公开(公告)号：CA1060283A

公开(公告)日：1979-08-14

申请号：CA241524

申请日：1975-12-11

Applicant: SONY CORP

Inventor： MAKINO YOSHIMI ,  UEDAIRA SATORU ,  ITO SHIGEYASU

IPC: C22F1/14 ,  C21D6/00 ,  C22B34/32 ,  C22C5/02 ,  C22C27/00 ,  C23C10/00 ,  C23C10/28 ,  C23C14/16 ,  C23C14/58 ,  C25D5/00 ,  C25D5/50 ,  H01F1/04 ,  C23C9/00

Abstract: A method of making a substantially ordered alloy which involves providing a metal base consisting of at least one of the ingredients of the desired alloy, depositing a thin metal layer on the base, the metal layer containing the remaining constituents of the desired alloy, and heating the metal base and the deposited metal layer at a temperature below the order disorder transformation temperature of the ordered alloy to be formed to thereby cause the ordered alloy to be produced by diffusion. -i-

公开(公告)号：DE2839626A1

公开(公告)日：1979-03-22

申请号：DE2839626

申请日：1978-09-12

Applicant: SONY CORP

Inventor： ASO KOICHI ,  UEDAIRA SATORU ,  ITO SHIGEYASU ,  TAMURA HIDEMASA ,  MAKINO YOSHIMI

IPC: C22C45/02 ,  G11B5/127 ,  G11B5/147 ,  H01F1/153 ,  C22C38/00

公开(公告)号：DE2505827A1

公开(公告)日：1975-08-14

申请号：DE2505827

申请日：1975-02-12

Applicant: SONY CORP

Inventor： MAKINO YOSHIMI ,  ITO SHIGEYASU

IPC: G11B5/706 ,  C09D5/23 ,  C09D7/12 ,  C22C5/00 ,  C22C5/04 ,  C22C19/03 ,  G03G5/16 ,  H01F1/04 ,  H01F1/047

Abstract: Magnetic alloy containing platinum, cobalt and nickel is disclosed which is suitable for use with magnetic recording medium, especially for use with an intermediate magnetic recording medium in thermo and magneto printing.

公开(公告)号：JP2003011314A

公开(公告)日：2003-01-15

申请号：JP2001200510

申请日：2001-07-02

Applicant: Sony Corp ,  ソニー株式会社

Inventor： ITO SHIGEYASU ,  OGAWA MINORU

IPC: B32B37/10 ,  H05K3/46 ,  B32B31/20

Abstract: PROBLEM TO BE SOLVED: To provide a lamination apparatus which can form a sharp temperature gradient in the thickness direction of a laminate and a method for laminating thermoplastic printed boards which does not cause the dimensional change of the boards and the deformation of a wiring pattern when the boards are laminated. SOLUTION: In the lamination apparatus 1 installed in a vacuum chamber 2, the thermoplastic printed boards 51 and 52 of syndiotactic polystyrene (SPS) are held between a lower holding block 11 comprising an infrared transmissible cooling holder 12 in which cooling water 18 flows between upper and lower silica glass plates 17 and an infrared lamp 14 located outside the holder 12 and a similar upper holding block 21, heated, and pressed to be fusion-bonded and laminated. In this process, the lamination surfaces M are heated at a temperature equal to or above the melting point of the SPS, the contact surfaces C with the cooling holders 12 and 22 are kept at a temperature not exceeding the second order transition point of the SPS, and the holding distance G, set at a prescribed value, is kept constant.

Abstract translation: 要解决的问题：提供一种能够在层叠体的厚度方向上形成尖锐的温度梯度的层压装置以及不会导致板的尺寸变化和布线图案的变形的热塑性印刷板的层压方法， 板被层压。 解决方案：在安装在真空室2中的层压装置1中，间同立构聚苯乙烯（SPS）的热塑性印刷电路板51和52保持在包括红外透射冷却保持器12的下保持块11之间，其中冷却水18在上方 并且将下部石英玻璃板17和位于保持器12外部的红外灯14和类似的上部保持块21加热并压制成熔接和层压。 在该过程中，层叠面M在SPS的熔点以上的温度下加热，与冷却保持件12,22的接触面C保持在不超过SPS的二阶转变点的温度 并且设定在规定值的保持距离G保持恒定。

公开(公告)号：JP2002290029A

公开(公告)日：2002-10-04

申请号：JP2001087661

申请日：2001-03-26

Applicant: SONY CORP

Inventor： KONDO SHINJI ,  ITO SHIGEYASU

IPC: H05K3/40 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method capable of forming a circuit pattern of higher accuracy than usual and a wiring board manufactured thereby. SOLUTION: This wiring board manufacturing method comprises a first process of providing through-holes 1c to a sintered board 1 and wiring pattern grooves 1a and 1b to both the surfaces of the sintered board 1, a second process of filling the through-holes 1c and the wiring pattern grooves 1a and 1b with conductive paste M, and a third process of curing the conductive paste M.

