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公开(公告)号:WO2021132916A1
公开(公告)日:2021-07-01
申请号:PCT/KR2020/017290
申请日:2020-11-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: PARK, Sanghoon , LEE, Juneseok , HA, Dohyuk , LEE, Jungyub , HEO, Jinsu , LEE, Youngju
IPC: H04M1/02 , H01Q1/1271 , H01Q1/246 , H01Q1/42
Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. Disclosed is a cover device configured to protect an antenna device embedded in an electronic device to radiate a beam of an ultra-high frequency band, the cover device including: a cover frame including a window area corresponding to a radiation area of the antenna device; and a functional structure disposed in the window area on the cover frame and having a stacked structure comprising one or more functional layers.
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公开(公告)号:EP4280382A1
公开(公告)日:2023-11-22
申请号:EP22752953.4
申请日:2022-02-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: KIM, Youngsub , PARK, Sanghoon , PARK, Jungho , BAEK, Kwanghyun , LEE, Youngju , LEE, Jungyub , LEE, Juneseok , HA, Dohyuk , HEO, Jinsu
Abstract: The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4th generation (4G) communication system such as long term evolution (LTE). According to various embodiments of the present disclosure, an antenna structure of a wireless communication system comprises: a first radiator; a first printed circuit board (PCB) in which the first radiator is arranged; a plurality of second radiators; a second PCB in which the plurality of second radiators are arranged; and a frame structure, wherein the frame structure is arranged such that an air layer is formed between the first PCB and the second PCB, and the plurality of second radiators can include a first metal patch arranged in a region corresponding to the first radiator, and a plurality of second metal patches arranged to be separated from the first metal patch so as to be fed by coupling.
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公开(公告)号:EP4184718A1
公开(公告)日:2023-05-24
申请号:EP21878020.3
申请日:2021-10-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: LEE, Juneseok , HEO, Jinsu , KIM, Youngsub , PARK, Jungho , BAEK, Kwanghyun , LEE, Youngju , JEONG, Kyoungho , HA, Dohyuk
Abstract: According to an embodiment of the present disclosure, an antenna device and/or an electronic device comprising same may comprise: a first antenna array including an array of multiple first radiation patches; a communication circuit configured to transmit and/or receive a wireless signal by using at least one of the first radiation patches; and at least one first isolator including a conductor and disposed at an area between two adjacent first radiation patches among the first radiation patches, wherein the first isolator comprises a first part, a second part disposed in parallel with the first part, and a third part for electrically connecting the first part and the second part, and the first part and the second part are configured to generate current flows having a phase difference of 180 degrees with respect to each other.
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公开(公告)号:EP4290692A1
公开(公告)日:2023-12-13
申请号:EP22811611.7
申请日:2022-05-24
Applicant: Samsung Electronics Co., Ltd.
Inventor: BAEK, Kwanghyun , KIM, Youngsub , KIM, Jinhoon , PARK, Chunmyung , LEE, Youngju , LEE, Juneseok , CHA, Wangi , HA, Dohyuk
Abstract: An electronic device is provided. The electronic device includes multiple antenna arrays, multiple first printed circuit board (PCB) sets corresponding to the multiple antenna arrays, a second PCB including a power interface, and a grid array configured to couple a first surface of each of first PCBs of the first PCB sets corresponding to an antenna array and a first surface of the second PCB, wherein the size of the first PCB is smaller than that of the second PCB, and a feeding line configured to transfer a signal to an antenna element is formed on at least one of a layer corresponding to the first surface of each of the first PCBs or a layer corresponding to the first surface of the second PCB.
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公开(公告)号:EP4243202A1
公开(公告)日:2023-09-13
申请号:EP22750060.0
申请日:2022-02-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: PARK, Sanghoon , BAEK, Kwanghyun , LEE, Juneseok , HA, Dohyuk , PARK, Jungho , LEE, Youngju , LEE, Jungyub , HEO, Jinsu
Abstract: The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). According to embodiments of the present disclosure, the antenna module comprises: a plurality of antennas; a first printed circuit board (PCB) on which the plurality of antennas are disposed; a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed; and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB and a coupling pad of the second PCB.
