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公开(公告)号：JP2004172330A
公开(公告)日：2004-06-17
申请号：JP2002336016
申请日：2002-11-20
Applicant: Oki Electric Ind Co Ltd , Sony Corp , ソニー株式会社 , 沖電気工業株式会社
Inventor： MITARAI TAKASHI , NAGAHAMA TSUTOMU , HIRONAKA KATSUYUKI , SAKAI YOSHIO , IGARASHI YASUSHI
IPC: H01L27/105 , H01L21/8242 , H01L21/8246 , H01L27/108
Abstract: PROBLEM TO BE SOLVED: To provide a ferroelectric nonvolatile semiconductor memory having a stacked capacitor structure and a structure wherein a contact plug is reliably prevented from being oxidized. SOLUTION: The ferroelectric nonvolatile semiconductor memory consists of a selection transistor TR, interlayer insulating layer 16, contact plug 18A, diffusion barrier layer 20, lower electrode 21, ferroelectric layer 22 and upper electrode 23. A side wall of the lower electrode 21 is covered with a first oxygen barrier layer 40, while a second oxygen barrier layer 41 is formed on a portion of the oxygen barrier layer 40, proximate to the lower end of the lower electrode 21 and the surface of the interlayer insulating layer 16. COPYRIGHT: (C)2004,JPO
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公开(公告)号：JP2011003787A
公开(公告)日：2011-01-06
申请号：JP2009146649
申请日：2009-06-19
Inventor： SOTOZAKI MINEHIRO , MITARAI TAKASHI , TADA MASAHIRO
IPC: H05K1/18 , B81B3/00 , B81C1/00 , H01H49/00 , H01H59/00 , H01L21/3205 , H01L21/8234 , H01L23/52 , H01L27/06
Abstract: PROBLEM TO BE SOLVED: To provide a high-frequency device that can accurately align a high-frequency device having an opening in a substrate, and to provide a method of manufacturing the device.SOLUTION: A lower portion 14D of a through-electrode, an opening 16, and a projection 17 are formed in a substrate 11. On the surface of the substrate 11, an insulating film 12, a dielectric layer 13, an upper portion 14A of the through-electrode that penetrates the insulation film 12 and the dielectric layer 13, and a switching element 15 are formed. The opening 16 and the projection 17 are formed simultaneously in the substrate 11, and thereafter, the lower portion 14D of the through-electrode that penetrates the substrate 11 and is in contact with the upper portion 14A of the through electrode is formed. By forming the opening 16 and the projection 17 at the same time, the high-frequency device 1 that can be accurately aligned, with respect to a mount substrate such as an interposer substrate can be obtained without increasing the number of processes.
Abstract translation: 要解决的问题：提供一种可以精确地对准具有基板中的开口的高频装置的高频装置，并提供制造该装置的方法。解决方案：通孔的下部14D， 开口16和突起17形成在基板11中。在基板11的表面上，绝缘膜12，电介质层13，穿透绝缘膜12的贯通电极的上部14A和 电介质层13和开关元件15。 开口16和突起17同时形成在基板11中，然后形成穿透基板11并与通孔的上部14A接触的贯通电极的下部14D。 通过同时形成开口16和突起17，可以在不增加处理次数的情况下获得能够相对于诸如插入器基板的安装基板精确对准的高频器件1。
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公开(公告)号：JP2009078315A
公开(公告)日：2009-04-16
申请号：JP2007248220
申请日：2007-09-25
Inventor： MITARAI TAKASHI
Abstract: PROBLEM TO BE SOLVED: To provide a sealing structure which can be manufactured in a relatively inexpensive and stable manner to be miniaturized with a protecting film for sealing.
