ENDURANCE IMPROVED ABRASIVES
    11.
    发明专利

    公开(公告)号:JPS61279469A

    公开(公告)日:1986-12-10

    申请号:JP12053585

    申请日:1985-06-05

    Abstract: PURPOSE:To obtain endurance improved new abrasives of extremely excellent abrasive performance by electro-statically transplanting the cut piles of ceramic fiber mingled with cut piles made of specified amount of reinforcing fiber together with transplant binder on base material. CONSTITUTION:The cut piles of ceramic fiber such as silicon cabide fiber, silicon nitriding fiber, molten alumina fiber or the like mingled with reinforcing fiber cut piles of 1 to 50%, or 5 to 20% desirably, in weight are electro-statically transplanted together with transplanted binder on base material. For reinforcing fiber such synthetic fiber as carbon fiber, aramid fiber, polyester fiber, polyamid fiber, and polyolefine fiber, metallic fiber, and glass fiber are recommended. Acrylic resin, polyurethane resin, polyester resin, polyamide resin, epoxy resin, and nylon resin or the compound are suitable for transplant binder, and are to be used depending upon the kinds of cut piles of reinforcing fiber and base material.

    SURFACE MATERIAL FOR DECORATION AND MANUFACTURE THEREOF

    公开(公告)号:JPH04135839A

    公开(公告)日:1992-05-11

    申请号:JP25716690

    申请日:1990-09-28

    Abstract: PURPOSE:To form easily a sophisticated shade and shadow pattern like that of a natural stone such as granite or marble in which the density of dotted pattern is varied unevenly by scattering a lot of chips on a colored bonding agent with the density of scattering locally varied and subjecting the chips to contact bonding after they are dried. CONSTITUTION:A colored bonding agent layer of substantial transparency is formed in even thickness on one face of a transparent film base. A number of chips are scattered on the colored bonding agent layer in a manner that the scattering density of at least a part of scattered chips is varied locally. Inorganic particles are settled and impregnated in the bonding agent layer, and a very small part of respective plastic chips is bonded as a bonding agent, and a natural material absorbs the bonding agent while flowing on the surface of the bonding agent layer and bonded with. The chip bonded film is dried with hot air. When the bonding agent layer flows at the time of dry heating, the scattering density of chips gets more uneven. The bonding agent layer is dried and fixed, and then heated, compressed and rolled to fix the scattered chips by compression bonding (rolling) on the colored bonding agent layer.

    SURFACE MATERIAL FOR DECORATION AND MANUFACTURE THEREOF

    公开(公告)号:JPH04135835A

    公开(公告)日:1992-05-11

    申请号:JP25716290

    申请日:1990-09-28

    Abstract: PURPOSE:To form easily a shade and shadow pattern of deep taste of a natural stone such as granite or marble by scattering chips composed of water- absorption substance partially on a colored layer in a manner of imbedding, drying, and then fixing by contact bonding the non-imbedded sections of chips on the colored bonding agent layer. CONSTITUTION:When chips 3a and 3b composed of a water-absorption substance is scattered over a colored bonding agent layer 2 applied in uniform thickness on one face of a transparent film 1, the chips 3a and 3b are settled partially in the bonding agent layer 2 by their own weight and the bonding agent is absorved into the chips 3a and 3b partially. The same is dried and fixed in the state, and when a non-imbedded section of the bonding agent layer of chips is rolled or fixed by contact bonding, a surface material for decoration 4 is manufactured.

    METHOD AND DEVICE FOR FLOCKING PILE

    公开(公告)号:JPS63224764A

    公开(公告)日:1988-09-19

    申请号:JP5901587

    申请日:1987-03-16

    Abstract: PURPOSE:To retard the curling of hair even if a pressure is exerted on the surface of the obtained suede product, by supplying cut piles which are dispersed and scattered in air by compressed air, uniformly sprinkling the piles over the surface of a base material in random directions and adhering the piles to the surface. CONSTITUTION:An inlet for the base material 2 and an outlet for the base material are provided to the main device body 4 having a closed space. Piles are supplied by a pile feeder 24 into the main device body 4. The piles are dispersed and scattered in the main device body by the compressed air supplied from supply parts 10 and 11. The compressed air is discharged from the discharge part 13 provided with a filter 12, and surplus piles scattered by compressed air are recirculated to the feeder 24 by pile circulating systems 14 and 15. By this method, the supplied cut piles are dispersed and scattered in air by compressed air, sprinkled over the substrate surface in random directions, and adhered to the surface. As a result, a flocked article having the warmness and softness of the fiber is obtained.

    SURFACE MATERIAL FOR DECORATION AND MANUFACTURE THEREOF

    公开(公告)号:JPH04135838A

    公开(公告)日:1992-05-11

    申请号:JP25716590

    申请日:1990-09-28

    Abstract: PURPOSE:To manufacture a surface material for decoration with a pattern of uneven blots or stains which is found on a natural stone such as granite or marble by scattering a number of chips on a colored bonding agent layer, dropping dilute solution of a bonding agent same as said colored bonding agent or different from locally and unevenly and fixing scattered chips by contact bonding. CONSTITUTION:A colored bonding agent layer of substantial transparency is provided in even thickness on one face of a transparent film base, and a number of chips are scattered on the colored bonding agent layer. Dilute solution of a bonding agent same as the colored bonding agent applied first or different from said agent is dropped, and the flow and oozing-in of dropped dilute solution are carried out in an irregular manner by the difference of density of chip particles and difference of water-absorption force and the like to form a pattern looking like rain leakage marks or stains. Said film is hot air dried, and the bonding agent layer is fixed and then heated and compression rolled, and the chips are fixed on the bonding agent layer by contact bonding.

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