公开(公告)号：JPH08139443A

公开(公告)日：1996-05-31

申请号：JP29600394

申请日：1994-11-07

Applicant: ASAHI CHEM RES LAB ,  SONY CORP

Inventor： MATSUDA YOSHINARI ,  IWASA SANDAI ,  OBA YOICHI ,  ENOKIDO MASAFUMI

IPC: H05K1/09 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40

Abstract: PURPOSE: To increase the part terminal junction strength by a method wherein a metallic paste using a specific amount of resin in a specific component of conductive metallic particles and the soldering property enhancing agent is applied and set so as to form a metal containing film. CONSTITUTION: After coating the part insertion hole of a printed-board with a metallic paste to be thermoset, a solderable metal containing film 13 is formed over the wall surface of the part insertion hole to insert a part terminal 6 to solder 5 a part.

公开(公告)号：JP2002033570A

公开(公告)日：2002-01-31

申请号：JP2000221072

申请日：2000-07-17

Applicant: SONY CORP

Inventor： MATSUDA YOSHINARI

IPC: H05K3/28 ,  H05K1/11 ,  H05K3/40

Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board which enables an operator to visually and easily inspect the outward appearance of a conductor like conductive paste and serves even to make a symbol display and a manufacturing method for the printed wiring board. SOLUTION: A first conductor pattern 20 and a second conductor pattern 22 provided on the top surface of a base material 10A by using conductors formed by using conductive paste 30 are electrically connected, and at least the conductors are covered with an overcoat resist film 40 formed by using photosetting ink obtained by mixing a given amount of white pigment with epoxy resin.

公开(公告)号：JP2000223267A

公开(公告)日：2000-08-11

申请号：JP2251999

申请日：1999-01-29

Applicant: SONY CORP

Inventor： KOTAKE RYOTA ,  ASAI NOBUTOSHI ,  MATSUDA YOSHINARI ,  SUZUKI YOSHIO

IPC: G09F9/30 ,  G09F9/00 ,  G09G3/10 ,  H01L27/32 ,  H01L51/50 ,  H01L51/52 ,  H05B33/04 ,  H05B33/06 ,  H05B33/12 ,  H05B33/14

Abstract: PROBLEM TO BE SOLVED: To provide an organic thin film electroluminescent(EL) element provided with wiring capable of reducing a non-displaying area and restraining the occurrence of migration when multiple display panels are used as one image plane. SOLUTION: This element 50 is composed by laminating a display material and electrodes 52, 57. In this case, a drive circuit connected to the electrodes 52, 57 is arranged inside a sealing member 30 covering the back surface of the flat display element 50, and wires 31, 70 for connecting a power circuit and a signal feeding circuit to the drive circuit are led from the inside of the sealing member 30 to the rear side of the flat display element 50.

公开(公告)号：JP2000150173A

公开(公告)日：2000-05-30

申请号：JP1481199

申请日：1999-01-22

Applicant: SONY CORP

Inventor： KOTAKE RYOTA ,  ASAI NOBUTOSHI ,  MATSUDA YOSHINARI ,  MATSUZAKI ATSUSHI ,  SUZUKI YOSHIO

IPC: G09G3/20 ,  G02F1/1335 ,  G02F1/13357 ,  G09F9/33 ,  G09F9/40 ,  G09G3/30 ,  H01L51/50 ,  H05B33/12 ,  H05B33/14 ,  H05B33/26

Abstract: PROBLEM TO BE SOLVED: To homogenize a display characteristic such as gradation and color reproductivity at the right and left, and the upper and lower ends of a display screen. SOLUTION: This device has a glass substrate 11, n-rows of stripe type column electrodes Y1 to Y640 arrayed on the glass substrate 11 in a row direction, white light emitting EL elements 12 arrayed on the entire surface of the column electrodes Y1 to Y640, and m-columns of stripe type row electrodes X1 to X480 arrayed on the white light emitting EL element 12 laid in a column direction orthogonal with the column electrodes Y1 to Y640. In addition, feed points are respectively provided approximately at the centers of the column electrodes Y1 to Y640 and the row electrodes X1 to X480, and drive voltage is applied from the feed points. According to this construction, a voltage drop distribution from each feed point to each end of the column electrode Y1 to Y640 can be made uniform. Similarly, a voltage drop from each feed point to each end of the row electrodes X1 to X480 can be made approximately uniform. Thus, irregular brightness can be eliminated from the right and left, and the upper and lower parts of a screen.

公开(公告)号：JPH114056A

公开(公告)日：1999-01-06

申请号：JP15321797

申请日：1997-06-11

Applicant: SONY CORP

Inventor： KONISHI MASAMI ,  MASATOKI TAMIJI ,  MATSUDA YOSHINARI

IPC: H05K1/16 ,  H05K3/24

Abstract: PROBLEM TO BE SOLVED: To provide a printing resistance printed circuit board having small variances in resistance of electrical resistance body between components and a manufacture thereof. SOLUTION: A printing resistance printed circuit board has two circuit wirings 14A, 14B made of copper foil on an electrically insulating substrate 12 and an electrical resistance body 22 formed by printing with resisting paste for electrically connecting two circuit wirings 14A, 14B. Silver-plated layers 20A, 20B are made between the copper foil wiring and the electrical resistance body, so as to improve electrical connection by preventing the oxidation of the copper foil. Preferably, the silver-plated layers 20A, 20B are made by electroless silver-plating.