SOLUTION: The sealing structure comprises a structure 10 formed on a substrate 1, a dummy member 20 arranged on the substrate 1 for the structure 10, the protecting film 7 provided on the structure 10 and the dummy member 20 for sealing the structure 10 and the dummy member 20, and a hollow space 6 provided between the structure 10 and the protecting film 7.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 要解决的问题：提供可以以相对便宜且稳定的方式制造的密封结构，以使其具有用于密封的保护膜的小型化。 解决方案：密封结构包括形成在基板1上的结构10，布置在用于结构10的基板1上的虚拟构件20，设置在结构10上的保护膜7和用于密封结构的伪构件20 10和虚拟构件20以及设置在结构体10和保护膜7之间的中空空间6.版权所有（C）2009，JPO＆INPIT
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14.发明专利Electro-mechanical element and manufacturing method thereof, and resonator and manufacturing method thereof 审中-公开电子机械元件及其制造方法及其谐振器及其制造方法
公开(公告)号：JP2007276089A
公开(公告)日：2007-10-25
申请号：JP2006109097
申请日：2006-04-11
Inventor： TADA MASAHIRO , MITARAI TAKASHI , MORITA SHINYA
CPC classification number: H03H9/1057 , H03H9/462 , H03H2009/02511
Abstract: PROBLEM TO BE SOLVED: To improve reliability on a capsulated electromechanical element.
SOLUTION: The electromechanical element is provided with an electromechanical element body 64 having lower electrodes 62 and 63 and a moving piece 35, and an over-coated film 38 sealing the electromechanical element body 64 with a space 37 held therein. Supports 52 are provided between the over-coated film 38 and the moving piece 35.
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 要解决的问题：提高封装机电元件的可靠性。 解决方案：机电元件设置有具有下电极62和63以及移动件35的机电元件主体64，以及用保持在其中的空间37密封机电元件主体64的外涂膜38。 支撑件52设置在过涂膜38和移动件35之间。版权所有（C）2008，JPO＆INPIT
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公开(公告)号：JP2003115545A
公开(公告)日：2003-04-18
申请号：JP2001308501
申请日：2001-10-04
Applicant: SONY CORP
Inventor： HIRONAKA KATSUYUKI , ISOBE CHIHARU , MITARAI TAKASHI
IPC: H01L27/04 , H01L21/822 , H01L21/8246 , H01L27/105
Abstract: PROBLEM TO BE SOLVED: To solve the problem that, although the hydrogen barrier property of a dielectric capacitor covered with an Al2 O3 film is improved in conventional cases, the aspect ratio of the dielectric capacitor becomes high when the Al2 O3 film is formed by a sputtering method from between the sputtering method and an MOCVD method, that a step coverage causes the problem of the film thickness of a sidewall part becoming thin so as to deteriorate the hydrogen barrier property and the Al2 O3 film being stripped when the film is formed directly on the dielectric capacitor. SOLUTION: A lower electrode 2, a dielectric layer 3 and an upper electrode 4 are laminated sequentially on an Si substrate, the dielectric capacitor is obtained, the dielectric capacitor is covered with a Ta2 O5 , Y2 O3 , CeO2 or HfO2 insulating film 5, and the insulating film 5 is covered with the Al2 O3 film 6.
