Abstract:
A method for operating a flash memory device ( 100 ) is proposed. The memory device includes a matrix of memory cells ( 110 ) each one having a programmable threshold voltage (V T ) defining a value stored in the memory cell. The method includes the steps of crasing a block ( 115 ) of memory cells, and compacting the threshold voltages of the memory cells of the block within a predefined compacting range, wherein the step of compacting includes: selecting at least one first memory cell (110 0e ) of the block for writing a target value; restoring the threshold voltage of a subset (110 0e ; 110 1o ) of the memory cells of the block to the compacting range, the subset consisting of the at least one first memory cell (110 0e ) and/or at least one second memory cell of the block (110 1o ) being adjacent to the at least one first memory cell; and at least partially writing the target value into the at least one first memory cell.
Abstract:
The evaluation time (Teval) of the programmed or erased state of a cell of the NAND memory array is set for the individual memory device in a way that at least partially compensates the generally large spread of parasitic capacitance values of the array bitlines in the mass production fabrication process of these devices.
Abstract:
The capacitive coupling between two adjacent bitlines of a NAND memory device is relevant and this may be exploited for boosting the voltage of bitlines that are not to be programmed in order to inhibit program operations on them. According to the disclosed method, first the even (odd) bitlines that include cells not to be programmed (BLE ,...,BLE ) are biased with a first voltage for inhibiting them from being programmed, typically the supply voltage (VDD), while the even (odd) bitlines that include cells to be programmed are grounded. Successively, the adjacent odd (even) bitlines (BLO ,...,BLO ) are biased at the supply voltage (VDD) or at an auxiliary voltage, for boosting the bias voltage of the even (odd) bitlines above the supply voltage. With this expedient, the bias voltage of the even (odd) bitlines that include cells not to be programmed is boosted because of the relevant parasitic coupling capacitances between adjacent bitlines. Therefore, no dedicated charge pump generator is needed.
Abstract:
A page buffer (130) comprised in an electrically programmable memory device (100) is provided. The memory device includes also a plurality of memory cells (110), a plurality of distinct programming states defined for each memory cell, corresponding to a number N>=2 of data bits storable in each memory cell, and at least one read/program unit (205) having a coupling line (SO) operatively associable with selected memory cells. The read/program unit is adapted to at least temporarily store data bits read from or to be written into selected memory cells and comprises programming state change enabling means (230-1,230-2,252,254,256,258,272,274,276,278) for selectively enabling a change in programming state of a selected memory cell by causing the coupling line to take one among a program enabling potential and a program inhibition potential. The programming state change enabling means comprises reading means (256,258,260,230-2), receiving means (252,254,230-1), and combining means (272,274) activatable during a combining phase. The combining means includes a coupling electrical path between the reading means and the receiving means, said coupling electrical line being kept isolated from the coupling electrical path during said combining phase.
Abstract:
A circuit comprises at least one memory cell ( 110 ) adapted to store data in terms of values of an electrical characteristic thereof, which exhibits a variability with temperature according to a first variation law; a voltage generator ( 300 ) is provided for generating a voltage (Vo) to be supplied to the at least one memory cell ( 110 ) for retrieving the data stored therein, the voltage generator including first means ( 305 ) adapted to cause the generated voltage take a value in a set of target values including at least one target value (Vr-1,Vr-2,Vr-3,Vfy-1,Vfy-2,Vfy-3), corresponding to an operation to be performed on the memory cell. The voltage generator comprises second means ( Mt,Rs,325, R1,R2,330 ) for causing the value taken by the generated voltage vary with temperature according to a prescribed second variation law exploiting a compensation circuit element ( Mt ) having said electrical characteristic.
Abstract:
A high-voltage switch (24) has a high-voltage input terminal (29), receiving a high voltage (HV), and an output terminal (31). A pass transistor (36), having a control terminal, is connected between the high-voltage input terminal (29) and the output terminal (31). The output of a voltage-multiplying circuit (40) of the charge-pump type is connected to the control terminal. The voltage-multiplying circuit (40) is of a symmetrical type, has first and second charge-storage means (41, 42), receiving a clock signal (CK) of a periodic type, and has a first circuit branch (44, 48) and a second circuit branch (45, 49), which are symmetrical to one another and operate in phase opposition with respect to the clock signal (CK).