公开(公告)号：EP3396344B1

公开(公告)日：2019-12-25

申请号：EP18163456.9

申请日：2018-03-22

Applicant: STMicroelectronics S.r.l.

Inventor： ABBASI GAVARTI, Mohammad ,  CALTABIANO, Daniele ,  POMARICO, Anna Angela ,  ROSELLI, Giuditta

IPC: G01L9/00

公开(公告)号：EP3537129A2

公开(公告)日：2019-09-11

申请号：EP19158156.0

申请日：2019-02-19

Applicant: STMicroelectronics S.r.l.

Inventor： CALTABIANO, Daniele

IPC: G01L9/00 ,  G01L9/04 ,  G01L19/00

Abstract: A semiconductor device (100; 100') includes a strain gauge (130) on a substrate (101; 702), the strain gauge configured to measure a stress of the substrate; and a temperature sensor (107) disposed within the substrate, the temperature sensor being decoupled from the stress of the substrate.

公开(公告)号：EP3396344A1

公开(公告)日：2018-10-31

申请号：EP18163456.9

申请日：2018-03-22

Applicant: STMicroelectronics S.r.l.

Inventor： ABBASI GAVARTI, Mohammad ,  CALTABIANO, Daniele ,  POMARICO, Anna Angela ,  ROSELLI, Giuditta

IPC: G01L9/00

Abstract: A microelectromechanical transducer (1; 20; 30; 50), comprising: a semiconductor body (2), having a first surface (2a) and a second surface (2b) opposite to one another; a first structural body (8), coupled to the first surface (2a) of the semiconductor body (2); a first sealed cavity (10) between the semiconductor body (2) and the first structural body (8); and an active area (7) housed in the first sealed cavity (10), including at least two trenches (4; 34) and a sensor element (6a-6d; 60) between the trenches (4; 34). The trenches (4; 34) extend along a vertical direction (Z) from the first surface (2a) towards the second surface (2b) of the semiconductor body (2).

公开(公告)号：EP3252449A1

公开(公告)日：2017-12-06

申请号：EP16206884.5

申请日：2016-12-23

Applicant: STMicroelectronics S.r.l.

Inventor： CALTABIANO, Daniele ,  ABBASI GAVARTI, Mohammad ,  MURARI, Bruno ,  BRIOSCHI, Roberto ,  GIUSTI, Domenico

IPC: G01L9/00 ,  G01L1/04

Abstract: A load-sensing device (10), arranged in a package (12) forming a chamber (24). The package (12) has a deformable substrate (21) configured, in use, to be deformed by an external force. A sensor unit (11) is in direct contact with the deformable substrate (21) and is configured to detect deformations of the deformable substrate. An elastic element (15) is arranged within of the chamber (24) and acts between the package (12) and the sensor unit (11) to generate, on the sensor unit, a force keeping the sensor unit in contact with the deformable substrate. For example, the deformable substrate is a base (21) of the package (12), and the elastic element is a metal lamina (15) arranged between the lid (22) of the package (12) and the sensor unit (11). The sensor unit (11) may be a semiconductor die integrating piezoresistors.

Abstract translation: 负载感测装置（10），其布置在形成腔室（24）的包装（12）中。 包装（12）具有可变形的基底（21），该基底在使用中被配置为通过外力而变形。 传感器单元（11）与可变形基板（21）直接接触并且被配置为检测可变形基板的变形。 弹性元件（15）布置在腔室（24）内并且作用在封装（12）和传感器单元（11）之间，以在传感器单元上​​产生保持传感器单元与可变形基底 。 例如，可变形衬底是封装（12）的基座（21），并且弹性元件是布置在封装（12）的盖（22）和传感器单元（11）之间的金属薄片（15） 。 传感器单元（11）可以是集成压敏电阻器的半导体管芯。