公开(公告)号：US20180190556A1

公开(公告)日：2018-07-05

申请号：US15396121

申请日：2016-12-30

Applicant: Texas Instruments Incorporated

Inventor： Barry Jon Male ,  Steve Kummerl ,  Robert Alan Neidorff ,  Benjamin Stassen Cook

IPC: H01L23/31 ,  H02H9/04 ,  H01L23/495 ,  H01L27/02 ,  H01L21/48 ,  H01L21/56

Abstract: In a described example, an apparatus includes: an integrated circuit die having multiple terminals; a leadframe having leads for external connections, at least some of the leads electrically coupled to at least one of the multiple terminals of the integrated circuit die; a first electrode having a first end portion; a second electrode having a second end portion positioned proximal to and spaced apart from the first end portion of the first electrode, the first end portion and the second end portion spaced by a spark gap; encapsulation material surrounding the integrated circuit die to form a packaged integrated circuit having a cavity surrounding the first end portion, the second end portion, and the spark gap so that the first end portion of the first electrode, the second end portion of the second electrode and the spark gap are spaced from the encapsulation material.

公开(公告)号：US09761543B1

公开(公告)日：2017-09-12

申请号：US15385098

申请日：2016-12-20

Applicant: Texas Instruments Incorporated

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L23/00 ,  H01L23/38 ,  H01L23/495 ,  H01L23/31 ,  H01L23/34 ,  H01L23/498 ,  H01L27/02

CPC classification number: H01L23/562 ,  H01L23/3107 ,  H01L23/315 ,  H01L23/345 ,  H01L23/38 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49861 ,  H01L27/0248 ,  H01L35/32 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: Integrated circuits with a molded package including a cavity and a semiconductor die spaced from an interior surface of the molded package within the cavity. The semiconductor die includes one or more electrical components, a thermal control component to control the temperature of the electrical component, and a driver to provide a current or voltage signal to the thermal control component at least partially according to a setpoint signal.

公开(公告)号：US12187601B2

公开(公告)日：2025-01-07

申请号：US16247118

申请日：2019-01-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L23/28 ,  B81B7/00 ,  B81C1/00 ,  H01L21/02 ,  H01L21/56 ,  H01L31/0203

Abstract: Described examples include sensor apparatus and integrated circuits having a package structure with an internal cavity and an opening that connects of the cavity with an ambient condition of an exterior of the package structure, and an electronic sensor structure mechanically supported by wires in the cavity and including a sensing surface exposed to the cavity to sense the ambient condition of an exterior of the package structure.

公开(公告)号：US11264369B2

公开(公告)日：2022-03-01

申请号：US16859345

申请日：2020-04-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon Male ,  Benjamin Stassen Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L25/16 ,  H01F38/14 ,  H01L31/0203 ,  H01L31/101 ,  H01L23/31 ,  H01L23/49 ,  H01L23/495 ,  H01L49/02 ,  H01L31/02 ,  H01L31/103 ,  H01L31/11 ,  H01L31/167 ,  H01L33/62 ,  H04B10/80 ,  H01L33/00 ,  H01L33/60 ,  H01L23/00

Abstract: In described examples, an integrated circuit includes a leadframe structure, which includes electrical conductors. A first coil structure is electrically connected to a first pair of the electrical conductors of the leadframe structure. The first coil structure is partially formed on a semiconductor die structure. A second coil structure is electrically connected to a second pair of the electrical conductors of the leadframe structure. The second coil structure is partially formed on the semiconductor die structure. A molded package structure encloses portions of the leadframe structure. The molded package structure exposes portions of the first and second pairs of the electrical conductors to allow external connection to the first and second coil structures. The molded package structure includes a cavity to magnetically couple portions of the first and second coil structures.

公开(公告)号：US20200258874A1

公开(公告)日：2020-08-13

申请号：US16859345

申请日：2020-04-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon Male ,  Benjamin Stassen Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L25/16 ,  H01L33/00 ,  H04B10/80 ,  H01L33/62 ,  H01L31/167 ,  H01L31/11 ,  H01L31/103 ,  H01L31/02 ,  H01L49/02 ,  H01L23/495 ,  H01L23/49 ,  H01L23/31 ,  H01F38/14 ,  H01L31/101 ,  H01L31/0203

Abstract: In described examples, an integrated circuit includes a leadframe structure, which includes electrical conductors. A first coil structure is electrically connected to a first pair of the electrical conductors of the leadframe structure. The first coil structure is partially formed on a semiconductor die structure. A second coil structure is electrically connected to a second pair of the electrical conductors of the leadframe structure. The second coil structure is partially formed on the semiconductor die structure. A molded package structure encloses portions of the leadframe structure. The molded package structure exposes portions of the first and second pairs of the electrical conductors to allow external connection to the first and second coil structures. The molded package structure includes a cavity to magnetically couple portions of the first and second coil structures.