公开(公告)号：JPH09298349A

公开(公告)日：1997-11-18

申请号：JP11487096

申请日：1996-05-09

Applicant: SONY CORP

Inventor： MATSUDA YOSHINARI

IPC: H05K1/09 ,  H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/24 ,  H05K3/34 ,  H05K3/44

Abstract: PROBLEM TO BE SOLVED: To provide a metal base printed wiring board at a low cost wherein heat dissipating performance is excellent and both electronic components for insertion and surface mount can be easily mounted. SOLUTION: This metal base printed wiring board is provided with an electric insulating layer 24 and an electrode layer 26 which are laminated in order on a metal plate 20, an insertion hole 12 which penetrates the metal plate 20, the electric insulating layer 24 and the electrode layer 26 and whose inner surface is formed of an electric insulating wall 30, and a metal paste layer 34 which is formed on an end surface of the electric insulating wall 30 of the electrode layer 26 side of the insertion hole 12 and has conductivity and solder wettability. Since the metal paste layer 34 is formed, a space between a lead terminal of the electronic component and the electrode layer 26 is surely bonded with solder at the time of mounting insertion type electronic component, and the insertion type electronic component can be mounted on a printed wiring board with high reliability.

公开(公告)号：JPH08116153A

公开(公告)日：1996-05-07

申请号：JP27433794

申请日：1994-10-14

Applicant: SONY CORP ,  HITACHI CHEMICAL CO LTD

Inventor： MATSUDA YOSHINARI ,  MIKAMI YOSHIKATSU ,  SAKUMA KAZUNORI ,  UEHARA TOSHISHIGE

IPC: H05K3/34 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30

Abstract: PURPOSE: To enable high density mounting of a surface mounting part which is miniaturized. CONSTITUTION: The title printed board is constituted of a board electrode whereon various circuit elements are surface-mounted, a board wherein an aperture 2a for inserting a lead terminal of a lead part is formed and a sheet member 4 wherein an aperture 4a is formed at a position corresponding to the aperture 2a of the board, and it is constituted by forming adhesion layers 3, 3, 3,... in advance in a specified position of the board and covering a surface wherein the adhesion layer 3 is formed with the sheet member 4. A printed board is manufactured to mount a surface mounting part to be mounted on a printed board by flow soldering after the sheet member 4 is peeled and temporarily fixed to the adhesion layer 3.

公开(公告)号：JP2003204016A

公开(公告)日：2003-07-18

申请号：JP2002002791

申请日：2002-01-09

Applicant: SONY CORP

Inventor： KAYABA MASAO ,  ORUI KEN ,  MATSUDA YOSHINARI ,  SANWO IKUO JIMMY

IPC: H01L23/12 ,  H01L23/31 ,  H01L23/552 ,  H01L23/64 ,  H05K1/02 ,  H05K1/16

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device capable of securing signal integrity even at the time of a high-speed operation and the manufacturing method, an interposer substrate used in the semiconductor device and the manufacturing method, and a printed circuit board composed by mounting the semiconductor device and the manufacturing method, at low cost without obstructing the miniaturization of the semiconductor device. SOLUTION: On the interposer substrate 29, wiring 28 connecting a connection part 8 with an output terminal 6 of a semiconductor chip 5 and an external connection terminal 13 is formed. In the wiring 28, a thin film resistor 27 is formed by a plating method. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2001313181A

公开(公告)日：2001-11-09

申请号：JP2000132075

申请日：2000-05-01

Applicant: SONY CORP

Inventor： KOTAKE RYOTA ,  MATSUDA YOSHINARI

IPC: G02F1/1345 ,  G09F9/30 ,  H01L51/50 ,  H05B33/10 ,  H05B33/12 ,  H05B33/14 ,  H05B33/26

Abstract: PROBLEM TO BE SOLVED: To provide a display device with a display surface of which, efficiency and reliability are improved. SOLUTION: For the display device 1 having a self-illumination display element or a reflection display element, a display element is formed on one surface of a substrate 2, and wiring patterns 6, connected to the display element and supplying driving signal, are formed on the other surface. Thus, a wiring area for the display element is secured on the back surface of the substrate 2, and non-displaying area is narrowed to the utmost, further, the wiring patterns 6 can be formed and connected without adding any excessive stress of heat and pressure to the display element.

公开(公告)号：JPH1134229A

公开(公告)日：1999-02-09

申请号：JP18862497

申请日：1997-07-14

Applicant: SONY CORP

Inventor： MATSUDA YOSHINARI

IPC: B32B15/08 ,  B32B15/20 ,  B32B17/04 ,  H01L21/60 ,  H05K1/09 ,  H05K3/24 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To carry out mixed loading mounting by laminating and integrating a combination metal foil obtained by applying electroplating treatment by a metal capable of bonding a solder member to the single surface of an aluminum foil and a hard org. resin base material so as to expose the single surface to which electroplating treatment is applied. SOLUTION: A metal foil laminated base material 1 is constituted by laminating and integrating a combination metal foil 4 having a copper clad surface 3 formed on the single surface of an aluminum foil 2, for example, by thin electrolytic copper plating treatment and a hard org. resin base material 5 so as to expose the copper clad surface 3 and produced by laminating the aluminum foil 2 and the hard org. resin base material 5 to integrate them and immersing the integrated laminated base material in a plating soln., for example, an integrated laminated base material state to apply thin electrolytic copper plating treatment thereto. By this constitution, the metal foil laminated base material 1 possible in mixed loading mounting can be inexpensively produced by a simple process.