Abstract:
A method of metalizing the surface of a plastic substrate is provided. The plastic substrate contains a plastic material and a promoter dispersed in the plastic material. The method comprises the steps of: removing the plastic material of the plastic substrate in a predetermined area to be metalized to expose the promoter; forming a first metal layer on the exposed promoter by means of a first plating; and forming at least one second metal layer on the first metal layer by means of a second plating, in which the promoter is at least one selected from the group consisting of: CuFe 2 O 4−δ , Ca 0.25 Cu 0.75 TiO 3−β , and TiO 2−σ , in which 0.05≤δ≤0.8, 0.05≤β≤0.5, and 0.05≤σ≤1.0. Further, a plastic article obtainable by the method of metalizing the surface of a plastic substrate is also provided.
Abstract translation:提供了塑料基板的表面金属化方法。 塑料基材含有分散在塑料材料中的塑料材料和促进剂。 该方法包括以下步骤:在要金属化的预定区域中去除塑料基板的塑料材料以暴露启动子; 通过第一次镀覆在暴露的助催化剂上形成第一金属层; 以及通过第二镀层在所述第一金属层上形成至少一个第二金属层,其中所述助催化剂是选自由以下组成的组中的至少一种:CuFe2O4-d,Ca0.25Cu0.75TiO3-β和TiO2- s,其中0.05 = d = 0.8,0.05 =ß= 0.5,0.05 = s = 1.0。 此外,还提供了通过使塑料基板的表面金属化的方法获得的塑料制品。
Abstract:
A method for metalizing a plastic surface is provided. The method may comprise the steps of: 1) gasifying the plastic surface to expose the chemical plating promoter; 2) chemical plating a layer of copper or nickel on the plastic surface, and 3) plating the plated surface in step 2) by electroplating or chemical plating at least one more time to form a metalized layer on the plastic surface. Further, A method for preparing a plastic article and a plastic article manufactured by the method as described may be provided.
Abstract:
A method for preparing a plastic article and a plastic article made using the same are provided. The method comprises steps of: providing a plastic substrate made from a plastic comprising an accelerator dispersed therein; irradiating a predetermined area on a surface of the plastic substrate to expose the accelerator in the predetermined area; plating the irradiated area on the surface of the plastic substrate to form a first metal layer on the predetermined area; and plating the first metal layer to form a second metal layer on the first metal layer. The accelerator is represented by formulas of AM x B y O z and/or A'M' m O n .
Abstract:
Disclosed is a method for metallizing a plastic surface. The method may comprise the steps: 1) gasifying the plastic surface to expose the electroless plating promoter; and 2) electroless plating a layer of copper or nickel on the plastic surface, followed by electroplating or a second electroless plating to form a metallized layer on the plastic surface. Further, disclosed are a method for preparing a plastic article and a plastic article as manufactured by the method as described.
Abstract:
Metalized plastic substrate and methods of producing the same are provided herein. The method includes providing a plastic having at least one accelerator dispersed in the plastic. The accelerator/s have a formula AM x B y O z , in which A is one or more elements selected from groups 10 and 11 of the Element Periodic Table; M is one or more metal elements in three plus selected from the group consisting of Fe, Co, Mn, Al, Ga, In, TI, and rare earth elements; and O is oxygen; and x=0-2, y=0.01-2; z=1-4; and the accelerator/s further have an alternative formula A'M' m O n , in which A' is one or more elements selected from groups 9, 10, and 11 of the periodic table; M' is one or more elements selected from the group consisting of Cr, Mo, W, Se, Te, and Po; and O is oxygen; and m=0.01-2; n=2-4. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the irradiated surface, and then plating the first metal layer to form at least a second metal layer.
Abstract translation:金属化塑料基材及其制备方法。 该方法包括提供一种具有分散在塑料中的至少一种促进剂的塑料。 加速器具有公式AM x B y O z,其中A是选自元素周期表的组10和11的一种或多种元素; M是选自Fe,Co,Mn,Al,Ga,In,TI和稀土元素中的三种加成中的一种或多种金属元素; 和O是氧; x = 0-2,y = 0.01-2; Z = 1-4; 并且加速剂进一步具有另外的式A'M'm O n,其中A'是选自元素周期表第9,10和11族的一种或多种元素; M'是选自Cr,Mo,W,Se,Te和Po中的一种或多种元素; 和O是氧; m = 0.01-2; N = 2-4。 该方法包括照射塑料基板的表面以暴露至少第一加速器的步骤。 该方法还包括电镀塑料基板的照射表面以在被照射的表面上形成至少第一金属层,然后电镀第一金属层以形成至少第二金属层。
Abstract:
A method for metalizing a plastic surface is provided. The method may comprise the steps of: 1) gasifying the plastic surface to expose the chemical plating promoter; 2) chemical plating a layer of copper or nickel on the plastic surface, and 3) plating the plated surface in step 2) by electroplating or chemical plating at least one more time to form a metalized layer on the plastic surface. Further, A method for preparing a plastic article and a plastic article manufactured by the method as described may be provided.
Abstract:
The present invention discloses a low-dielectric resin composition, a low-dielectric resin/metal composite material and a preparation method thereof, and an electronic device. The resin composition comprises, based on 100% by weight of the resin composition: 45-70 wt% of a base resin, 20-45 wt% of a chopped glass fiber, 1-3 wt% of a toughening resin, 0.2-0.5 wt% of an unmodified glycidyl methacrylate, and 0-10 wt% of an auxiliary. The base resin is selected from the PBT resin and/or the PPS resin. The chopped glass fiber has a dielectric constant of 4.0 to 4.4 at 1 MHz. With the same base resin component, the dielectric constant and dielectric loss of the low-dielectric resin material prepared with the low-dielectric resin composition are significantly reduced, which is advantageous for satisfying the requirements of use of plastics for antenna channels in metal shell of an electronic device, so as to improve the ability of the electronic device having antennas to receive and transmit signals.
Abstract:
Metalized plastic substrates and a manufacturing method thereof are provided herein. The method includes providing a plastic substrate made of a plastic material, in which a plurality of accelerator particles is dispersed. The accelerator particles are made of a compound selected from the group consisting of: CuFe 2 O 4-6 , Ca 0 . 25 Cu 0.75 TiO 3-² , and TiO 2-à , and ´, ², à is deemed to be 0.05‰¤´‰¤0.8, 0.05‰¤²‰¤0.5, and 0.05‰¤Ã‰¤1.0. The method includes the step of removing plastic material in a determined area of a surface of the plastic substrate. The method further includes plating the exposed surface of the plastic substrate to form a first metal layer, and then plating the first metal layer to form a second metal layer.
Abstract:
A resin composition, a metal-resin composite formed with the resin composition and a metal substrate and a preparation method and use thereof, and an electronic product shell using the resin composition are provided. The resin composition comprises a base resin, a modified resin and a fiber, wherein the base resin is one or two or more of a polyarylene sulfide resin, a polyether resin, and a polyester resin, and the modified resin has a melting point that is 3-24°C higher than the glass transition temperature of the base resin.