公开(公告)号：US20190356212A1

公开(公告)日：2019-11-21

申请号：US16529227

申请日：2019-08-01

Applicant: Texas Instruments Incorporated

Inventor： Robert Alan Neidorff ,  Joseph Maurice Khayat

IPC: H02M1/08 ,  H03K17/16 ,  H02M3/158 ,  H02M3/156

Abstract: Methods and apparatus to increase efficiency of a power converter using a bias voltage on a low side drive gate are disclosed. An example power converter includes an inductor; a transistor coupled to the inductor; and a driver coupled to a gate of the transistor, the driver to apply (A) a first voltage to the gate to enable the transistor, (B) a second voltage to the gate to disable the transistor, and (C) a third voltage to the gate during a transition between applying the first voltage and the second voltage, the third voltage being between the first voltage and the second voltage.

公开(公告)号：US10424551B2

公开(公告)日：2019-09-24

申请号：US15913497

申请日：2018-03-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L23/66 ,  H01L23/31 ,  H01L21/56 ,  G02B27/09 ,  G02B3/08 ,  G02B19/00

Abstract: In described examples of forming an integrated circuit wave device, a method includes: (a) affixing an integrated circuit die relative to a substrate; (b) creating a form relative to the integrated circuit die and the substrate; and (c) forming a wave shaping member having a shape conforming at least in part to a shape of the form.

公开(公告)号：US10074639B2

公开(公告)日：2018-09-11

申请号：US15395584

申请日：2016-12-30

Applicant: Texas Instruments Incorporated

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L25/16 ,  H01F38/14 ,  H01L23/31 ,  H01L23/49 ,  H01L23/495 ,  H01L49/02 ,  H01L31/02 ,  H01L31/103 ,  H01L31/11 ,  H01L31/167 ,  H01L33/62 ,  H04B10/80 ,  H01L23/00

CPC classification number: H01L25/167 ,  H01F38/14 ,  H01L23/315 ,  H01L23/49 ,  H01L23/49575 ,  H01L24/08 ,  H01L24/48 ,  H01L24/85 ,  H01L28/10 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/101 ,  H01L31/103 ,  H01L31/1105 ,  H01L31/167 ,  H01L33/00 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/08113 ,  H01L2224/48091 ,  H01L2224/48149 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H04B10/803 ,  H01L2224/45099

Abstract: Disclosed examples include integrated circuits with a leadframe structure, a first circuit structure including a light source configured to generate a light signal along an optical path, a second circuit structure including a light sensor facing the optical path to receive the light signal, and a molded package structure enclosing portions of the leadframe structure, the molded package structure having a cavity defined by an interior surface of the molded package structure, the optical path extending in the cavity between the first and second circuit structures.

公开(公告)号：US20190144267A1

公开(公告)日：2019-05-16

申请号：US16247118

申请日：2019-01-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: B81B7/00 ,  B81C1/00

Abstract: Described examples include sensor apparatus and integrated circuits having a package structure with an internal cavity and an opening that connects of the cavity with an ambient condition of an exterior of the package structure, and an electronic sensor structure mechanically supported by wires in the cavity and including a sensing surface exposed to the cavity to sense the ambient condition of an exterior of the package structure.

公开(公告)号：US10179730B2

公开(公告)日：2019-01-15

申请号：US15372565

申请日：2016-12-08

Applicant: Texas Instruments Incorporated

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L21/56 ,  H01L21/02 ,  H01L21/00 ,  H01L31/0203 ,  H01L23/28 ,  B81B7/00 ,  B81C1/00

Abstract: Disclosed examples include sensor apparatus and integrated circuits having a package structure with an internal cavity and an opening that connects of the cavity with an ambient condition of an exterior of the package structure, and an electronic sensor structure mechanically supported by wires in the cavity and including a sensing surface exposed to the cavity to sense the ambient condition of an exterior of the package structure.