公开(公告)号：CA2887911C

公开(公告)日：2017-06-27

申请号：CA2887911

申请日：2013-10-23

Applicant: SPECTRASENSORS INC

Inventor： FEITISCH ALFRED ,  NEUBAUER GABI ,  SCHREMPEL MATHIAS

IPC: H01S5/022 ,  B23K20/02 ,  H01S5/024 ,  H01S5/042

Abstract: A first contact surface (310) of a semiconductor laser chip (302) can be formed to a first target surface roughness and a second contact surface (312) of a carrier mounting (304) can be formed to a second target surface roughness. A first bond preparation layer (306) comprising a first metal can optionally be applied to the formed first contact surface, and a second bond preparation layer (308) comprising a second metal can optionally be applied to the formed second contact surface. Both preparation layers may be made of gold and diffusion bonding results from a heating of device under pressure. The first contact surface can be contacted with the second contact surface, and a solderless securing process can secure the semiconductor laser chip to the carrier mounting. Related systems, methods, articles of manufacture, and the like are also described.

公开(公告)号：AU2013334609B2

公开(公告)日：2016-12-01

申请号：AU2013334609

申请日：2013-10-23

Applicant: SPECTRASENSORS INC

Inventor： FEITISCH ALFRED ,  NEUBAUER GABI ,  SCHREMPEL MATHIAS

IPC: H01S5/022 ,  B23K20/02 ,  H01S5/024 ,  H01S5/042

Abstract: A first contact surface (310) of a semiconductor laser chip (302) can be formed to a first target surface roughness and a second contact surface (312) of a carrier mounting (304) can be formed to a second target surface roughness. A first bond preparation layer (306) comprising a first metal can optionally be applied to the formed first contact surface, and a second bond preparation layer (308) comprising a second metal can optionally be applied to the formed second contact surface. Both preparation layers may be made of gold and diffusion bonding results from a heating of device under pressure. The first contact surface can be contacted with the second contact surface, and a solderless securing process can secure the semiconductor laser chip to the carrier mounting. Related systems, methods, articles of manufacture, and the like are also described.

公开(公告)号：CA2887911A1

公开(公告)日：2014-05-01

申请号：CA2887911

申请日：2013-10-23

Applicant: SPECTRASENSORS INC

Inventor： FEITISCH ALFRED ,  NEUBAUER GABI ,  SCHREMPEL MATHIAS

IPC: H01S5/022 ,  B23K20/02 ,  H01S5/024 ,  H01S5/042

Abstract: A first contact surface (310) of a semiconductor laser chip (302) can be formed to a first target surface roughness and a second contact surface (312) of a carrier mounting (304) can be formed to a second target surface roughness. A first bond preparation layer (306) comprising a first metal can optionally be applied to the formed first contact surface, and a second bond preparation layer (308) comprising a second metal can optionally be applied to the formed second contact surface. Both preparation layers may be made of gold and diffusion bonding results from a heating of device under pressure. The first contact surface can be contacted with the second contact surface, and a solderless securing process can secure the semiconductor laser chip to the carrier mounting. Related systems, methods, articles of manufacture, and the like are also described.