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    METHOD OF PRODUCING OPTICAL WAVEGUIDES, CORRESPONDING SYSTEM AND DEVICE
    11.
    发明申请
    METHOD OF PRODUCING OPTICAL WAVEGUIDES, CORRESPONDING SYSTEM AND DEVICE 审中-公开

    公开(公告)号：US20190086609A1

    公开(公告)日：2019-03-21

    申请号：US16130677

    申请日：2018-09-13

    Applicant: STMicroelectronics S.r.l.

    Inventor： Mark Andrew Shaw

    IPC: G02B6/122 ,  G02B6/25 ,  G02B6/12 ,  H01L21/822 ,  H01L21/67 ,  B23K26/0622

    Abstract: A method includes providing a semiconductor wafer that includes at least one optical waveguide extending in a longitudinal direction. Stealth dicing laser processing is applied to the semiconductor wafer by producing defect regions into the wafer along at least one cutting line. The cutting line is oblique to the longitudinal direction of the at least one optical waveguide. The wafer is expanded to induce fracture thereof at the at least one cutting line, thereby producing an end surface of the at least one optical waveguide. The end surface is oblique to the longitudinal direction of the at least one optical waveguide.

    OPTICAL COUPLING SYSTEM, CORRESPONDING DEVICE AND METHOD
    12.
    发明申请
    OPTICAL COUPLING SYSTEM, CORRESPONDING DEVICE AND METHOD 审中-公开

    公开(公告)号：US20180113256A1

    公开(公告)日：2018-04-26

    申请号：US15608548

    申请日：2017-05-30

    Applicant: STMicroelectronics S.r.l.

    Inventor： Mark Andrew Shaw

    IPC: G02B6/26 ,  G02B6/42 ,  G02B6/12

    Abstract: An optical coupling includes a body having a first surface which couples with a photonics integrated circuit and a second surface including an array of lenses integral with the body. The array of lenses couples to an optical fiber connector. The array of lenses may be a linear array. The body may be made of a polymer material, which may be optically cured. The photonics integrated circuit and the optical coupling may be used, for example, in a mobile phone. The optical coupling may be made by shaping curable material on a photonics integrated circuit into a body, and curing the body of curable material. The cured body includes the first surface in contact with the photonics integrated circuit and the second surface including the array of optical lenses to couple with the optical fiber connector.

    OPTO-MECHANICAL TRANSDUCER APPARATUS AND CORRESPONDING METHOD
    15.
    发明申请
    OPTO-MECHANICAL TRANSDUCER APPARATUS AND CORRESPONDING METHOD 有权

    公开(公告)号：US20210382332A1

    公开(公告)日：2021-12-09

    申请号：US17326955

    申请日：2021-05-21

    Applicant: STMicroelectronics S.r.l.

    Inventor： Luca Maggi ,  Mark Andrew Shaw

    IPC: G02F1/01 ,  H01L41/053

    Abstract: An embodiment apparatus comprises an optically transparent substrate having first and second surfaces; a piezoelectric membrane, arranged at the first surface, that oscillates in response to a light beam propagated through the substrate; at least one reflective facet facing the substrate and arranged at the piezoelectric membrane; and an optical element receiving the light beam at an input end and guiding the light beam towards an output end coupled to the second surface. The optical element incorporates a light focusing path focusing the light beam at a focal point at the piezoelectric membrane, and at least one light collimating path collimating the light beam onto the at least one reflective facet. The optical element guides light reflected from the at least one reflective facet to the input end, the reflected light indicating a position of the optical element with respect to the focal point.

    Method for forming an electro-optical system
    16.
    发明授权
    Method for forming an electro-optical system 有权

    公开(公告)号：US11063029B2

    公开(公告)日：2021-07-13

    申请号：US16404174

    申请日：2019-05-06

    Applicant: STMicroelectronics S.r.l.

    Inventor： Mark Andrew Shaw

    IPC: H01L25/16 ,  H01L23/00 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/18

    Abstract: An optoelectronic device includes an optical integrated circuit having a first surface and a second surface opposite the first surface. The optical integrated circuit has an optical zone of the first surface of the optical integrated circuit. The device includes an electrically insulating material disposed over the optical integrated circuit, where he electrically insulating material partially covers the first surface so as to expose the optical zone.

