Abstract:
When the threshold voltage of a cell of a four-level FLASH memory device, that includes an array of singularly addressable preliminarily erased memory cells each capable of storing a two-bit datum, is verified to have reached the desired distribution, the cell is read using a test read voltage smaller than or equal to the program voltage. In this situation the voltage V S on the source node is surely negligible and the programmed state of the cell may be correctly verified. A novel architecture of a page buffer is also provided.
Abstract:
A method for programming an electrically programmable memory (100) is provided. The electrically programmable memory includes a plurality of memory cells (110) arranged in individually-selectable memory cell sets each including at least one memory cell, a plurality of distinct memory cell programming states (201, 202, 203, 204) corresponding to a number N >=2 of data bits storable in each memory cell. The data bits include at least a first data bits group (LSB) and a second data bits group (MSB); the first data bits groups and, respectively, the second data bits groups stored in the memory cells of one of said individually-selectable memory cell sets form at least a first memory page and a second memory page, respectively, the first and second memory pages being individually addressable. The programming method comprises: - causing the memory cells of a selected memory cells set to be brought into a predetermined, starting programming state (201); - receiving a target value for the first data bits groups of the memory cells of the selected memory cells set; - receiving a target value for the second data bits groups of the memory cells of the selected memory cells set; - after having received the target values of both the first and the second data bits groups, applying to the memory cells of the selected memory cells set a programming sequence (350) adapted to cause the memory cells of the selected memory cells sets to be brought into a target programming state (201,202,203,204) jointly determined by the target values of the first and second data bits groups.
Abstract:
A memory device (100) is provided. The memory device includes a matrix (105) of memory cells (110) adapted to store data and arranged in a plurality of bit lines (BLe, BLo), the bit lines extending along a first direction (Y); a page buffer (130) adapted to interface the matrix with a downstream circuitry (125c, 140), the page buffer comprising a plurality of read/program units (205(i)). Each read/program unit is associated with and operatively couplable to at least one bit line. The memory device further includes at least two groups each including at least two respective read/program units, wherein the read/program units of a generic one of said groups are generically aligned along the first direction. The at least two groups are generically aligned along a second direction (X) transversal to the first direction. The memory device further includes at least one signal track (BITOUT) associated with each one of said groups for conveying signals corresponding to data read from the memory cells to the downstream circuitry are provided. Said at least one signal track is shared by the at least two read/program units of the corresponding group. The memory device further includes means (410) for selectively assigning the at least one signal track to one of the associated read/program unit at a time among the at least two read/program units of the group associated with said signal track.
Abstract:
A reading method of a NAND memory device including the steps of: first connecting a first end terminal (12a) of a stack (12) of cells (3, 3', 3") to a reference line (13); second connecting a second end terminal (12b) of the stack (12) of cells (3, 3', 3") to a respective bitline (10); charging the bitline (10) to a predetermined bitline read voltage (V DR ), wherein one of the steps of first connecting and second connecting is carried out before charging the bitline (10) and the other of the steps of first connecting and second connecting is carried out after charging the bitline (10). An order of carrying out the steps of first connecting and second connecting is determined based on an address (MSB; AL2) of a selected cell (3', 3") .
Abstract:
A method for operating a flash memory device ( 100 ) is proposed. The memory device includes a matrix of memory cells ( 110 ) each one having a programmable threshold voltage (V T ) defining a value stored in the memory cell. The method includes the steps of crasing a block ( 115 ) of memory cells, and compacting the threshold voltages of the memory cells of the block within a predefined compacting range, wherein the step of compacting includes: selecting at least one first memory cell (110 0e ) of the block for writing a target value; restoring the threshold voltage of a subset (110 0e ; 110 1o ) of the memory cells of the block to the compacting range, the subset consisting of the at least one first memory cell (110 0e ) and/or at least one second memory cell of the block (110 1o ) being adjacent to the at least one first memory cell; and at least partially writing the target value into the at least one first memory cell.
Abstract:
The evaluation time (Teval) of the programmed or erased state of a cell of the NAND memory array is set for the individual memory device in a way that at least partially compensates the generally large spread of parasitic capacitance values of the array bitlines in the mass production fabrication process of these devices.
Abstract:
The capacitive coupling between two adjacent bitlines of a NAND memory device is relevant and this may be exploited for boosting the voltage of bitlines that are not to be programmed in order to inhibit program operations on them. According to the disclosed method, first the even (odd) bitlines that include cells not to be programmed (BLE ,...,BLE ) are biased with a first voltage for inhibiting them from being programmed, typically the supply voltage (VDD), while the even (odd) bitlines that include cells to be programmed are grounded. Successively, the adjacent odd (even) bitlines (BLO ,...,BLO ) are biased at the supply voltage (VDD) or at an auxiliary voltage, for boosting the bias voltage of the even (odd) bitlines above the supply voltage. With this expedient, the bias voltage of the even (odd) bitlines that include cells not to be programmed is boosted because of the relevant parasitic coupling capacitances between adjacent bitlines. Therefore, no dedicated charge pump generator is needed.
Abstract:
A page buffer (130) comprised in an electrically programmable memory device (100) is provided. The memory device includes also a plurality of memory cells (110), a plurality of distinct programming states defined for each memory cell, corresponding to a number N>=2 of data bits storable in each memory cell, and at least one read/program unit (205) having a coupling line (SO) operatively associable with selected memory cells. The read/program unit is adapted to at least temporarily store data bits read from or to be written into selected memory cells and comprises programming state change enabling means (230-1,230-2,252,254,256,258,272,274,276,278) for selectively enabling a change in programming state of a selected memory cell by causing the coupling line to take one among a program enabling potential and a program inhibition potential. The programming state change enabling means comprises reading means (256,258,260,230-2), receiving means (252,254,230-1), and combining means (272,274) activatable during a combining phase. The combining means includes a coupling electrical path between the reading means and the receiving means, said coupling electrical line being kept isolated from the coupling electrical path during said combining phase.
Abstract:
A circuit comprises at least one memory cell ( 110 ) adapted to store data in terms of values of an electrical characteristic thereof, which exhibits a variability with temperature according to a first variation law; a voltage generator ( 300 ) is provided for generating a voltage (Vo) to be supplied to the at least one memory cell ( 110 ) for retrieving the data stored therein, the voltage generator including first means ( 305 ) adapted to cause the generated voltage take a value in a set of target values including at least one target value (Vr-1,Vr-2,Vr-3,Vfy-1,Vfy-2,Vfy-3), corresponding to an operation to be performed on the memory cell. The voltage generator comprises second means ( Mt,Rs,325, R1,R2,330 ) for causing the value taken by the generated voltage vary with temperature according to a prescribed second variation law exploiting a compensation circuit element ( Mt ) having said electrical characteristic.