公开(公告)号：EP2125983A1

公开(公告)日：2009-12-02

申请号：EP08708586.6

申请日：2008-02-01

Applicant: TESA SE

Inventor： HUSEMANN, Marc ,  HANNEMANN, Frank

IPC: C09J7/00 ,  C09J7/02

CPC classification number: C09J7/403 ,  C09J7/35 ,  C09J2201/28 ,  C09J2201/61 ,  Y10T428/14 ,  Y10T428/24661

Abstract: The invention relates to a heat-activated planar element adhering without voids, comprising at least one heat-activatable adhesive mass, the one side surface thereof having a channel element. The channel element has at least one channel, which is adjusted to the transport of a fluid. The channel is recessed in the side surface of the planar element so that it is open toward the side surface. The channel extends continuously from an edge section of the side surface to a further edge section of the side surface. Via the channel structure formed by the at least one channel, liquid or gaseous fluids formed or collected in the adhesive surface can be removed from the adhesively bonding plane, thereby improving the strength of the adhesive bond. The invention further relates to a method for producing and applying said planar element.

公开(公告)号：EP2820098A1

公开(公告)日：2015-01-07

申请号：EP13705487.0

申请日：2013-02-22

Applicant: Tesa SE

Inventor： SCHMITZ-STAPELA, Daniel ,  DOLLASE, Thilo ,  REITER, Sven ,  HANNEMANN, Frank

IPC: C09J7/00 ,  C09J7/02 ,  C08K5/32 ,  C08K5/29 ,  B32B37/12 ,  B32B7/12 ,  B29C65/50 ,  C09J7/04

CPC classification number: C09J175/04 ,  B29C65/4835 ,  B29C65/5057 ,  B29C66/7422 ,  B32B7/12 ,  B32B37/0046 ,  B32B37/06 ,  B32B37/1207 ,  B32B37/26 ,  B32B38/004 ,  B32B38/1841 ,  B32B2037/1223 ,  B32B2037/268 ,  B32B2038/042 ,  B32B2305/186 ,  B32B2305/28 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/12 ,  B32B2311/24 ,  B32B2398/20 ,  B32B2457/00 ,  C08J5/12 ,  C09J5/00 ,  C09J5/06 ,  C09J7/00 ,  C09J7/10 ,  C09J7/35 ,  C09J2201/61 ,  C09J2205/102 ,  C09J2400/163 ,  C09J2400/226 ,  C09J2475/00 ,  Y10T156/10 ,  Y10T428/31605

Abstract: To adhesively bond eloxated aluminium to plastic, a product having at least one layer of a latently reactive adhesive film which has a thermoplastic component which has a melting point T(melting) such that 35°C ≤ T(melting) ≤ 90°C, in particular 40°C ≤ T(melting) ≤ 60°C, and contains functional groups which can react with isocyanate and an isocyanate-containing component which is dispersed in particulate form in the thermoplastic component and is essentially deactivated in the region of the particle surface, where the particles have a start temperature T(start) such that 40°C ≤ T(start) ≤100°C, in particular 45°C ≤ T(start) ≤ 90°C, particularly preferably 45°C ≤T(start) ≤ 75°C; where T(start) ≤ T(melting), is used. Laminates of eloxated aluminium with the abovementioned adhesive product and plastic are employed, in particular, in the electronics industry, e.g. in mobile telephones or laptop computers.

Abstract translation: 使用具有至少一层潜在反应性粘合剂膜的产品将氧化铝粘合到塑料上，该层具有熔点T（熔化）的热塑性组分，其中35℃≤T（熔化）≤90℃。 并且包含能够与异氰酸酯反应的官能团和以热塑性颗粒形式分散的含异氰酸酯的组分，并且在颗粒表面的区域中基本上失活，所述颗粒具有起始温度T（起始），其中40℃≤ T（起始）≤100℃，T（起始）≤T（熔融）。

公开(公告)号：EP1893708B1

公开(公告)日：2012-01-25

申请号：EP06761933.8

申请日：2006-05-24

Applicant: TESA SE

Inventor： HUSEMANN, Marc ,  HANNEMANN, Frank ,  KOOP, Matthias

IPC: C09J7/00 ,  C09J7/02 ,  C09J109/02 ,  C09J113/00 ,  C09J115/00 ,  C08L9/02

CPC classification number: C09J113/00 ,  C08L9/02 ,  C08L13/00 ,  C08L15/00 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/08 ,  C09J109/02 ,  C09J115/00

Abstract: Disclosed is a plastic film comprising at least one heat-activated adhesive material based on a mixture of at least one nitrile rubber (S1), at least one carboxy-terminated, amine-terminated, epoxy-terminated, or methacrylate-terminated nitrile butadiene rubber (S2) having an average molecular weight Mw = 20,000 g/mol, and at least one reactive resin.