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Patent Agency Ranking
公开(公告)号：JP2015038962A
公开(公告)日：2015-02-26
申请号：JP2014096477
申请日：2014-05-08
Inventor： MITARAI TAKASHI , YANAGAWA SHUSAKU , ROKUHARA MASAHITO , OKA SHUICHI
CPC classification number: H01L21/486 , G02F1/136286 , H01L23/15 , H01L23/373 , H01L23/49827 , H01L23/49833 , H01L23/5384 , H01L23/5385 , H01L23/5389 , H01L27/1218 , H01L27/124 , H01L27/3276 , H01L2224/16225 , H01L2224/73253 , H05K1/115 , H05K1/185 , H05K1/186 , H05K3/10 , H05K3/30 , H05K3/42 , H05K3/4605 , H05K3/4697 , Y10T29/4913 , Y10T29/49155
Abstract: 【課題】大型の部品や耐熱性を備えていない部品をも内蔵する部品内蔵ガラス基板を構成し、機器本体を小型で薄型のものにできるようにする。【解決手段】部品実装基板と貼り合わされる配線基板に、部品実装基板上に実装される部品の形状に合わせた貫通孔やキャビティを設けて、光硬化樹脂により貼り合わせることで、部品内蔵ガラス基板を構成する。これにより、大型の部品や耐熱性を備えていない部品をも内蔵するガラス基板を構成することが可能になると共に、基板を、そのまま筐体の外装とすることができるので、さらに、電子機器を薄型で小型のものとすることができる。本技術は、スマートフォンに適用することができる。【選択図】図5
Abstract translation: 要解决的问题：构成组合了大尺寸部件的组件内置玻璃基板和不具有耐热性的部件，以实现紧凑的尺寸和薄的器件体。解决方案：在线路板制造方法中，通孔 并且在与元件安装基板接合并与光固化树脂接合的布线板上设置符合要安装在元件安装基板上的元件的形状的空腔，以构成元件内置玻璃 基质。 因此，由于可以组成并入大尺寸部件的玻璃基板和不具有耐热性的部件，并且可以将基板本身用作外壳的外包装，因此可以实现薄且紧凑的电子设备。 本技术可以应用于智能电话。
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公开(公告)号：JP2011040303A
公开(公告)日：2011-02-24
申请号：JP2009187556
申请日：2009-08-12
Inventor： AKIBA AKIRA , MITARAI TAKASHI , IKEDA KOICHI
Abstract: PROBLEM TO BE SOLVED: To provide a connector which can connect and disconnect a plurality of signal routes with a small number of actuators and can miniaturize a MEMS switch, and to provide a switch using this contact. SOLUTION: The connector 1 includes a movable section 10, and two sets of fixed contact electrode pair; and movable contact electrodes 21, 22 are arranged on two side faces of the movable section 10. The fixed contact electrode 31, the movable contact electrode 21, and the fixed contact electrode 32 constitute the first signal route; and the fixed contact electrode 31, the movable contact electrode 22, and the fixed contact electrode 32 constitute the second signal route. The movable section 10 is connected with a driving means (actuator) via a rod (push-pull rod) 40. One of two signal routs is selected since the movable section 10 is displaced in a one-axis direction by connecting with the displacement of the rod 40. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 要解决的问题：提供一种能够利用少量致动器连接和断开多个信号路由并且可以使MEMS开关小型化并且使用该接触来提供开关的连接器。
解决方案：连接器1包括可移动部分10和两组固定接触电极对; 并且可动接触电极21,22设置在可动部10的两个侧面上。固定接触电极31，可动接触电极21和固定接触电极32构成第一信号路径; 并且固定接触电极31，可动接触电极22和固定接触电极32构成第二信号路径。 可移动部分10经由杆（推杆）40与驱动装置（致动器）连接。由于可移动部分10通过与一个轴方向的位移 版权所有（C）2011，JPO＆INPIT
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18.发明专利
公开(公告)号：JP2010282788A
公开(公告)日：2010-12-16
申请号：JP2009134125
申请日：2009-06-03
Inventor： AKIBA AKIRA , MITARAI TAKASHI
Abstract: PROBLEM TO BE SOLVED: To provide a contact switch capable of controlling generation of stiction at a contact part and achieving a longer life; and to provide a semiconductor device, a module, and an electronic equipment with the built-in contact switch.
SOLUTION: The contact switch 11A is provided on a signal circuit 12 with a fixed contact 23 and a movable contact 24 facing the fixed contact 23. On the fixed contact 23, there is provided a sliding face 25 (a curved face of a concave shape) and a sliding face 26 (a curved face of a convex shape) corresponding to the sliding face is provided on the movable contact 24. A degree of curvature (a curveture ratio) of the sliding face 26 of the movable contact 24 side is set to be larger than that of the sliding face 25 of the fixed contact 23 side. At an ON operation, the movable contact 24 displaces toward the fixed contact 23 side and contact with each other, while it performs a sliding action, or the sliding face 26 is elastically deformed along the sliding face 25.
