公开(公告)号：DE69032002T2

公开(公告)日：1998-07-23

申请号：DE69032002

申请日：1990-09-25

Applicant: TORAY INDUSTRIES

Inventor： MORITA TOHRU ,  NAGAHAMA AKIHIKO ,  UEDA TOSHIAKI ,  ONO MASAAKI

IPC: B29C47/00 ,  B29C47/88 ,  B32B27/36 ,  G11B5/73

Abstract: A composite polyester film comprising a major layer and a minor layer composed of a polyester having a melt resistivity of less than 5 x 10 OMEGA .cm and lower than that of a polyester constituting the major layer and a thickness of 1/200 to 4/10 of the thickness of the composite film as a whole. The film exhibits excellent electrostatic castability and heat stability.

公开(公告)号：EP0645416A4

公开(公告)日：1996-02-21

申请号：EP94910562

申请日：1994-03-29

Applicant: TORAY INDUSTRIES

Inventor： MIYAJI SHINICHIRO ,  KIDA KENJI ,  UEDA TOSHIAKI

IPC: C08J5/04 ,  H05K1/03 ,  B29C70/00

CPC classification number: C08J5/04 ,  C08J2381/02 ,  H05K1/0333 ,  Y10S428/901 ,  Y10T428/24479 ,  Y10T428/2495 ,  Y10T428/2982

Abstract: A fiber sheet impregnated with a resin composition mainly comprising poly-p-phenylene sulfide and having the degree of orientation of 0.3 to 0.9. The sheet is markedly improved in thermal resistance, thermal dimensional stability, dielectric characteristics and mechanical properties when folded, thus being suited for use as insulation base material for circuit boards and multilayer interconnection boards wherein higher-density and thinner circuits are necessitated.

Abstract translation: 浸渍有主要包含聚对苯硫醚并且取向度为0.3至0.9的树脂组合物的纤维片。 当折叠时，片材的热阻，热尺寸稳定性，介电特性和机械性能显着提高，因此适合用作电路板和多层互连板的绝缘基材，其中需要更高密度和更薄的电路。