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6.
公开(公告)号:EP3700009A1
公开(公告)日:2020-08-26
申请号:EP20158279.8
申请日:2020-02-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: LEE, Juneseok , KUM, Junsig , BAEK, Kwanghyun , HA, Dohyuk , HEO, Jinsu , LEE, Youngju , LEE, Jungyub
Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module is provided. The antenna module includes a flexible printed circuit board (FPCB) including a first surface directed in a first direction and a second surface directed in a second direction that forms a predetermined first angle with respect to the first direction, a first antenna deployed on one surface of the first surface, and a second antenna deployed on one surface of the second surface.
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公开(公告)号:EP4318805A1
公开(公告)日:2024-02-07
申请号:EP22842478.4
申请日:2022-07-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: LEE, Juneseok , BAEK, Kwanghyun , HA, Dohyuk , PARK, Jungho , LEE, Sangho , LEE, Youngju , LEE, Wuseong
Abstract: The disclosure relates to a 5th Generation (5G) or pre-5G communication system for supporting a data transfer rate higher than that of a post-4th Generation (4G) communication system such as Long Term Evolution (LTE). According to embodiments of the disclosure, a radio unit (RU) module includes a first printed circuit board (PCB) on which a plurality of antenna elements are disposed; a second PCB on which a radio frequency integrated circuit (RFIC) is disposed; and a third PCB configured to electrically connect each of the plurality of antenna elements disposed on the first PCB and the RFIC disposed on the second PCB, wherein the size of the third PCB is smaller than the size of the first PCB and greater than the size of the second PCB, a first surface of the third PCB is coupled to a first surface of the first PCB through a grid array, and positions of feeding ports on the first surface of the third PCB correspond to positions in which ports of the plurality of antenna elements are disposed on a second surface opposite the first surface of the first PCB.
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公开(公告)号:EP4293826A1
公开(公告)日:2023-12-20
申请号:EP22811621.6
申请日:2022-05-24
Applicant: Samsung Electronics Co., Ltd.
Inventor: KIM, Youngsub , JUNG, Sohyeon , BAEK, Kwanghyun , LEE, Youngju , LEE, Juneseok , HA, Dohyuk
Abstract: An electronic device is provided. The electronic device includes a plurality of antenna arrays, a plurality of first printed circuit board (PCB) sets corresponding to the plurality of the antenna arrays, and a second PCB including a power interface, the second PCB may include a feeding line for delivering signals to the antenna elements, a first layer formed away from a first surface of the feeding line, and a second layer formed away from a second surface of the feeding line, and the second layer may include a metamaterial for transforming impedance.
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公开(公告)号:EP3957140A1
公开(公告)日:2022-02-23
申请号:EP20806733.0
申请日:2020-05-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: BAEK, Kwanghyun , LEE, Juneseok , HA, Dohyuk , LEE, Youngju , HEO, Jinsu
IPC: H05K3/40 , H05K3/46 , G06K19/077
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公开(公告)号:EP4391228A1
公开(公告)日:2024-06-26
申请号:EP22883883.5
申请日:2022-10-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: PARK, Sanghoon , PARK, Jungho , BAEK, Kwanghyun , LEE, Youngju , LEE, Jungyub , LEE, Juneseok , HA, Dohyuk , HEO, Jinsu
CPC classification number: H01Q21/28 , H01Q21/065 , H01Q1/246 , H01Q9/0414 , H01Q9/0457
Abstract: An antenna assembly is provided. The antenna assembly includes a first flexible printed circuit board (FPCB) for multiple first antennas, a second flexible printed circuit board (FPCB) for multiple second antennas, a metal plate including multiple holes, a first adhesive material layer for bonding between the metal plate and the first FPCB, and a second adhesive material layer for bonding between the metal plate and the second FPCB, wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas to be located in the multiple holes, respectively.
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