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公开(公告)号:DE3785329D1
公开(公告)日:1993-05-13
申请号:DE3785329
申请日:1987-08-03
Applicant: TORAY INDUSTRIES
Inventor: NAKAMURA KIYOKAZU , KOMETANI KIICHI , KOSHINO AKIHIKO , HORIUCHI KENJIRO
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公开(公告)号:EP0180648A4
公开(公告)日:1986-10-02
申请号:EP85902151
申请日:1985-04-26
Applicant: TORAY INDUSTRIES
Inventor: HORIUCHI KENJIRO - AZA YAKIYAM , KOMETANI KIICHI , INOUE TOSHIHIDE
IPC: C08L23/04 , C08G59/00 , C08L7/00 , C08L21/00 , C08L23/00 , C08L33/00 , C08L33/02 , C08L51/00 , C08L51/02 , C08L63/00 , C08L67/00 , C08L67/02 , C08L69/00 , C08L87/00 , C08L101/00 , H01B3/42
CPC classification number: H01B3/426 , C08L67/02 , C08L69/00 , H01B3/421 , C08L23/025 , C08L2666/02
Abstract: A polyester composition comprising (a) an aromatic polyester having a relative viscosity of 1.2 to 20, (b) an aromatic polycarbonate having a number-average molecular weight of 10,000 to 80,000, and (c) a glycidyl group-containing copolymer of 0.1 to 100 in melt index containing as major components an alpha-olefin and a glycidyl ester of an alpha, beta-unsaturated acid. This composition possesses excellent fluidity and residence stability upon molding, and excellent mechanical properties, particularly impact resistance, thus being useful as electric and electronic device parts and automobile parts. This composition can be molded into various moldings in a conventional manner.
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公开(公告)号:EP0276327A4
公开(公告)日:1990-05-14
申请号:EP87904972
申请日:1987-08-03
Applicant: TORAY INDUSTRIES
Inventor: NAKAMURA KIYOKAZU , KOMETANI KIICHI , KOSHINO AKIHIKO , HORIUCHI KENJIRO
IPC: C08G59/18 , C08G65/48 , C08L59/00 , C08L63/00 , C08L67/00 , C08L67/02 , C08L69/00 , C08L71/00 , C08L71/12 , C08L77/00 , C08L81/06 , C08L71/04
CPC classification number: C08L71/12 , C08G65/485 , C08L59/00 , C08L67/00 , C08L67/02 , C08L69/00 , C08L71/00 , C08L77/00 , C08L81/06 , C08L2666/14 , C08L2666/02
Abstract: A resin composition which is prepared by compounding 100 parts by weight of a polyester composition composed of: (A) 5 to 95 wt % of an aromatic polyester; and (B) 95 to 5 wt % of a polyphenylene ether having the repeating units (I), and/or modified polyphenylene ether obtained by reacting the above-described polyphenylene ether with 0.05 to 20 wt % of an active functional group-containing monomer, with 0.05 to 30 parts by weight of an epoxy compound represented by formula (C). This resin composition has excellent moldability and dimensional stability upon molding, and the moldings made of the composition shows excellent mechanical properties and excellent solvent resistance.
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