COPYRIGHT: (C)2011,JPO&INPITAbstract translation: 要解决的问题：提供一种能够控制在接触部分产生静电的接触开关并实现更长的使用寿命; 并提供具有内置接触开关的半导体器件，模块和电子设备。 解决方案：接触开关11A设置在具有固定触点23和面向固定触点23的可动触点24的信号电路12上。在固定触点23上设置有滑动面25（曲面 凹形）和与滑动面相对应的滑动面26（凸形的曲面）设置在可动触头24上。可动触头24的滑动面26的曲率（曲率比） 侧被设定为大于固定触点23侧的滑动面25的那一侧。 在ON操作时，可动触头24朝向固定触头23侧移动并且彼此接触，同时执行滑动动作，或者滑动面26沿着滑动面25弹性变形。版权所有（C） ）2011，JPO＆INPIT
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公开(公告)号：JP2008236386A
公开(公告)日：2008-10-02
申请号：JP2007073234
申请日：2007-03-20
Inventor： MITARAI TAKASHI , TADA MASAHIRO
Abstract: PROBLEM TO BE SOLVED: To provide an electromechanical device which prevents a fluctuation in a resonance frequency and improves a yield by eliminating positional deviation of supports resulting from a deviation in adapting a mask, its manufacturing method and a resonator by the electromechanical device.
SOLUTION: The electromechanical device 25 having a moving member 10 arranged on a substrate 5 through space 27 is provided with a protective film 15 for sealing the electromechanical device 25 through space 26, wherein the protective film 15 and the moving member 10 are supported by supports 16A and 16B that penetrate the moving member 10.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 要解决的问题：提供一种机电装置，其通过消除由于机电装置适应掩模，其制造方法和谐振器的偏差而导致的支撑体的位置偏移，从而防止谐振频率的波动并提高产量 。 解决方案：具有通过空间27布置在基板5上的移动部件10的机电装置25设置有用于通过空间26密封机电装置25的保护膜15，其中保护膜15和移动部件10是 由穿过移动构件10的支撑件16A和16B支撑。版权所有（C）2009，JPO＆INPIT
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20.发明专利Electromechanical element and electronic circuit device, and method for manufacturing the same 审中-公开电子元件和电子电路装置及其制造方法
公开(公告)号：JP2007216368A
公开(公告)日：2007-08-30
申请号：JP2006042987
申请日：2006-02-20
Inventor： AKIBA AKIRA , MITARAI TAKASHI
CPC classification number: B81C1/00896 , B81B2207/015 , B81C2201/056
Abstract: PROBLEM TO BE SOLVED: To solve a problem such as deformation or breakage of a needle caused by a load or the like on the mover in a manufacturing process of an electromechanical element.
SOLUTION: A mover 5 is formed on a sacrifice layer 23, and a plurality of holes 5h for exposing the sacrifice layer 23 are formed in the mover 5. The first etching to leave a part of the sacrifice layer is performed from the holes formed in the mover and from the periphery of the mover, and the mover is mechanically supported by the remaining portion of the sacrifice layer. In this state, the loading work is performed, the second etching is performed subsequently to remove the remaining portion of the sacrifice layer. By performing the loading work on the needle in a reinforcing state by a part of the sacrifice layer, deformation, breakage or the like of the mover in the manufacturing process by the load or the like can be avoided.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 要解决的问题：为了解决在机电元件的制造过程中由于载荷等导致的针头的变形或破损的问题。 解决方案：在牺牲层23上形成移动器5，并且在移动器5中形成用于暴露牺牲层23的多个孔5h。离开牺牲层的一部分的第一蚀刻是从 形成在移动器和移动器的周边的孔，并且移动器由牺牲层的剩余部分机械地支撑。 在这种状态下，进行加载工作，随后执行第二蚀刻以去除牺牲层的剩余部分。 通过由牺牲层的一部分在加强状态下进行针的加载作业，可以避免在制造过程中通过负载等的动子的变形，破损等。 版权所有（C）2007，JPO＆INPIT
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