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公开(公告)号：DE69001349D1
公开(公告)日：1993-05-19
申请号：DE69001349
申请日：1990-10-15
Applicant: SOLVAY
Inventor： TYTGAT DANIEL , MAGNUS STEFAAN
Abstract: Baths for chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, phosphoric acid and tetraborate ions.
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Patent Agency Ranking
公开(公告)号：AT88223T
公开(公告)日：1993-04-15
申请号：AT90202734
申请日：1990-10-15
Applicant: SOLVAY
Inventor： TYTGAT DANIEL , MAGNUS STEFAAN
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公开(公告)号：FR2621052A1
公开(公告)日：1989-03-31
申请号：FR8713407
申请日：1987-09-25
Applicant: SOLVAY
Inventor： TYTGAT DANIEL , MAGNUS STEFAAN
Abstract: Baths for the chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, chloride ions, phosphoric acid and phosphate and hydrogenphosphate ions, in quantities adjusted so as to impart a pH of between 1.25 and 3 to the bath.
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公开(公告)号：NO884228L
公开(公告)日：1989-03-28
申请号：NO884228
申请日：1988-09-23
Applicant: SOLVAY
Inventor： TYTGAT DANIEL , MAGNUS STEFAAN
Abstract: Baths for the chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, chloride ions, phosphoric acid and phosphate and hydrogenphosphate ions, in quantities adjusted so as to impart a pH of between 1.25 and 3 to the bath.
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公开(公告)号：NO884228A
公开(公告)日：1989-03-28
申请号：NO884228
申请日：1988-09-23
Applicant: SOLVAY
Inventor： TYTGAT DANIEL , MAGNUS STEFAAN
CPC classification number: C23F3/06
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公开(公告)号：FI884332A
公开(公告)日：1989-03-26
申请号：FI884332
申请日：1988-09-21
Applicant: SOLVAY
Inventor： TYTGAT DANIEL , MAGNUS STEFAAN
Abstract: Baths for the chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, chloride ions, phosphoric acid and phosphate and hydrogenphosphate ions, in quantities adjusted so as to impart a pH of between 1.25 and 3 to the bath.
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