公开(公告)号：EP2238815A2

公开(公告)日：2010-10-13

申请号：EP09705439.9

申请日：2009-01-21

Applicant: TESA SE

Inventor： HUSEMANN, Marc ,  HANNEMANN, Frank ,  BRODBECK, Markus

IPC: H05K3/00

CPC classification number: H05K3/0061 ,  B32B37/10 ,  B32B2309/68 ,  B32B2457/08 ,  H05K1/0393 ,  H05K3/0064 ,  H05K3/386 ,  H05K2203/068 ,  H05K2203/085

Abstract: A method for producing circuit boards, comprising a process for modifying a flexible circuit board, in particular for the stabilization thereof, characterized by at least the following method steps: a) providing a planar formation ("reinforcement plate") having lower flexibility than that of the flexible circuit board, b) hot laminating an adhesive film, which can be activated by heat, on the reinforcement plate, c) placing the laminate made of adhesive film and reinforcement plate with the adhesive film side on the flexible circuit board, d) introducing the component made of reinforcement plate, adhesive film, and flexible circuit board into a partial vacuum atmosphere, e) hot laminating the component with application of pressure and heat.

公开(公告)号：EP2087056A1

公开(公告)日：2009-08-12

申请号：EP07822289.0

申请日：2007-11-07

Applicant: TESA SE

Inventor： HUSEMANN, Marc ,  HANNEMANN, Frank ,  KOOP, Matthias

IPC: C09J7/00 ,  C09J7/02 ,  C09J109/02

CPC classification number: C09J109/02 ,  C08L61/00 ,  C08L61/06 ,  C08L61/28 ,  C08L63/00 ,  C08L75/00 ,  C08L2666/04 ,  C08L2666/14 ,  C09J7/10 ,  C09J7/35 ,  C09J2409/00 ,  Y10T428/2813

Abstract: A heat-activated adhesive-bondable sheet-like element is described with a first adhesive mass and a second adhesive mass, the element being suitable for the adhesive bonding of objects with metal surface to objects with plastics surface, and, even at low temperatures, can give a stable and mechanically strong adhesive bond. This is achieved via use of particular, mutually matched combinations of different adhesive masses based on synthetic nitrile rubbers and reactive resins.

公开(公告)号：EP1893709B1

公开(公告)日：2012-10-10

申请号：EP06761934.6

申请日：2006-05-24

Applicant: TESA SE

Inventor： HUSEMANN, Marc ,  HANNEMANN, Frank ,  KOOP, Matthias

IPC: C09J7/00 ,  C09J7/02 ,  C08L9/02 ,  C09J109/02 ,  B29K105/00 ,  B29K305/02 ,  B29K305/12

CPC classification number: C09J109/02 ,  B29C65/4825 ,  B29C65/483 ,  B29C65/4865 ,  B29C65/5021 ,  B29C65/5057 ,  B29C65/8207 ,  B29C65/8238 ,  B29C66/1122 ,  B29C66/43 ,  B29C66/71 ,  B29C66/742 ,  B29K2027/06 ,  B29K2055/02 ,  B29K2069/00 ,  B29K2105/0088 ,  B29K2305/02 ,  B29K2305/12 ,  C08L9/02 ,  C08L61/00 ,  C08L63/00 ,  C08L2666/02 ,  C09J7/10 ,  C09J7/35 ,  C09J2409/00 ,  C09J2461/00 ,  C09J2463/00 ,  Y10T428/28 ,  B29C65/00

公开(公告)号：EP2820098B1

公开(公告)日：2018-04-04

申请号：EP13705487.0

申请日：2013-02-22

Applicant: tesa SE

Inventor： SCHMITZ-STAPELA, Daniel ,  DOLLASE, Thilo ,  REITER, Sven ,  HANNEMANN, Frank

