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1.发明授权公开(公告)号：US11824052B2
公开(公告)日：2023-11-21
申请号：US17342730
申请日：2021-06-09
Applicant: STMicroelectronics S.r.l.
Inventor： Mark Andrew Shaw
IPC: H01L25/16 , H01L23/00 , H01L31/02 , H01L31/0203 , H01L31/18
CPC classification number: H01L25/167 , H01L24/19 , H01L24/20 , H01L25/165 , H01L31/0203 , H01L31/02005 , H01L31/18 , H01L2224/214
Abstract: An optoelectronic device includes an optical integrated circuit having a first surface and a second surface opposite the first surface. The optical integrated circuit has an optical zone of the first surface of the optical integrated circuit. The device includes an electrically insulating material disposed over the optical integrated circuit, where the electrically insulating material partially covers the first surface so as to expose the optical zone.
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公开(公告)号：US10802215B2
公开(公告)日：2020-10-13
申请号：US15921374
申请日：2018-03-14
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Mark Andrew Shaw
Abstract: An optical waveguide includes a glass waveguide body and a waveguide core through which optical radiation propagates. The waveguide core includes: a body portion extending within the waveguide body, a coupling portion extending at the surface of the waveguide body, and an S-bent intermediate portion coupling the body portion and the coupling portion. An optical coupling arrangement (e.g., for coupling one or more optical fibers to a silicon photonics device) includes one such optical waveguide and a second optical waveguide including a respective waveguide body and one or more waveguide members. The second optical waveguide is coupled with the first optical waveguide with the waveguide member(s) facing the coupling portion of the first optical waveguide.
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公开(公告)号：US10591684B2
公开(公告)日：2020-03-17
申请号：US15608548
申请日：2017-05-30
Applicant: STMicroelectronics S.r.l.
Inventor： Mark Andrew Shaw
Abstract: An optical coupling includes a body having a first surface which couples with a photonics integrated circuit and a second surface including an array of lenses integral with the body. The array of lenses couples to an optical fiber connector. The array of lenses may be a linear array. The body may be made of a polymer material, which may be optically cured. The photonics integrated circuit and the optical coupling may be used, for example, in a mobile phone. The optical coupling may be made by shaping curable material on a photonics integrated circuit into a body, and curing the body of curable material. The cured body includes the first surface in contact with the photonics integrated circuit and the second surface including the array of optical lenses to couple with the optical fiber connector.
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公开(公告)号：US10382137B2
公开(公告)日：2019-08-13
申请号：US16014932
申请日：2018-06-21
Applicant: STMicroelectronics S.r.l.
Inventor： Luca Maggi , Antonio Fincato , Salvatore Mario Rotolo , Matteo Alessio Traldi , Luigi Verga , Mark Andrew Shaw
IPC: G02B6/36 , H04B10/114 , H04J14/02 , H04B10/40 , G02B6/42 , H04B10/80 , H04B10/2575
Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface.
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公开(公告)号：US11598920B2
公开(公告)日：2023-03-07
申请号：US17326955
申请日：2021-05-21
Applicant: STMicroelectronics S.r.l.
Inventor： Luca Maggi , Mark Andrew Shaw
Abstract: An embodiment apparatus comprises an optically transparent substrate having first and second surfaces; a piezoelectric membrane, arranged at the first surface, that oscillates in response to a light beam propagated through the substrate; at least one reflective facet facing the substrate and arranged at the piezoelectric membrane; and an optical element receiving the light beam at an input end and guiding the light beam towards an output end coupled to the second surface. The optical element incorporates a light focusing path focusing the light beam at a focal point at the piezoelectric membrane, and at least one light collimating path collimating the light beam onto the at least one reflective facet. The optical element guides light reflected from the at least one reflective facet to the input end, the reflected light indicating a position of the optical element with respect to the focal point.
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Patent Agency Ranking
公开(公告)号：US20200310031A1
公开(公告)日：2020-10-01
申请号：US16365566
申请日：2019-03-26
Applicant: STMicroelectronics S.r.l.
Inventor： Mark Andrew Shaw
Abstract: A method of forming a photonic device includes forming a cavity extending from a first major surface of a semiconductor wafer, performing a laser grooving process to form a first groove and a second groove, dicing the semiconductor wafer along the first groove and the second groove, and attaching an optical interposer to the bottom surface of the cavity. The cavity includes a first sidewall, an opposite second sidewall, and a bottom surface. The first groove is separated from the second groove by the cavity. The dicing passes through the cavity along a line connecting the first groove to the second groove.