公开(公告)号：JP2002261444A

公开(公告)日：2002-09-13

申请号：JP2001061254

申请日：2001-03-06

Applicant: SONY CORP

Inventor： ITO SHIGEYASU

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To obtain a laminated wiring board that can be manufactured by collectively laminating single wiring boards upon each other while the collapse of pattern via holes caused by a flowing resin is prevented. SOLUTION: Each single wiring board carrying a wiring pattern and having through holes is constituted in a multilayer structure of two kinds of thermoplastic resins and the melting point of a layer 2 (thermoplastic resin) constituting at least one surface is made lower than that of the other layer 1 (thermoplastic resin). At the time of laminating the wiring boards upon another, one wiring board is bonded to another single wiring board by thermally melting the layer 2.

公开(公告)号：JP2001257448A

公开(公告)日：2001-09-21

申请号：JP2000066474

申请日：2000-03-10

Applicant: SONY CORP

Inventor： ITO SHIGEYASU ,  IZUMI MASAHIRO ,  OGAWA MINORU

IPC: H05K3/04

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing printed wiring boards, which needs no special facility such as large-scale facility or facility for waste liquid processing and by which printed wiring boards exhibiting necessary mounting properties can be obtained, and to provide such printed wiring boards. SOLUTION: Resin sheets 13 of thermosetting resin are placed on both sides of a core substrate 14 and sheets of copper foil 12 are placed on the outside of the resin sheets 13. Two SUS boards 15 are sandwiched between an upper mold 16 and a lower mold 17 and are pressed. When the SUS boards 15 are pressed by the upper mold 16, protrusions 11a of a mold 11 are engaged in the copper foil 12, and the engaged copper foil 12 is embedded in the resin sheet 13 under the copper foil 12. The copper foil 12 is bonded to the core substrate 14 while being embedded in the resin sheet 13.

公开(公告)号：JPH09186430A

公开(公告)日：1997-07-15

申请号：JP34415795

申请日：1995-12-28

Applicant: SONY CORP

Inventor： KUZE YASUO ,  NAKAMURA EMI ,  ITO SHIGEYASU

IPC: H05K3/34 ,  H05K3/18 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To obtain a printed wiring board in which connection with an electronic device can be carried out well even when the wiring circuit pattern is formed with fine pitch by preventing the forming position of land from being shifted. SOLUTION: An outermost wiring circuit pattern 3 is provided, at a specified position thereof, with a resist layer 5 having an opening 4a of specified shape for partially exposing the wiring circuit pattern 3 and the opening 4a is plated, on the inside thereof, with a conductive material to form a land 6a. The wiring circuit pattern 3 is preferably formed by additive method. The resist layer 5 is preferably formed by exposing and developing a photoresist.

公开(公告)号：JP2003229663A

公开(公告)日：2003-08-15

申请号：JP2002028235

申请日：2002-02-05

Applicant: SONY CORP ,  MITSUBISHI PLASTICS IND

Inventor： OGAWA MINORU ,  IZUMI MASAHIRO ,  ITO SHIGEYASU ,  YAMADA SHINGETSU ,  SUZUKI HIDEJI ,  KUROSAKI NORIO

IPC: C08J5/18 ,  C08L71/10 ,  C08L79/08 ,  H01L23/12 ,  H01L23/14 ,  H05K1/03 ,  H05K1/09 ,  H05K3/04 ,  H05K3/10 ,  H05K3/20 ,  H05K3/22 ,  H05K3/40 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a multilayered wiring board which has a high heat resistance, can be welded at a low temperature, is suitably applied to such a manufacturing mode as the small-scale many-kind production, and is reduced in environmental load and on which highly precise wiring can be formed with high accuracy, and to provide a semiconductor device mounting substrate using the wiring board and a method of manufacturing the wiring board. SOLUTION: In the multilayered wiring board, wiring circuit forming groove sections 12 and via holes 13 are formed in an insulating substrate 1 composed of a thermosetting resin composition containing a polyarylketone resin having a peak crystalline melting point of ≥260°C and an amorphous polyether imide resin as main components. In addition, metal foil 14 is buried in the groove sections 12 in a state where the surface of the foil 14 is exposed and a conductive material 15 prepared by hardening conductive paste is packed in the via holes 13. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2003218491A

公开(公告)日：2003-07-31

申请号：JP2002012934

申请日：2002-01-22

Applicant: SONY CORP

Inventor： ITO SHIGEYASU

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To prevent separation of conductive paste filled in a viahall by increasing adhesion strength of conductive paste and the interior wall of the viahall. SOLUTION: Openings are formed for forming viahall 5 to a thermoplastic resin film 2 containing the air bubble 2a, and a concavity portion 6 is formed by exposing the air bubble 2a on the interior wall of the viahall 5. COPYRIGHT: (C)2003,JPO