公开(公告)号：WO2005086532A3

公开(公告)日：2006-01-26

申请号：PCT/US2005006565

申请日：2005-03-01

Applicant: TESSERA INC ,  HUMPSTON GILES ,  OSBORN PHILIP R ,  THOMPSON JESSE BURL ,  KUBOTA YOICHI ,  TSENG CHUNG-CHUAN ,  BURTZLAFF ROBERT ,  HABA BELGACEM ,  TUCKERMAN DAVID B ,  WARNER MICHAEL

Inventor： HUMPSTON GILES ,  OSBORN PHILIP R ,  THOMPSON JESSE BURL ,  KUBOTA YOICHI ,  TSENG CHUNG-CHUAN ,  BURTZLAFF ROBERT ,  HABA BELGACEM ,  TUCKERMAN DAVID B ,  WARNER MICHAEL

IPC: B81B7/00 ,  H01L23/495 ,  H04R19/00 ,  H04R19/04

CPC classification number: B81B7/0077 ,  B81B2201/0257 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10155 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/3025 ,  H04R19/005 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed to one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chop and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of the said device and from said device.

Abstract translation: 本文公开了封装芯片的各种实施例及其制造方法。 本文公开的一种这样的封装芯片包括具有前表面，与正面相对的后表面的芯片和在前表面和后表面中的一个处的器件，该器件可操作为声能和电磁能中的至少一个的换能器 并且所述芯片包括暴露于所述前表面和后表面中的一个的多个接合焊盘。 封装芯片包括具有介电元件和设置在电介质元件上的金属层的封装元件，封装元件具有面向斩波的内表面和背离芯片的外表面。 金属层包括暴露在内表面和外表面中的至少一个的多个触点，触点导电地连接到接合焊盘。 金属层还包括第一开口，用于沿着所述装置和所述装置中的至少一个的方向通过声能和电磁能中的至少一个。

公开(公告)号：WO2009020572A3

公开(公告)日：2009-05-22

申请号：PCT/US2008009353

申请日：2008-08-01

Applicant: TESSERA TECH HUNGARY KFT ,  TESSERA INC ,  AVSIAN OSHER ,  GRINMAN ANDREY ,  HUMPSTON GILES ,  MARGALIT MOTI

Inventor： AVSIAN OSHER ,  GRINMAN ANDREY ,  HUMPSTON GILES ,  MARGALIT MOTI

IPC: H01L21/98 ,  H01L23/538 ,  H01L25/065

CPC classification number: H01L25/00 ,  H01L21/50 ,  H01L21/568 ,  H01L24/24 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A stacked microelectronic unit (80) is provided which has a top surface (34) and a bottom surface remote from the top surface and a plurality of vertically stacked microelectronic elements (12, 12A) therein, including at least one microelectronic element (12A) having a front face (14A) adjacent to the top surface and a rear face (16A) oriented towards the bottom surface. Each of the microelectronic elements (12, 12A) has traces (24, 24A) extending from contacts (22, 22A) at the front face beyond edges of the microelectronic element. A dielectric layer (116) contacts edges of the microelectronic elements and underlies the rear face of the at least one microelectronic element. Leads are connected to the traces (24, 24A) extending along the dielectric layer (116). Unit contacts (74), exposed at the top surface, are connected to the leads (66).

Abstract translation: 提供堆叠微电子单元（80），其具有远离顶表面的顶表面（34）和底表面以及其中包括至少一个微电子元件（12A）的多个垂直堆叠微电子元件（12,12A） 具有与顶面相邻的前面（14A）和面向底面的后面（16A）。 微电子元件（12,12A）中的每一个具有从正面处的触点（22,22A）延伸超过微电子元件的边缘的迹线（24,24A）。 介电层（116）接触微电子元件的边缘并位于至少一个微电子元件的背面之下。 引线连接到沿电介质层（116）延伸的迹线（24,24A）。 暴露在顶表面的单元触点（74）连接到引线（66）。

公开(公告)号：WO2009017835A3

公开(公告)日：2009-04-16

申请号：PCT/US2008009356

申请日：2008-07-31

Applicant: TESSERA INC ,  HABA BELGACEM ,  HUMPSTON GILES ,  MARGALIT MOTI

Inventor： HABA BELGACEM ,  HUMPSTON GILES ,  MARGALIT MOTI

IPC: H01L21/60 ,  H01L23/12

CPC classification number: H01L21/76898 ,  H01L21/76805 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/12 ,  H01L24/18 ,  H01L24/82 ,  H01L24/95 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A microelectronic unit 400 can include a semiconductor element 401 having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts 403 at the front surface and a rear surface remote from the front surface. The semiconductor element 401 can have through holes 410 extending from the rear surface through the semiconductor element 401 and through the contacts 403. A dielectric layer 411 can line the through holes 410. A conductive layer 412 may overlie the dielectric layer 411 within the through holes 410. The conductive layer 412 can conduct ively interconnect the contacts 403 with unit contacts.