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公开(公告)号：US10761279B2
公开(公告)日：2020-09-01
申请号：US16428428
申请日：2019-05-31
Applicant: STMicroelectronics S.r.l.
Inventor： Mark Andrew Shaw , Luca Maggi , Antonio Fincato
Abstract: A method includes providing a semiconductor body comprising a surface with a recessed portion therein. The recessed portion includes a bottom surface. Optical waveguide cores in a first array of optical waveguide cores extend side-by-side at the bottom surface. The method further includes providing a second array of optical waveguide cores over the first array of optical waveguide cores. Optical waveguide cores in the second array of optical waveguide cores extend side-by-side. Each optical waveguide core in the second array of optical waveguide cores is in an adiabatic coupling relationship with a corresponding optical waveguide core in the first array of optical waveguide cores. The method also includes applying an optical waveguide cladding material over the second array of optical waveguide cores.
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公开(公告)号：US09324627B2
公开(公告)日：2016-04-26
申请号：US14258818
申请日：2014-04-22
Applicant: STMicroelectronics S.r.l.
Inventor： Pierangelo Magni , Giuseppe Gattavari , Mark Andrew Shaw
CPC classification number: H01L23/34 , H01L23/3107 , H01L23/49541 , H01L24/80 , H01L2224/48091 , H01L2224/48227 , H01L2224/48245 , H01L2224/48247 , H01L2924/12042 , H01L2924/181 , H05K1/183 , H05K3/306 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
Abstract: An embodiment of an electronic assembly for mounting on an electronic board includes a plurality of electric contact regions exposed on a mounting surface of the electronic board. The electronic assembly includes a chip of semiconductor material in which at least one electronic component is integrated, at least one support element including a first main surface and a second main surface opposite to the first main surface, the chip being enclosed by the at least one support element, a heat dissipation plate thermally coupled to said chip to dissipate the heat produced by it, exposed on the first main surface of the support element, a plurality of contact elements, each electrically coupled to a respective electric terminal of the electronic component integrated in the chip, exposed on the same first main surface of which is exposed to the dissipation plate. Also included are a plurality of electric connection elements, each adapted to electrically intercouple a respective contact element of the electronic assembly with a corresponding electric contact region of the electronic board, in such a way that the second main surface of the at least one support element faces the mounting surface of the electronic board.
Abstract translation: 用于安装在电子板上的电子组件的实施例包括暴露在电子板的安装表面上的多个电接触区域。 电子组件包括其中集成有至少一个电子部件的半导体材料芯片，包括第一主表面和与第一主表面相对的第二主表面的至少一个支撑元件，芯片被至少一个 支撑元件，热耦合到所述芯片以散发由其产生的热量的散热板，暴露在支撑元件的第一主表面上，多个接触元件，每个接触元件电耦合到电子元件的相应电气端子集成 在芯片中，暴露在与其散开板相同的第一主表面上。 还包括多个电连接元件，每个电连接元件适于将电子组件的相应接触元件与电子板的对应电接触区域电相互耦合，使得至少一个支撑元件的第二主表面 面向电子板的安装表面。
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公开(公告)号：US20210296297A1
公开(公告)日：2021-09-23
申请号：US17342730
申请日：2021-06-09
Applicant: STMicroelectronics S.r.l.
Inventor： Mark Andrew Shaw
IPC: H01L25/16 , H01L23/00 , H01L31/02 , H01L31/0203 , H01L31/18
Abstract: An optoelectronic device includes an optical integrated circuit having a first surface and a second surface opposite the first surface. The optical integrated circuit has an optical zone of the first surface of the optical integrated circuit. The device includes an electrically insulating material disposed over the optical integrated circuit, where he electrically insulating material partially covers the first surface so as to expose the optical zone.
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公开(公告)号：US10718900B2
公开(公告)日：2020-07-21
申请号：US16130677
申请日：2018-09-13
Applicant: STMicroelectronics S.r.l.
Inventor： Mark Andrew Shaw
IPC: H01L21/67 , H01L21/822 , G02B6/122 , G02B6/25 , G02B6/12 , B23K26/0622 , G02B6/13
Abstract: A method includes providing a semiconductor wafer that includes at least one optical waveguide extending in a longitudinal direction. Stealth dicing laser processing is applied to the semiconductor wafer by producing defect regions into the wafer along at least one cutting line. The cutting line is oblique to the longitudinal direction of the at least one optical waveguide. The wafer is expanded to induce fracture thereof at the at least one cutting line, thereby producing an end surface of the at least one optical waveguide. The end surface is oblique to the longitudinal direction of the at least one optical waveguide.
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