Abstract:
The present invention relates to a solid-state imaging element which is able to provide the solid-state imaging element having a polarizing element having a simple configuration and structure based on a wire grid polarizer technique, a solid-state imaging device, an imaging apparatus, and a method of manufacturing a polarizing element. The solid-state imaging device includes a plurality of solid-state imaging elements 41 each including a photoelectric conversion element 61 and a polarizing element 70 formed on the light incident side of the photoelectric conversion element 61. The solid-state imaging device includes two or more kinds of polarizing elements 70 having different polarization orientations. Each polarizing element has a stacked structure in which a stripe-shaped reflecting layer 71, an insulating layer 72 formed on the reflecting layer 71, and a light absorption layer 73 made up of a plurality of segments 73' formed on the insulating layer 72 in a separated state are stacked in that order from the photoelectric conversion element side.
Abstract:
An exposing mask capable of obtaining a sufficient gradient with a simple structure and forming a 3-D shape by exposing. An exposing mask (M) used in an exposure system (S), wherein a plurality of pattern blocks, each comprising a pair of a light shielding pattern for shielding light emitted from the exposure system (S) and a transmission pattern for transmitting this light, are continuously arranged, and they are provided at a constant pitch with a ratio between a light shielding pattern and a transmission pattern gradually varying.
Abstract:
PROBLEM TO BE SOLVED: To provide a method of accurately manufacturing an optical waveguide having high accuracy and a high accumulation only by a lithography technique. SOLUTION: The method of manufacturing the optical waveguide 1 comprising cores 4 on which light input and output faces 2, 3 are formed in a diagonal shape and a clad 5 includes: a step in which a plurality of rectangular pattern openings 12 corresponding to the cores 4 are arranged side by side on a mask 13 used for exposure of a photosensitive material used for forming the cores 4; a step in which a plurality of exposures are repeated while moving the exposing position of the mask 13 with respect to the photosensitive material in the longitudinal direction of the cores 4 to make an exposed pattern corresponding to the diagonal face shape of the light input and output faces; a step in which a molding mold is manufactured by etching a mold material placed under the photosensitive material mask obtained by developing the multiply exposed photosensitive material; and a step in which the cores are formed by using the molding mold. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an antireflection film capable of sufficiently reducing reflectance on an interface between a resist layer and a silicon semiconductor substrate, even if exposure light is made incident obliquely by one layer in a liquid immersion lithography technique, and to provide an exposure method. SOLUTION: The double layer structure antireflection film is used in exposing a resist layer in an exposure system having a wavelength of 190-195 nm and having a numerical aperture of 1.2-1.3, and is formed between the resist layer and a silicon nitride film formed on the surface of the silicon semiconductor substrate. When complex refractive indexes N 1 , N 2 of upper layer and lower layer constituting the antireflection film are expressed by the expressions; N 1 =n 1 -k 1 i, N 2 =n 2 -k 2 i, film thicknesses of the upper layer and lower layer are d 1 , d 2 and a predetermined combination is selected as the combination of values [n 10 , k 10 , d 10 , n 20 , k 20 , d 20 ], n 1 , k 1 , d 1 , n 2 , k 2 , d 2 satisfy the following relation: ä(n 1 -n 10 )/(n 1m -n 10 )} 2 +ä(k 1 -k 10 )/(k 1m -k 10 )} 2 +ä(d 1 -d 10 )/(d 1m -d 10 )} 2 +ä(n 2 -n 20 )/(n 2m -n 20 )} 2 +ä(k 2 -k 20 )/(k 2m -k 20 )} 2 +ä(d 2 -d 20 )/(d 2m -d 20 )} 2 ≤1. