公开(公告)号：DE60140397D1

公开(公告)日：2009-12-24

申请号：DE60140397

申请日：2001-04-06

Applicant: SONY CORP

Inventor： SUZUKI YOSHIO ,  MATSUDA YOSHINARI

IPC: H01L27/15 ,  H01L51/50 ,  G09F9/00 ,  G09F9/30 ,  G09G3/20 ,  G09G3/30 ,  H01L27/32 ,  H05B33/12 ,  H05B33/14

Abstract: An organic EL display with a big screen can be realized, a fabrication work can be simplified, a manufacturing cost can be reduced, a periodicity with which pixels are arrayed on the whole of the screen can be maintained after the manufacturing, a picture quality can be prevented from being deteriorated due to a boundary between transparent substrates and high resolution can be realized. A plurality of organic thin-film EL elements (2) are formed on a single transparent substrate (1). Circuit substrates (5) in which driver circuits (6) for supply signals to signal electrodes and scanning electrodes of the elements (2) are mounted are closely bonded to the respective elements (2). The circuit substrate (5) is made of a material having end-sealing property and has through-holes bored at its positions opposing to the signal electrode and the scanning electrode. The through-holes are buried by a material having end-sealing property and conductivity. Signals are supplied from the driver circuit (6) to the signal electrode and the scanning electrode through the material having end-sealing property and conductivity. The organic EL element (2) is covered at its portion which is not bonded to the circuit substrate (5) by an end-sealing material. A cross-sectional side view showing an example of an arrangement of a display unit in which the organic thin-film EL element is formed as a unit.

公开(公告)号：MX2008006053A

公开(公告)日：2009-10-21

申请号：MX2008006053

申请日：2008-05-09

Applicant: SONY CORP

Inventor： MATSUDA YOSHINARI ,  RUIZ ROGELIO

IPC: H05K1/00

Abstract: Un conductor de empalme de dispositivo para montar en la superficie incluye un miembro de base y un miembro de electrodo. El miembro de base se fabrica de un laminado de resina. El miembro de electrodo se fabrica de un material eléctricamente conductor y se forma en una configuración en forma general de C para definir una abertura allí. La abertura se dimensiona para recibir el miembro de base tal que el miembro de electrodo se pliega parcialmente alrededor y se sujeta al miembro de base para retener el miembro de base en la abertura.

公开(公告)号：ES2195732A1

公开(公告)日：2003-12-01

申请号：ES200101683

申请日：2001-07-18

Applicant: SONY CORP

Inventor： MATSUDA YOSHINARI

IPC: H05K3/42 ,  H05K1/02 ,  H05K1/11 ,  H05K3/38 ,  H05K3/40

Abstract: Mejoras en la resistencia de la adherencia entre pasta conductora y zonas terminales de placa de circuito impreso, y, método de fabricación de ésta. Unas zonas terminales de lámina de cobre provistas de un agujero pasante para ser llenado con una pasta de cobre están provistas de partes huecas en forma de anillo en la periferia del agujero pasante en el que la exfoliación entre la pasta de cobre y las zonas terminales de lámina de cobre ocurriría fácilmente hasta ahora, por lo que se obtiene una placa de circuito impreso por ambos lados con agujeros pasantes en el revestimiento o chapado de cobre utilizando un sustrato de papel- fenol en que la resistencia de adherencia entre las partes terminales de lámina de cobre y la pasta de cobre ha sido mejorada.