IPC: B32B37/12 ,  C09J7/00 ,  C09J7/02 ,  C09J5/06 ,  C09J175/04

CPC classification number: C09J175/04 ,  B29C65/4835 ,  B29C65/5057 ,  B29C66/7422 ,  B32B7/12 ,  B32B37/0046 ,  B32B37/06 ,  B32B37/1207 ,  B32B37/26 ,  B32B38/004 ,  B32B38/1841 ,  B32B2037/1223 ,  B32B2037/268 ,  B32B2038/042 ,  B32B2305/186 ,  B32B2305/28 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/12 ,  B32B2311/24 ,  B32B2398/20 ,  B32B2457/00 ,  C08J5/12 ,  C09J5/00 ,  C09J5/06 ,  C09J7/00 ,  C09J7/10 ,  C09J7/35 ,  C09J2201/61 ,  C09J2205/102 ,  C09J2400/163 ,  C09J2400/226 ,  C09J2475/00 ,  Y10T156/10 ,  Y10T428/31605

公开(公告)号：EP3003688A1

公开(公告)日：2016-04-13

申请号：EP14726170.5

申请日：2014-05-26

Applicant: tesa SE

Inventor： SULKAKOSKI, Kim ,  HANNEMANN, Frank ,  FISCHER, Alexander

IPC: B29C65/14 ,  B29C65/00

CPC classification number: B32B37/12 ,  B32B37/10 ,  B32B38/0008 ,  B32B2457/20 ,  B32B2457/208 ,  B32B2551/00 ,  C09J5/06 ,  C09J2205/31 ,  F16B11/006

Abstract: The invention relates to a method for adhesively bonding two substrates by means of an adhesive film that can be made to bond adhesively by being activated with heat, wherein - the adhesive film is not adhesive at room temperature, - in a first step the adhesive film is laminated in a heated state onto the first of the substrates to be adhesively bonded, - after the lamination, the side of the adhesive film that is not in contact with the first substrate to be adhesively bonded is initially exposed, in order to be able to be brought into contact with the second substrate to be adhesively bonded, characterized in that - the adhesive film is activated by irradiating with electromagnetic radiation in the near infrared range (NIR), by heating to a temperature T
K above the lowest activation temperature T
A,u , and the adhesive bonding with the second substrate to be adhesively bonded is brought about by means of the activation by the NIR radiation.

公开(公告)号：EP2225796A1

公开(公告)日：2010-09-08

申请号：EP08865019.7

申请日：2008-12-12

Applicant: TESA SE

Inventor： HUSEMANN, Marc ,  HANNEMANN, Frank ,  KOOP, Matthias

IPC: H01Q1/20 ,  H01Q1/38 ,  H05K3/00

CPC classification number: H01Q1/38 ,  H01Q1/20 ,  H05K3/202 ,  H05K3/386 ,  H05K2203/0191 ,  H05K2203/1105 ,  H05K2203/1476 ,  Y10T29/49016 ,  Y10T428/2813 ,  Y10T428/2852

Abstract: The invention discloses a method for producing an antenna system having at least one metal antenna unit and at least one carrier unit, wherein said antenna unit is connected in a first connection step to a heat-activated surface element, which can be glued, and the heat-activated surface element, which can be glued, is connected in a second connection step to the carrier unit, wherein the heating of said surface element in the second connection step occurs through said antenna unit. Furthermore, a surface element which is particularly suitable for this method and the products obtained therefrom are disclosed.

公开(公告)号：EP3992260A1

公开(公告)日：2022-05-04

申请号：EP21177037.5

申请日：2021-06-01

Applicant: tesa SE

Inventor： KEITE-TELGENBÜSCHER, Dr. Klaus ,  MOEHRKE, Claudia ,  HANNEMANN, Frank ,  KRAMP, Stefan

IPC: C09J7/10 ,  C09J175/06 ,  C09J167/00 ,  C08G63/91

Abstract: Die Erfindung betrifft einen reaktiven Haftklebstoffilm mit (a) einer polymeren Filmbildner-Matrix, (b) einer oder mehreren Reaktivkomponente(n) in einem Masseanteil von zumindest 30 Gew.-%, bezogen auf die Summe der Komponenten (a), (b) und (c), und (c) einem Reagenz, ausgewählt aus einem Initiator, insbesondere Radikalinitiator, oder einem Härter oder einem Aktivator, wobei die polymere Filmbildner-Matrix zu mindestens 50 Gew.-% ein kristallisierbares Polymer ist, das beim Abkühlen ausgehend von einer Temperatur, die mindestens 30 K oberhalb der Peaktemperatur des Schmelzpeaks liegt, zumindest aber 100 °C beträgt, bei einer Abkühlgeschwindigkeit von 10 K/min in der dynamischen Differenzkalorimetrie (DSC) eine Kristallisationsenthalpie von weniger als 1 J/g aufweist.