Abstract:
PROBLEM TO BE SOLVED: To provide an optical amplifier capable of suppressing change in drive current and optical output with time.SOLUTION: An optical amplifying element 20 on a stem 10 is called a transparent type SOA and amplifies short-wavelength light having entered into an incidence side end face 20A to emit light having larger luminance than the incident light from an injection side end face 20B. Both the incidence side end face 20A and the injection side end face 20B of the optical amplifying element 20 have an anti-reflection film on its surface. The optical amplifying element 20 is sealed by the stem 10 and a cap 30. Light transparent windows 32 are provided on an opposite part of the incidence side end face 20A and the injection side end face 20B, respectively, in the cap 30.
Abstract:
PROBLEM TO BE SOLVED: To provide an optical oscillator capable of readily and simply obtaining desired pulsed light-frequency.SOLUTION: The optical oscillator comprises a supersaturation-absorber part having a double quantum well separation containment heterostructure made of GaInN/GaN/AlGaN material, and for applying negative bias voltage; a self-exciting oscillation semiconductor laser 1 having a gain part for injecting gain current; a light separating means 3 for separating a part of laser light from the self-exciting oscillation semiconductor laser 1; a light receiving element 5 for receiving laser light separated by the light separating means; and a current limiting circuit 6 for controlling current injected into the gain part of the self-exciting oscillation semiconductor laser 1 based on an amount of laser light received by the light receiving element 5.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor laser device accurately, surely and easily forming a second electrode and a ridge structure separated by a separating groove. SOLUTION: This method for manufacturing a bi-section GaN-based semiconductor laser device includes respective processes of: (A) forming a first compound semiconductor layer 30, a compound semiconductor layer 40 that constitutes a light-emitting region 41 and a saturable absorption region 42, and a second compound semiconductor layer 50; thereafter (B) forming a strip-shaped second electrode 62 on the second compound semiconductor layer 50; then (C) forming a ridge structure by etching at least a part of the second compound semiconductor layer 50 using the second electrode 62 as an etching mask; and thereafter (D) forming a separating groove 62C in the second electrode 62 by a wet etching method, and thereby separating the second electrode into a first portion 62A and a second portion 62B by the separating groove. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor laser with an ultrashort pulse and an ultrahigh output by a simple construction and structure. SOLUTION: The semiconductor laser is driven by a pulse current with a value that is ten times or more as large as that of a threshold current or a pulse voltage that is twice or more as large as that of a threshold voltage, or the semiconductor laser emits a first light peak with a light intensity larger than three wats and with a half width of 20 picoseconds or less, and a second light peak, subsequent to the first light peak, that has an energy of 1 nano-joule or larger and a duration of 1 nanosecond or more. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a light-emitting diode which emits light efficiently and which can be manufactured at low costs by a single epitaxial growth, and to provide a manufacturing method of the same. SOLUTION: A substrate 11 having a plurality of protrusions 12 is formed on one main surface of the substrate 11 such as a sapphire substrate wherein the protrusion 12 is made of a material different in type from that of the substrate, an SiO 2 film e.g., and a first nitride-based group III-V compound semiconductor layer 15 is grown on each recess 13 between the protrusions 12 until making a triangle in section wherein a bottom surface of the recess becomes a base of the triangle. Thereafter, a second nitride-based group III-V compound semiconductor layer 15 is laterally grown on the substrate from the first nitride-based group III-V compound semiconductor layer 15. The protrusions 12 are triangular or trapezoidal e.g. in section. On the second nitride-based group III-V compound semiconductor layer 15, a third nitride-based group III-V compound semiconductor layer 15 including an active layer and a nitride-based group III-V compound semiconductor layer 15 are formed. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing light emitting element by which the yield of a light emitting element can be improved by reducing the influence of the warping of a substrate caused by epitaxial growth. SOLUTION: The method of manufacturing the light emitting element includes an epitaxial growth step of adhering a film to the surface of the substrate through epitaxial growth, a flattening step of flattening the rear surface of the substrate by grinding after the epitaxial growth step, and a substrate treating step of performing prescribed treatment to the surface of the substrate after the flattening step. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method for forming a GaInN layer that has high In composition and superior optical characteristics. SOLUTION: A cleaned c-surface sapphire substrate 22 is introduced into an MBE device, and thermal cleaning is performed for ten minutes at 800°C in vacuum. Then the temperature of the substrate is lowered to 550°C, and the surface of the sapphire substrate is nitrided by a nitrogen plasma. Then the temperature of the substrate is lowered to 300°C, and the sapphire substrate is kept for ten minutes under a condition where the amount of In beam is 8×10 -8 Torr, the flow rate of nitrogen gas is 2 sccm, and RF power is 330 W. By using the nitrogen plasma in an MBE method, a low temperature InN buffer layer 24 having a thickness of 30nm is grown on the sapphire substrate at an average growing speed 70nm/hour. A surface of the low temperature InN buffer layer has a nitrogen polarity. Then the temperature of the substrate is raised to 550°C, and an annealing treatment is performed while keeping the temperature for three minutes, to flatten the surface. Continuously, Ga, In and the nitrogen plasma are supplied to grow a Ga 1-x In x N mixed crystal semiconductor layer 26, in which In composition X is 0.73, on the low temperature InN buffer layer, in a MBE method. COPYRIGHT: (C)2004,JPO
Abstract:
PURPOSE: To realize a semiconductor light emitting element using II-VI compound semiconductor which can use pseudo two-dimensional system excitons even at a room temperature. CONSTITUTION: In a semiconductor light emitting element having a first clad layer 2, an active layer 3 of single quantum well structure or multiple quantum well structure, and a second clad layer 4, the energy gap between the first clad layer 2 and the second clad layer 4 is Egc , and the energy gap of a quantum well layer constituting the active layer 3 is Egw . The quantum well structure is so designed that the condition of Egw /Egc
Abstract:
PURPOSE:To provide a semiconductor laser which can output blue light by using a ZnMgSSe compound semiconductor. CONSTITUTION:An n-type ZnMgSSe clad layer 3, an active layer 4 consisting of a ZnSe/ZnMgSSe multiple quantum well layer, a p-type ZnMgSSe clad layer 5 and a p-type ZnSe contact layer 6 are formed in multilayer on an n-type GaAs substrate 1 with an n-type ZnSe buffer layer 2 therebetween by a molecular epitaxial method one by one. An Au/Pd electrode 8 is used for an p-side electrode and an In electrode 9 is used for an n-side electrode.
Abstract:
PURPOSE:To enable performing heat treatment just sufficiently by a method wherein heat treatment is performed, while a voltage is applied in the thickness direction of an epitaxial layer and the current flowing through the epitaxial layer is measured. CONSTITUTION:On one main surface of a conductive GaAs substrate 1 of P-type, an undoped ZnSe epitaxial layer 2 is grown; P-type impurity for ZnSe, like nitrogen, is ion-implanted: after an electrode 3 composed of metal like indium is formed on the other surface of the substrate 1, the electrode 3 is brought into ohmic contact with the GaAs substrate 1 by alloying. Two members wherein the ZnAs epitaxial layer 2 is formed on the GaAs substrate 1 are so stacked that the surfaces of each ZnSe epitaxial layer 2 comes into close contact with each other. After that, a voltage E is applied between the electrodes 3 formed on each GaAs substrate 1, and heat treatment is performed at a prescribed temperature, while the flowing current between the electrodes 3 is monitored with an ammeter 4.