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an antireflection film capable of sufficiently reducing reflectance on an interface between a resist layer and a silicon semiconductor substrate, even if exposure light is made incident obliquely by one layer in a liquid immersion lithography technique, and to provide an exposure method. SOLUTION: The double layer structure antireflection film is used in exposing a resist layer in an exposure system having a wavelength of 190-195 nm and having a numerical aperture of 1.1-1.2, and is formed between the resist layer and a silicon nitride film formed on the surface of the silicon semiconductor substrate. When complex refractive indexes N 1 , N 2 of upper layer and lower layer constituting the antireflection film are expressed by the expressions; N 1 =n 1 -k 1 i, N 2 =n 2 -k 2 i, film thicknesses of the upper layer and lower layer are d 1 , d 2 and a predetermined combination is selected as the combination of values [n 10 , k 10 , d 10 , n 20 , k 20 , d 20 ], n 1 , k 1 , d 1 , n 2 , k 2 , d 2 satisfy the following relation: ä(n 1 -n 10 )/(n 1m -n 10 )} 2 +ä(k 1 -k 10 )/(k 1m -k 10 )} 2 +ä(d 1 -d 10 )/(d 1m -d 10 )} 2 +ä(n 2 -n 20 )/(n 2m -n 20 )} 2 +ä(k 2 -k 20 )/(k 2m -k 20 )} 2 +ä(d 2 -d 20 )/(d 2m -d 20 )} 2 ≤1. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an antireflection film capable of sufficiently reducing reflectance on an interface between a resist layer and a silicon semiconductor substrate, even if exposure light is made incident obliquely by one layer in a liquid immersion lithography technique, and to provide an exposure method. SOLUTION: The double layer structure antireflection film is used in exposing a resist layer in an exposure system having a wavelength of 190-195 nm and having a numerical aperture of 1.0-1.1, and is formed between the resist layer and a silicon nitride film formed on the surface of the silicon semiconductor substrate. When complex refractive indexes N 1 , N 2 of upper layer and lower layer constituting the antireflection film are expressed by the expressions; N 1 =n 1 -k 1 i, N 2 =n 2 -k 2 i, film thicknesses of the upper layer and lower layer are d 1 , d 2 and a predetermined combination is selected as the combination of values [n 10 , k 10 , d 10 , n 20 , k 20 , d 20 ], n 1 , k 1 , d 1 , n 2 , k 2 , d 2 satisfy the following relation: ä(n 1 -n 10 )/(n 1m -n 10 )} 2 +ä(k 1 -k 10 )/(k 1m -k 10 )} 2 +ä(d 1 -d 10 )/(d 1m -d 10 )} 2 +ä(n 2 -n 20 )/(n 2m -n 20 )} 2 +ä(k 2 -k 20 )/(k 2m -k 20 )} 2 +ä(d 2 -d 20 )/(d 2m -d 20 )} 2 ≤1. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an exposure apparatus, having an illumination system for imparting an arbitrary polarization distribution to the light for illuminating masks. SOLUTION: The exposure apparatus comprises a fly-eye lens array 104 arranged with fly eyes in a matrix form, in order to equalize the intensity of light being emitted from a light source, and an optical rotation element array 102, consisting of a plurality of optical rotation elements, arranged in correspondence with respective lens element of the fly-eye lens array 104, while having an optical axis parallel with the traveling direction of the light emitted from the light source and making the oscillation plane of passing light rotate. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To conquer the difficulty of mask production while enhancing resolution in the exposure of a gate line, or the like, of a severe dimensional rule when a desired pattern is obtained by projection mapping using a phase shift mask. SOLUTION: In an aligner arranged to obtain a desired pattern by projection mapping using a phase shift mask 10, a polarization condition selecting unit 20 for selecting the polarization direction of illumination light with respect to the phase shift mask 10 is provided in parallel with the direction of the compositional side of a pattern formed on the phase shift mask 10 at the time of projection mapping. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a method for determining a defect specification in a phase shift mask. SOLUTION: A table of correlation between three-dimensional information of a glass defect 11 of the phase shift mask 10 and a CD (minute dimension) error of a transfer pattern is created and a specification in which the glass defect 11 is allowed is determined based on the table.
Abstract:
PROBLEM TO BE SOLVED: To provide a chemical sensor, a chemical sensor module, a biomolecule detection device, and a biomolecule detection method that enable biomolecules to be detected with high precision.SOLUTION: A chemical sensor of the present invention comprises a substrate, an on-chip lens, and a planarization layer. The substrate has a plurality of photodiodes formed thereon and arranged in a flat shape. The on-chip lens is provided on the substrate and condenses incident light on the photodiodes. The planarization layer covers and planarizes the on-chip lens and forms a probe support surface for supporting a probe material.