    Method of Producing a Device for Adiabatic Coupling, Corresponding Device and System
    17.
    发明申请
    Method of Producing a Device for Adiabatic Coupling, Corresponding Device and System 审中-公开

    公开(公告)号：US20190369341A1

    公开(公告)日：2019-12-05

    申请号：US16428428

    申请日：2019-05-31

    Applicant: STMicroelectronics S.r.l.

    Inventor： Mark Andrew Shaw ,  Luca Maggi ,  Antonio Fincato

    IPC: G02B6/42 ,  G02B6/122

    Abstract: A method includes providing a semiconductor body comprising a surface with a recessed portion therein. The recessed portion includes a bottom surface. Optical waveguide cores in a first array of optical waveguide cores extend side-by-side at the bottom surface. The method further includes providing a second array of optical waveguide cores over the first array of optical waveguide cores. Optical waveguide cores in the second array of optical waveguide cores extend side-by-side. Each optical waveguide core in the second array of optical waveguide cores is in an adiabatic coupling relationship with a corresponding optical waveguide core in the first array of optical waveguide cores. The method also includes applying an optical waveguide cladding material over the second array of optical waveguide cores.

    Device, Corresponding Method and Electro-Optical System
    18.
    发明申请
    Device, Corresponding Method and Electro-Optical System 审中-公开

    公开(公告)号：US20190341374A1

    公开(公告)日：2019-11-07

    申请号：US16404174

    申请日：2019-05-06

    Applicant: STMicroelectronics S.r.l.

    Inventor： Mark Andrew Shaw

    IPC: H01L25/16 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/02 ,  H01L31/18

    Abstract: An optoelectronic device includes an optical integrated circuit having a first surface and a second surface opposite the first surface. The optical integrated circuit has an optical zone of the first surface of the optical integrated circuit. The device includes an electrically insulating material disposed over the optical integrated circuit, where he electrically insulating material partially covers the first surface so as to expose the optical zone.

    Method of packaging a MEMS transducer device and packaged MEMS transducer device
    20.
    发明授权
    Method of packaging a MEMS transducer device and packaged MEMS transducer device 有权
    包装MEMS换能器装置和封装的MEMS换能器装置的方法

    公开(公告)号：US09321626B2

    公开(公告)日：2016-04-26

    申请号：US14224861

    申请日：2014-03-25

    Applicant: STMicroelectronics S.r.l.

    Inventor： Mark Andrew Shaw ,  Fabrizio Soglio

    IPC: H01L29/84 ,  B81B7/00 ,  H04R19/00 ,  H04R19/02 ,  H04R31/00 ,  B81C1/00

    CPC classification number: B81B7/0032 ,  B81C1/00261 ,  H01L29/84 ,  H04R19/005 ,  H04R19/02 ,  H04R31/00

    Abstract: A packaged MEMS transducer device comprising: a die, including: a semiconductor body having a front side and a back side, opposite to one another in a first direction, at least one cavity extending through the semiconductor body between the front side and the back side, and at least one membrane extending on the front side at least partially suspended over the cavity; and a package designed to house the die on an inner surface thereof. The transducer device moreover includes a sealing layer extending on the back side of the semiconductor body for sealing the cavity, and includes a paste layer extending between the sealing layer and the inner surface of the package for firmly coupling the die to the package.

    Abstract translation: 一种封装的MEMS换能器装置，包括：模具，包括：半导体本体，其具有在第一方向上彼此相对的前侧和后侧，至少一个在前侧和后侧之间延伸穿过半导体本体的空腔 并且至少一个膜在前侧延伸至少部分地悬挂在空腔上; 以及设计成在其内表面上容纳模具的包装。 换能器装置还包括在半导体本体的后侧延伸的密封层，用于密封空腔，并且包括在密封层和封装的内表面之间延伸的糊层，用于将管芯牢固地连接到封装。

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