Lateral insulated gate bipolar transistor with low turn-on overshoot current

    公开(公告)号:US11367785B2

    公开(公告)日:2022-06-21

    申请号:US17606216

    申请日:2020-03-31

    Abstract: A lateral insulated gate bipolar transistor (IGBT) with a low turn-on overshoot current is provided to reduce a peak value of a current flowing through a device during turn-on of a second gate pulse while preventing a current capability and a withstand voltage capability from being degraded. The lateral IGBT includes: a buried oxygen arranged on a P-type substrate, an N-type drift region arranged on the buried oxygen, on which a P-type body region and an N-type buffer region are arranged, a P-type collector region arranged in the N-type buffer region, a field oxide layer arranged above the N-type drift region, a P-type well region arranged in the P-type body region, and a P-type emitter region and an emitter region arranged in the P-type well region, where inner boundaries of the foregoing 4 regions are synchronously recessed to form a pinch-off region. A gate oxide layer is arranged on a surface of the P-type body region, and a polysilicon gate is arranged on the gate oxide layer. The polysilicon gate includes a first gate located above the surface of the P-type body region and a second gate located above the pinch-off region and the N-type drift region. The first gate is connected to a first gate resistor, and the second gate is connected to a second gate resistor.

    Self-adaptive synchronous rectification control system and method of active clamp flyback converter

    公开(公告)号:US11081967B2

    公开(公告)日:2021-08-03

    申请号:US16617508

    申请日:2018-09-28

    Abstract: The invention discloses a self-adaptive synchronous rectification control system and a self-adaptive synchronous rectification control method of an active clamp flyback converter. The control system comprises a sampling and signal processing circuit, a control circuit with a microcontroller as a core and a gate driver. According to the control method, a switching-on state, an early switching-off state, a late switching-off state and an exact switching-off state of a secondary synchronous rectifier of the active clamp flyback converter can be directly detected, and the synchronous rectifier and a switching-on time of the synchronous rectifier in next cycle can be controlled according to a detection result. After several cycles of self-adaptive control, the synchronous rectifier enters the exact switching-on state, thus avoiding oscillation of an output waveform of the active clamp flyback converter.

    Synchronous rectification control system and method for quasi-resonant flyback converter

    公开(公告)号:US11984813B2

    公开(公告)日:2024-05-14

    申请号:US17435789

    申请日:2020-05-15

    CPC classification number: H02M3/33592 H02M1/0058 H02M1/38

    Abstract: A synchronous rectification control system and method for a quasi-resonant flyback converter are provided. The control system includes a switching transistor voltage sampling circuit configured to sample an output terminal voltage of the switching transistor to obtain a sampled voltage of the switching transistor; a sampling calculation module configured to obtain a dead-time based on the sampled voltage of the switching transistor and a preset relationship, the preset relationship being a correspondence between the duration of the sampled voltage of the switching transistor being below a first preset value and the dead-time during an on-time of a switching cycle of the switching transistor, the dead-time being a time from when the switching transistor is turned off to when the synchronous rectification transistor is turned on; and a control module configured to receive the dead-time and control switching of the synchronous rectification transistor based on the dead-time.

    Graphene channel silicon carbide power semiconductor transistor

    公开(公告)号:US11158708B1

    公开(公告)日:2021-10-26

    申请号:US16486494

    申请日:2018-09-25

    Abstract: The invention provides a graphene channel silicon carbide power semiconductor transistor, and its cellular structure thereof. Characterized in that, a graphene strip serving as a channel is embedded in a surface of the P-type body region and two ends of the graphene strip are respectively contacted with a boundary between the N+-type source region and the P-type body region and a boundary between the P-type body region and the N-type drift region, and the graphene strip is distributed in a cellular manner in a gate width direction, a conducting channel of a device is still made of graphene; in the case of maintaining basically invariable on-resistance and current transmission capacity, the P-type body regions are separated by the graphene strip, thus enhancing a function of assisting depletion, which further reduces an overall off-state leakage current of the device, and improves a breakdown voltage.