公开(公告)号：MY123457A

公开(公告)日：2006-05-31

申请号：MYPI9905836

申请日：1999-12-31

Applicant: SONY CORP

Inventor： MATSUDA YOSHINARI ,  SUZUKI YOSHIO ,  ODAKE RYOTA ,  ASAI NOBUTOSHI

IPC: G09F9/30 ,  G09F9/40 ,  H01J23/16 ,  H01L25/16 ,  H05B33/12 ,  H05B33/26 ,  H05K3/36

Abstract: DISCLOSED HEREIN ARE A VIDEO DISPLAY AND A MANUFACTURING METHOD THEREFOR, MORE PARTICULARLY, THERE IS PROVIDED A VIDEO DISPLAY INCLUDING A DISPLAY PANEL (11) HAVING A PLURALITY OF ANODES (13) AND CATHODES (15) ARRANGED ORTHOGONALLY TO EACH OTHER SO AS TO FORM GRIDS, A PRINTED WIRING BOARD (21) HAVING A DRIVE CIRCUIT WITH WIRINGS (23) FOR DRIVING THE DISPLAY PANEL AND A PLURALITY OF BUMPS (25) FOR ELECTRICALLY CONNECTING THEWIRINGS OF THE DRIVE CIRCUIT TO THE ANODES (13) AND THE CATHODES (15), AND AN ADHESIVE LAYER (17) FOR BONDING THE DISPLAY PANEL (11) AND THE PRINTED WIRING BOARD (21) TO FORM A MULTILEVEL STRUCTURE. WITH THIS STRUCTURE, A LARGE-SIZED VIDEO IMAGE WITH NO DISCONTINUITIES CAN BE DISPLAYED, AND THE THICKNESS OF THE VIDEO DISPLAY CAN ALSO BE REDUCED.(FIGURES 1A AND IB)

公开(公告)号：ES2195732B1

公开(公告)日：2005-03-01

申请号：ES200101683

申请日：2001-07-18

Applicant: SONY CORP

Inventor： MATSUDA YOSHINARI

IPC: H05K3/42 ,  H05K1/02 ,  H05K1/11 ,  H05K3/38 ,  H05K3/40

Abstract: Mejoras en la resistencia de la adherencia entre pasta conductora y zonas terminales de placa de circuito impreso, y, método de fabricación de ésta. Unas zonas terminales de lámina de cobre provistas de un agujero pasante para ser llenado con una pasta de cobre están provistas de partes huecas en forma de anillo en la periferia del agujero pasante en el que la exfoliación entre la pasta de cobre y las zonas terminales de lámina de cobre ocurriría fácilmente hasta ahora, por lo que se obtiene una placa de circuito impreso por ambos lados con agujeros pasantes en el revestimiento o chapado de cobre utilizando un sustrato de papel- fenol en que la resistencia de adherencia entre las partes terminales de lámina de cobre y la pasta de cobre ha sido mejorada.

公开(公告)号：SG77722A1

公开(公告)日：2001-01-16

申请号：SG200000066

申请日：2000-01-05

Applicant: SONY CORP

Inventor： MATSUDA YOSHINARI ,  SUZUKI YOSHIO ,  ODAKE RYOTA ,  ASAI NOBUTOSHI

IPC: G09F9/40 ,  G09F9/30 ,  H01L25/16 ,  H05B33/12 ,  H05B33/26 ,  H05K3/36 ,  H01L27/14

Abstract: Disclosed herein are a video display and a manufacturing method therefor, more particularly a video display including a display panel (11) having a plurality of anodes (13) and cathodes (15) arranged orthogonally to each other so as to form a grid, a printed wiring board (21) having a drive circuit with wirings (23) for driving the display panel (11) and a plurality of bumps (25) for electrically connecting the wirings (23) to the anodes (13) and the cathodes (15), and an adhesive layer (17) for bonding the display panel (11) and the printed wiring board (21) to form a multilayer structure. With this structure, a large-sized video image with no discontinuities can be displayed, and the thickness of the video display can also be reduced.

