公开(公告)号：DK529488A

公开(公告)日：1989-03-26

申请号：DK529488

申请日：1988-09-23

Applicant: SOLVAY

Inventor： TYTGAT DANIEL ,  MAGNUS STEFAAN

IPC: C23F3/00 ,  C23F3/06 ,  C23F1/18

Abstract: Baths for the chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, chloride ions, phosphoric acid and phosphate and hydrogenphosphate ions, in quantities adjusted so as to impart a pH of between 1.25 and 3 to the bath.

公开(公告)号：FI905229A0

公开(公告)日：1990-10-24

申请号：FI905229

申请日：1990-10-24

Applicant: SOLVAY & CIE SOCIETY ANONYME

Inventor： TYTGAT DANIEL ,  MAGNUS STEFAAN

IPC: C23F1/18 ,  C23F3/06 ,  C23G

Abstract: Baths for chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, phosphoric acid and tetraborate ions.

公开(公告)号：NO884228D0

公开(公告)日：1988-09-23

申请号：NO884228

申请日：1988-09-23

Applicant: SOLVAY

Inventor： TYTGAT DANIEL ,  MAGNUS STEFAAN

IPC: C23F3/00 ,  C23F3/06 ,  C23F1/18 ,  C23G1/00

Abstract: Baths for the chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, chloride ions, phosphoric acid and phosphate and hydrogenphosphate ions, in quantities adjusted so as to impart a pH of between 1.25 and 3 to the bath.

公开(公告)号：NO904579A

公开(公告)日：1991-04-25

申请号：NO904579

申请日：1990-10-23

Applicant: SOLVAY

Inventor： TYTGAT DANIEL ,  MAGNUS STEFAAN

IPC: C23F1/18 ,  C23F3/06

CPC classification number: C23F3/06

公开(公告)号：NO904579D0

公开(公告)日：1990-10-23

申请号：NO904579

申请日：1990-10-23

Applicant: SOLVAY

Inventor： TYTGAT DANIEL ,  MAGNUS STEFAAN

IPC: C23F1/18 ,  C23F3/06 ,  C09G

Abstract: Baths for chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, phosphoric acid and tetraborate ions.

公开(公告)号：BR8804929A

公开(公告)日：1989-05-02

申请号：BR8804929

申请日：1988-09-23

Applicant: SOLVAY

Inventor： TYTGAT DANIEL ,  MAGNUS STEFAAN

IPC: C23F3/00 ,  C23F3/06

Abstract: Baths for the chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, chloride ions, phosphoric acid and phosphate and hydrogenphosphate ions, in quantities adjusted so as to impart a pH of between 1.25 and 3 to the bath.

公开(公告)号：NO904579L

公开(公告)日：1991-04-25

申请号：NO904579

申请日：1990-10-23

Applicant: SOLVAY

Inventor： TYTGAT DANIEL ,  MAGNUS STEFAAN

IPC: C23F1/18 ,  C23F3/06

Abstract: Baths for chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, phosphoric acid and tetraborate ions.

公开(公告)号：CA2028195A1

公开(公告)日：1991-04-25

申请号：CA2028195

申请日：1990-10-22

Applicant: SOLVAY

Inventor： TYTGAT DANIEL ,  MAGNUS STEFAAN

IPC: C23F1/18 ,  C23F3/06 ,  C23G1/10

Abstract: Bains et procéde pour le polissage chimique de surfaces en cuivre ou en alliage de cuivre Bains pour le polissage chimique de surfaces en cuivre ou en alliage de cuivre, comprenant, en solution aqueuse, du peroxyde d'hydrogène, de l'acide phosphorique et des ions tétraborate. Pas de figure.

公开(公告)号：DK529488D0

公开(公告)日：1988-09-23

申请号：DK529488

申请日：1988-09-23

Applicant: SOLVAY

Inventor： TYTGAT DANIEL ,  MAGNUS STEFAAN

IPC: C23F3/00 ,  C23F3/06 ,  C23F1/18

Abstract: Baths for the chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, chloride ions, phosphoric acid and phosphate and hydrogenphosphate ions, in quantities adjusted so as to impart a pH of between 1.25 and 3 to the bath.

公开(公告)号：FI884332A0

公开(公告)日：1988-09-21

申请号：FI884332

申请日：1988-09-21

Applicant: SOLVAY

Inventor： TYTGAT DANIEL ,  MAGNUS STEFAAN

IPC: C23F3/00 ,  C23F3/06 ,  C23F

Abstract: Baths for the chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, chloride ions, phosphoric acid and phosphate and hydrogenphosphate ions, in quantities adjusted so as to impart a pH of between 1.25 and 3 to the bath.