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公开(公告)号:EP4246720A1
公开(公告)日:2023-09-20
申请号:EP22752988.0
申请日:2022-02-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: LEE, Juneseok , KIM, Youngsub , PARK, Sanghoon , PARK, Jungho , BAEK, Kwanghyun , LEE, Youngju , LEE, Jungyub , HA, Dohyuk , HEO, Jinsu
Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). According to various embodiments of the present disclosure, an antenna device may include a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include an RF routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements through a second surface of the second PCB opposite the first surface of the second PCB.
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12.
公开(公告)号:EP4049437A1
公开(公告)日:2022-08-31
申请号:EP20905614.2
申请日:2020-11-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: PARK, Sanghoon , LEE, Juneseok , HA, Dohyuk , LEE, Jungyub , HEO, Jinsu , LEE, Youngju
IPC: H04M1/02
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公开(公告)号:EP4033608A1
公开(公告)日:2022-07-27
申请号:EP20876541.2
申请日:2020-10-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: HA, Dohyuk , BAEK, Kwanghyun , LEE, Juneseok , HEO, Jinsu , LEE, Youngju , LEE, Jungyub
Abstract: The present disclosure relates to a 5 th generation (5G) or pre-5G communication system for supporting higher data transmission rates than a 4 th generation (4G) communication system such as long-term evolution (LTE). An antenna module in a wireless communication system includes: a printed circuit board (PCB); a radio frequency integrated circuit (RFIC); and a plurality of antenna elements for emitting a radio frequency (RF) signal, wherein the plurality of antenna elements may be disposed in a first area of a first surface of the PCB, and the RFIC may be disposed in a second area, different from the first area, of the first surface of the PCB.
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