Abstract:
A method for operating a flash memory device ( 100 ) is proposed. The memory device includes a matrix of memory cells ( 110 ) each one having a programmable threshold voltage (V T ) defining a value stored in the memory cell. The method includes the steps of crasing a block ( 115 ) of memory cells, and compacting the threshold voltages of the memory cells of the block within a predefined compacting range, wherein the step of compacting includes: selecting at least one first memory cell (110 0e ) of the block for writing a target value; restoring the threshold voltage of a subset (110 0e ; 110 1o ) of the memory cells of the block to the compacting range, the subset consisting of the at least one first memory cell (110 0e ) and/or at least one second memory cell of the block (110 1o ) being adjacent to the at least one first memory cell; and at least partially writing the target value into the at least one first memory cell.
Abstract:
A method (t1c-t9c) of erasing a flash memory (300) integrated in a chip of semiconductor material (175) and comprising at least one matrix (105) of cells (Mhk) with a plurality of rows and a plurality of columns made in at least one insulated body (165j), the cells of each row being connected to a corresponding word line (WLh); the method includes the step (t2c-t1c) of applying a single erasing pulse relative to a selected single one of the at least one body to a selected subset of the word lines for erasing the cells of each corresponding row made in the selected body with no intermediate check of the completion of the erasure.
Abstract:
An electrically-modifiable, non-volatile, semiconductor memory comprising a plurality of user memory locations which can be addressed individually from outside the memory in order to read and to modify user memory location, there is a corresponding pair of physical memory locations ((X1, Y1), (X2, Y2); WORDn) in the memory, which assume, alternatively, the functions of an active memory location and of a non-active memory location, the active memory location containing a previously-written datum and the non-active memory location being available for the writing of a new datum to replace the previously-written datum, so that, upon a request to replace the previous datum with the new datum, the previous datum is kept in the memory until the new datum has been written.
Abstract:
This invention relates to a method of adjusting the erase/program voltage in semiconductor non-volatile memories. The memories are formed of at least one matrix of memory cells having a floating gate, a control gate, and drain and source terminals, and are organised by the byte in rows (WL) and columns (BL), each byte comprising a group of cells having respective control gates connected in parallel with one another to a common control line (CG) through a selection element of the byte switch type, and each cell being connected to a respective control column (BL) through a selection element of the bit switch type. Advantageously, a double adjustment is provided for the program voltage of the memory cells, whereby the program voltage during the erasing phase can be higher in modulo than the program voltage during the writing phase. This is achieved by forming the bit switch element (20) inside a well (13) and the byte switch element (21) directly in the substrate.