    TRANSVERSE ULTRA-THIN INSULATED GATE BIPOLAR TRANSISTOR HAVING HIGH CURRENT DENSITY
    18.
    发明申请
    TRANSVERSE ULTRA-THIN INSULATED GATE BIPOLAR TRANSISTOR HAVING HIGH CURRENT DENSITY 有权
    具有高电流密度的横向超薄绝缘栅双极晶体管

    公开(公告)号:US20150270377A1

    公开(公告)日:2015-09-24

    申请号:US14439715

    申请日:2012-12-27

    Abstract: A transverse ultra-thin insulated gate bipolar transistor having current density includes: a P substrate, where the P substrate is provided with a buried oxide layer thereon, the buried oxide layer is provided with an N epitaxial layer thereon, the N epitaxial layer is provided with an N well region and P base region therein, the P base region is provided with a first P contact region and an N source region therein, the N well region is provided with an N buffer region therein, the N well region is provided with a field oxide layer thereon, the N buffer region is provided with a P drain region therein, the N epitaxial layer is provided therein with a P base region array including a P annular base region, the P base region array is located between the N well region and the P base region, the P annular base region is provided with a second P contact region and an N annular source region therein, and the second P contact region is located in the N annular source region. The present invention greatly increases current density of a transverse ultra-thin insulated gate bipolar transistor, thus significantly improving the performance of an intelligent power module.

    Abstract translation: 具有电流密度的横向超薄绝缘栅双极晶体管包括:P基板,其中P基板在其上设置有掩埋氧化物层,所述掩埋氧化物层在其上设置有N外延层,提供N外延层 在其中具有N阱区域和P基极区域,P基极区域中设置有第一P接触区域和N源极区域,N阱区域中设置有N个缓冲区域,N阱区域设置有 在其上的场氧化物层,N缓冲区在其中设置有P漏极区,N外延层中设置有包括P环状基极区的P基区阵列,P基区阵列位于N阱之间 区域和P基区域中,P环状基部区域设置有第二P接触区域和N环状源极区域,第二P接触区域位于N环状源极区域中。 本发明大大增加了横向超薄绝缘栅双极晶体管的电流密度,从而显着提高了智能功率模块的性能。

    High-threshold power semiconductor device and manufacturing method thereof

    公开(公告)号:US12107167B2

    公开(公告)日:2024-10-01

    申请号:US17762929

    申请日:2021-01-20

    CPC classification number: H01L29/7851 H01L29/1095 H01L29/778 H01L29/8122

    Abstract: The present invention discloses a high-threshold power semiconductor device and a manufacturing method thereof. The high-threshold power semiconductor device includes, in sequence from bottom to top: a metal drain electrode, a substrate, a buffer layer, and a drift region; further including: a composite column body which is jointly formed by a drift region protrusion, a columnar p-region and a columnar n-region on the drift region, a channel layer, a passivation layer, a dielectric layer, a heavily doped semiconductor layer, a metal gate electrode and a source metal electrode. The composite column body is formed by sequentially depositing a p-type semiconductor layer and an n-type semiconductor layer on the drift region and then etching same. The channel layer and the passivation layer are formed in sequence by deposition. Thus, the above devices are divided into a cell region and a terminal region. The dielectric layer, the heavily doped semiconductor layer, the metal gate electrode and the source metal electrode only exist in the cell region, and the passivation layer of the terminal region extends upwards and is wrapped outside the channel layer. This structure can increase a threshold voltage of the device, improve the blocking characteristics of the device and reduce the size of a gate capacitance.

    Multi-phase high-precision current sharing control method applied to constant on-time control

    公开(公告)号:US12046990B1

    公开(公告)日:2024-07-23

    申请号:US18641384

    申请日:2024-04-21

    CPC classification number: H02M1/082 H02M1/0025 H02M3/1586

    Abstract: A multi-phase high-precision current sharing control method applied to constant on-time control is provided, wherein a current difference between continuously sampled current of each line and mean current is processed by a PI compensation module and a low-pass filter module to obtain on-time regulation data. A high bit of the regulation data controls the value of counter reference Vref in an on-time control module, and a low bit controls the length of an enabled delay line in a delay line module. The counter timing control of the on-time control module is combined with the delay line timing control of the delay line module to improve the control precision of a DPWM. The method takes COT control of a Buck converter as a typical application. Compared with a multi-phase COT controller without a current-sharing mechanism, the method can improve the stability and reliability of the system.

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