公开(公告)号：JP2002217553A

公开(公告)日：2002-08-02

申请号：JP2001005364

申请日：2001-01-12

Applicant: SONY CORP

Inventor： MATSUDA YOSHINARI

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a multilayer printed wring board, which can ensure strength by ensuring total thickness and control required characteristics impedance at a low cost, and to provide a manufacturing method of a multiplayer printed wiring board. SOLUTION: A multilayer printed wiring board 1, having a multilayer structure, has a core base material 10 wherein a power supply layer 12 is formed in one surface, and a ground layer 14 is formed in the other surface, a dielectric layer 30, which is formed in either the power supply layer 12 or the ground layer 14 of the core base material 10 and has relative dielectric constant of 3 or larger, a conductive layer 40 formed on the dielectric layer 30, a first prepreg layer 50 formed on the conductive layer 40, a second prepreg layer 60 formed in either the ground layer 14 or the power supply layer 12, a first conductor layer 70 formed on the first prepreg layer 50 and a second conductor layer 80 formed on the second prepreg layer 60.

公开(公告)号：JP2001092385A

公开(公告)日：2001-04-06

申请号：JP27195099

申请日：1999-09-27

Applicant: SONY CORP

Inventor： MATSUDA YOSHINARI ,  SUZUKI YOSHIO ,  KOTAKE RYOTA ,  ASAI NOBUTOSHI

IPC: G09F9/30 ,  G09F9/00 ,  H01L27/32 ,  H01L51/52 ,  H05B33/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/00 ,  H05K3/04 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board allowing circuit parts of low moisture resistance to stably operate over the long term, and a video display device capable of stably displaying a video over a long time period. SOLUTION: Through-holes 13 of a glass substrate 11 of the printed wiring board 25 are filled with a silver paste 15 using epoxy resin as a binder, and conductive patterns 24 on both surfaces of the glass substrate 11 have continuity via the silver paste 15. Therefore, it is possible to connect the circuit parts without using a dedicated plane area, and moreover, the wiring board 25 does not transmit moisture, and the moisture does not reach the circuit parts.

公开(公告)号：JP2000003785A

公开(公告)日：2000-01-07

申请号：JP16644898

申请日：1998-06-15

Applicant: SONY CORP

Inventor： MATSUDA YOSHINARI ,  SUZUKI YOSHIO

IPC: H05B33/06 ,  G09F9/30 ,  H01L21/302 ,  H01L51/50 ,  H05B33/10

Abstract: PROBLEM TO BE SOLVED: To provide the manufacture of electroluminescent display which is capable of forming image in all areas of a display surface side. SOLUTION: A thermoplastic insulating resin layer 22 is formed on or between EL elements of an image display panel having contact holes for exposing an ITO electrode layer and is hardened through heating. Contact holes for respectively exposing the ITO electrode layer and a metal electrode layer are opened. Furthermore, the contact holes are filled with the conductive paste, and hardened through heating. Continuously, a conductive pattern 26 to be connected to the conductive paste by thermosetting is formed. Thereafter, an electronic component 30 is mounted on the conductive pattern. Since the electronic component 30 is mounted on the image display panel at an EL element side, the necessity for providing a non-display area in a panel display surface side is eliminated.

公开(公告)号：JPH11101841A

公开(公告)日：1999-04-13

申请号：JP26228197

申请日：1997-09-26

Applicant: SONY CORP

Inventor： MATSUDA YOSHINARI

IPC: G01R31/02 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40

Abstract: PROBLEM TO BE SOLVED: To provide electric characteristics inspection equipment which enables simultaneously the open-short inspection of a conductive paste through hole type double-sided printed wiring board and the electric continuity resistance inspection of a through hole. SOLUTION: This equipment 30 inspects electric characteristics of a conductive paste through hole type double-sided printed wiring board which has printed wirings 72A, 72B on both surfaces of an insulating board 70, and makes electric continuity between the printed wirings 72A and 72B on both surfaces of the board, via a conductive paste layer 76 buried in a through hole 74 of the board 70. This equipment 30 is provided with an open-short inspection part 32 inspecting the open-short state of the printed wirings 72A, 72B, and an electric continuity resistance inspection part 34 measuring the electric continuity resistance value of the conductive paste through hole 74.