Abstract translation: 微电子单元400可以包括具有前表面的半导体元件401，与前表面相邻的微电子半导体器件，在前表面处的触点403和远离前表面的后表面。 半导体元件401可以具有从后表面延伸穿过半导体元件401并穿过触点403的通孔410.电介质层411可以将通孔410排成线。导电层412可以覆盖通孔内的电介质层411 410.导电层412可以导电地将触点403与单元触点互连。

公开(公告)号：WO2009017758A2

公开(公告)日：2009-02-05

申请号：PCT/US2008009207

申请日：2008-07-25

Applicant: TESSERA INC ,  MIRKARIMI LAURA ,  HABA BELGACEM ,  HUMPSTON GILES ,  OVRUTSKY DAVID

Inventor： MIRKARIMI LAURA ,  HABA BELGACEM ,  HUMPSTON GILES ,  OVRUTSKY DAVID

IPC: H01L25/065 ,  H01L21/98

CPC classification number: H01L21/50 ,  H01L24/24 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/04105 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements (12, 12A) each having a front surface (117), contacts (22) exposed at the front surface, a rear surface (118) and edges (18, 20) extending between the front and rear surfaces. Traces (24) connected with the contacts may extend along the front surfaces towards edges of the microelectronic elements with the rear surface of at least one of the stacked microelectronic elements being adjacent to a top face (90) of the microelectronic unit. A plurality of conductors (66) may extend along edges of the microelectronic elements from the traces (24) to the top face (90). The conductors may be conductively connected with unit contacts (76) such that the unit contacts overlie the rear surface (118) of the at least one microelectronic element (12A) adjacent to the top face.

Abstract translation: 提供了一种堆叠微电子单元，其可以包括多个垂直堆叠的微电子元件（12,12A），每个微电子元件具有前表面（117），暴露在前表面处的触点（22），后表面（118）和边缘 ，20）在前表面和后表面之间延伸。 与触点连接的迹线（24）可以沿着前表面朝向微电子元件的边缘延伸，其中至少一个堆叠的微电子元件的后表面与微电子单元的顶面（90）相邻。 多个导体（66）可以沿着微电子元件的边缘从迹线（24）延伸到顶面（90）。 导体可以与单元触点（76）导电连接，使得单元接触覆盖邻近顶面的至少一个微电子元件（12A）的后表面（118）。

公开(公告)号：WO2008048666A3

公开(公告)日：2008-07-10

申请号：PCT/US2007022233

申请日：2007-10-17

Applicant: TESSERA INC ,  HUMPSTON GILES ,  GAO GUILIAN ,  HABA BELGACEM

Inventor： HUMPSTON GILES ,  GAO GUILIAN ,  HABA BELGACEM

IPC: H01L23/498

CPC classification number: H01L23/4985 ,  H01L23/49811 ,  H01L24/48 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package 700 includes a microelectronic element 702 having contacts 706, a flexible substrate 712 spaced from and overlying the microelectronic element and a plurality of conductive posts 726 extending from the flexible substrate 712 and projecting away from the microelectronic element 702. The conductive posts are electrically interconnected with the microelectronic element. Each conductive post has a conductive base 728 that is in contact with the flexible substrate 712 and a conductive tip 730 that extends from the base, with the base of the conductive post having a larger diameter than the tip of the conductive post. In certain embodiments, the conductive base and the conductive tip have a cylindrical shape.

Abstract translation: 微电子封装700包括微电子元件702，微电子元件702具有触点706，与微电子元件间隔开并且覆盖微电子元件的柔性衬底712以及从柔性衬底712延伸并远离微电子元件702突出的多个导电柱726。 与微电子元件电互连。 每个导电柱具有与柔性衬底712接触的导电基部728和从基部延伸的导电尖端730，其中导电柱的基部的直径大于导电柱的尖端的直径。 在某些实施例中，导电基底和导电尖端具有圆柱形状。

公开(公告)号：WO2006004671A3

公开(公告)日：2006-05-04

申请号：PCT/US2005022750

申请日：2005-06-24

Applicant: TESSERA INC ,  HUMPSTON GILES ,  BEROZ MASUD ,  TUCKERMAN DAVID B

Inventor： HUMPSTON GILES ,  BEROZ MASUD ,  TUCKERMAN DAVID B

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L21/563 ,  H01L21/4853 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/0221 ,  H05K2201/0379 ,  H05K2201/10234 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package includes a microelectronic element having faces and contacts, and a flexible substrate spaced from and overlying a first face of the microelectronic element, the flexible substrate having conductive pads facing away from the first face of the microelectronic element. The package includes a plurality of spheres attached to the conductive pads of the flexible substrate and projecting away from the first face of the microelectronic element, each sphere having a contact surface remote from the conductive pads, the contact surfaces of the spheres including a contact metal devoid of solder. The package also includes a plurality of support elements disposed between the microelectronic element and the substrate for supporting the flexible substrate over the microelectronic element, the spheres being offset from the support elements.

Abstract translation: 微电子封装包括具有面和触点的微电子元件，以及与微电子元件的第一面间隔开并覆盖微电子元件的第一面的柔性基板，柔性基板具有背离微电子元件的第一面的导电焊盘。 该封装包括附接到柔性基板的导电焊盘并且远离微电子元件的第一面突出的多个球体，每个球体具有远离导电焊盘的接触表面，球体的接触表面包括接触金属 没有焊料。 封装还包括多个支撑元件，其设置在微电子元件和基板之间，用于将柔性基板支撑在微电子元件上，该球体与支撑元件相抵消。