abstract: An optical transceiver can include a transmitter having a photonic integrated circuit, and a receiver having a current-to-voltage converter and a photodetector in electrical communication with the current-to-voltage converter and separate from the photonic integrated circuit. Each of the transmitter and the receiver can include an interconnect member that includes first and second optical paths for the propagation of optical transmit signals and optical receive signals, respectively. The interconnect members of the transmitter and receiver can further define electrical paths that are configured to connect to an underlying substrate at one end, and the transmitter and receiver, respectively. The interconnect members can be separate from each other or can define a single monolithic interconnect member.

    Abstract translation: 光收发器可以包括具有光子集成电路的发射器，以及具有电流 - 电压转换器和光电检测器的接收器，所述电流 - 电压转换器和光电检测器与电流 - 电压转换器电通信并且与 光子集成电路。 发射器和接收器中的每一个可以包括互连构件，该互连构件包括分别用于传输光发射信号和光接收信号的第一和第二光路。 发射器和接收器的互连构件可以进一步限定被配置为一端连接到下面的衬底以及发射器和接收器的电路径。 互连部件可以彼此分离或者可以限定单个单体互连部件。

    INTERCONNECT ALIGNMENT SYSTEM AND METHOD
    7.
    发明申请
    INTERCONNECT ALIGNMENT SYSTEM AND METHOD 审中-公开

    公开(公告)号：WO2022212604A1

    公开(公告)日：2022-10-06

    申请号：PCT/US2022/022686

    申请日：2022-03-30

    Applicant: SAMTEC, INC.

    Inventor： CORONATI, John ,  EPITAUX, Marc ,  GORE, Brandon Thomas

    IPC: H01L23/00

    Abstract: An interconnection system includes a mating substrate that is configured to be placed in electrical communication with a main board along an insertion direction so as to define a separable interface. The interconnection system is configured to align the mating substrate with the main board along first and second transverse directions that are perpendicular to each other and to the insertion direction.

    OPTICAL INTERPOSER
    8.
    发明申请
    OPTICAL INTERPOSER 审中-公开

    公开(公告)号：WO2019152990A1

    公开(公告)日：2019-08-08

    申请号：PCT/US2019/016649

    申请日：2019-02-05

    Applicant: SAMTEC INC.

    Inventor： EPITAUX, Marc ,  CORONATI, John

    IPC: G02B6/42

    Abstract: Waveguides of optically transparent interposers are adiabatically coupled to respective waveguides of photonic integrated circuits that are mounted to the optically transparent interposers. In particular, photonic integrated circuits can be mounted to an interposer that has both optical connections and electrical connections. The optical connections of the interposer can be adiabatically coupled to the photonic integrated circuit. The electrical connections can be connected to the photonic integrated circuit and to a host board that also supports an ASIC.

    OPTICAL TRANSCEIVER HAVING ALIGNMENT MODULE
    9.
    发明申请
    OPTICAL TRANSCEIVER HAVING ALIGNMENT MODULE 审中-公开
    具有对准模块的光收发器

    公开(公告)号：WO2018081340A1

    公开(公告)日：2018-05-03

    申请号：PCT/US2017/058402

    申请日：2017-10-26

    Applicant: SAMTEC INC.

    Inventor： EPITAUX, Marc ,  ZBINDEN, Eric ,  NIGHTINGALE, John, L.

    IPC: G02B6/36

    CPC classification number: G02B6/423 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/4246 ,  G02B6/4249

    Abstract: An optical transceiver includes a photonic integrated circuit that is configured to be placed in alignment with an alignment module that is configured to carry a plurality of optical fibers. When the photonic integrated circuit is aligned with the alignment module, the optical fibers are placed in optical alignment with respective waveguides of the photonic integrated circuit.

    Abstract translation: 光收发器包括光子集成电路，该光子集成电路被配置成与被配置为承载多根光纤的对准模块对准放置。 当光子集成电路与对准模块对准时，光纤放置在与光子集成电路的各个波导光学对准的位置。

    OPTICAL MODULE INCLUDING SILICON PHOTONICS CHIP AND COUPLER CHIP
    10.
    发明申请
    OPTICAL MODULE INCLUDING SILICON PHOTONICS CHIP AND COUPLER CHIP 审中-公开
    光学模块，包括硅胶片和耦合芯片

    公开(公告)号：WO2016145310A1

    公开(公告)日：2016-09-15

    申请号：PCT/US2016/022006

    申请日：2016-03-11

    Applicant: SAMTEC, INC.

    Inventor： EPITAUX, Marc ,  CORNELIUS, Joshua, Rajiv ,  NIGHTINGALE, John, L.

    IPC: G02B6/122

    CPC classification number: G02B6/4292 ,  G02B6/12007 ,  G02B6/1228 ,  G02B6/124 ,  G02B6/138 ,  G02B6/2938 ,  G02B6/3652 ,  G02B6/4214 ,  G02B6/428

    Abstract: An optical module includes a waveguide interconnect that transports light signals; a Silicon Photonics chip that modulates the light signals, detects the light signals, or both modulates and detects the light signals; a coupler chip attached to the Silicon Photonics chip and the waveguide interconnect so that the light signals are transported along a light path between the Silicon Photonics chip and the waveguide interconnect; and one of the Silicon Photonics chip and the coupler chip includes first, second, and third alignment protrusions. The other of the coupler chip and the Silicon Photonics chip includes a point contact, a linear contact, and a planar contact. The point contact provides no movement for the first alignment protrusion. The linear contact provides linear movement for the second alignment protrusion. The planar contact provides planar movement for the third alignment protrusion.

    Abstract translation: 光学模块包括传输光信号的波导互连; 调制光信号的硅光子芯片，检测光信号，或调制并检测光信号; 连接到硅光子芯片和波导互连的耦合器芯片，使得光信号沿着硅光子芯片和波导互连之间的光路传输; 并且其中一个硅光子芯片和耦合器芯片包括第一，第二和第三对准突起。 耦合器芯片和硅光子芯片中的另一个包括点接触，线性接触和平面接触。 点接触不提供第一对准突起的移动。 线性接触为第二对准突起提供线性运动。 平面接触为第三对准突起提供平面运动。

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