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    4.
    发明专利
    未知

    公开(公告)号：DE69427258T2

    公开(公告)日：2001-12-06

    申请号：DE69427258

    申请日：1994-03-29

    Applicant: TORAY INDUSTRIES

    Inventor： MIYAJI SHINICHIRO ,  KIDA KENJI ,  UEDA TOSHIAKI

    IPC: C08J5/04 ,  H05K1/03 ,  B29C67/24

    Abstract: A fiber sheet impregnated with a resin composition mainly comprising poly-p-phenylene sulfide and having the degree of orientation of 0.3 to 0.9. The sheet is markedly improved in thermal resistance, thermal dimensional stability, dielectric characteristics and mechanical properties when folded, thus being suited for use as insulation base material for circuit boards and multilayer interconnection boards wherein higher-density and thinner circuits are necessitated.

    5.
    发明专利
    未知

    公开(公告)号：DE69217546T2

    公开(公告)日：1997-06-05

    申请号：DE69217546

    申请日：1992-04-17

    Applicant: TORAY INDUSTRIES

    Inventor： KIDA KENJI ,  MIYAJI SHINICHIRO ,  DEGUCHI YUKICHI

    IPC: B29C47/06 ,  B29C55/12 ,  B29K81/00 ,  B29L9/00 ,  B32B7/02 ,  B32B7/10 ,  B32B27/00 ,  B32B27/08 ,  B32B27/28

    Abstract: A laminated polyphenylene sulfide film wherein the central layer comprises a biaxially oriented polyphenylene sulfide film and the surface layer comprises a phenylene sulfide copolymer containing a comonomer unit other than a p-phenylene sulfide unit in an amount of 3 to less than 50 mole %. The film has improved bondability, particularly heat sealability, without detriment to the heat resistance and mechanical properties inherent in a biaxially oriented polyphenylene sulfide film.

    7.
    发明专利
    未知

    公开(公告)号：DE69416109T2

    公开(公告)日：1999-09-09

    申请号：DE69416109

    申请日：1994-10-20

    Applicant: TORAY INDUSTRIES

    Inventor： KAWATSU YUKIO ,  TSUNASHIMA KENJI ,  TOYODA KATSUYA ,  ANDO KATSUTOSHI ,  YAMAUCHI HIDEYUKI ,  KIDA KENJI

    IPC: B32B27/36 ,  B41N1/24

    Abstract: The specification discloses a thermal stencil paper for mimeograph, having a uniform shape of pores and well-balanced retainability and permeability of printing ink. Thermal stencil paper for mimeograph formed by laminating a porous support member comprising polyester fibers on one surface of a polyester film, characterized in that the porous support member forms a reticulate body having a fusing point at which the fibers are fused to one another, a film which straddles the fibers, and which has a thickness smaller than an average fiber diameter, being formed at some of the fusing points in the reticulate body. Since such thermal stencil paper for mimeograph is provided, the printed matter obtained by a mimeograph using this stencil paper has a high quality of image, and set-off does not occur. Such printed matter is highly convenient to transport.

    8.
    发明专利
    未知

    公开(公告)号：DE69416109D1

    公开(公告)日：1999-03-04

    申请号：DE69416109

    申请日：1994-10-20

    Applicant: TORAY INDUSTRIES

    Inventor： KAWATSU YUKIO ,  TSUNASHIMA KENJI ,  TOYODA KATSUYA ,  ANDO KATSUTOSHI ,  YAMAUCHI HIDEYUKI ,  KIDA KENJI

    IPC: B32B27/36 ,  B41N1/24

    Abstract: The specification discloses a thermal stencil paper for mimeograph, having a uniform shape of pores and well-balanced retainability and permeability of printing ink. Thermal stencil paper for mimeograph formed by laminating a porous support member comprising polyester fibers on one surface of a polyester film, characterized in that the porous support member forms a reticulate body having a fusing point at which the fibers are fused to one another, a film which straddles the fibers, and which has a thickness smaller than an average fiber diameter, being formed at some of the fusing points in the reticulate body. Since such thermal stencil paper for mimeograph is provided, the printed matter obtained by a mimeograph using this stencil paper has a high quality of image, and set-off does not occur. Such printed matter is highly convenient to transport.

    A HEAT-SENSITIVE STENCIL SHEET AND A MANUFACTURING METHOD THEREOF
    9.
    发明专利
    A HEAT-SENSITIVE STENCIL SHEET AND A MANUFACTURING METHOD THEREOF 未知

    公开(公告)号：CA2204800A1

    公开(公告)日：1997-11-09

    申请号：CA2204800

    申请日：1997-05-08

    Applicant: TORAY INDUSTRIES

    Inventor： KAWATSU YUKIO ,  YAMAUCHI HIDEYUKI ,  KIDA KENJI

    IPC: B41N1/24 ,  B32B31/14

    Abstract: A heat-sensitive stencil sheet comprises a fibrous support of polyester fibers, and a polyester film, wherein both the orientation parameter (R1) of the film and the orientation parameter (R2) of the fibers respectively obtained by laser Raman spectrometry are in a range from 3 to 10. A method for manufacturing such a heat-sensitive stencil sheet comprises thermally bonding an undrawn polyester film and a fibrous support of undrawn polyester fibers to form a laminate and then stretching the laminate, wherein, during the bonding or during the stretching, the film and the fibrous support of the laminate are heated at different temperatures, respectively.

    10.
    发明专利
    未知

    公开(公告)号：DE69427258D1

    公开(公告)日：2001-06-28

    申请号：DE69427258

    申请日：1994-03-29

    Applicant: TORAY INDUSTRIES

    Inventor： MIYAJI SHINICHIRO ,  KIDA KENJI ,  UEDA TOSHIAKI

    IPC: C08J5/04 ,  H05K1/03 ,  B29C67/24

    Abstract: A fiber sheet impregnated with a resin composition mainly comprising poly-p-phenylene sulfide and having the degree of orientation of 0.3 to 0.9. The sheet is markedly improved in thermal resistance, thermal dimensional stability, dielectric characteristics and mechanical properties when folded, thus being suited for use as insulation base material for circuit boards and multilayer interconnection boards wherein higher-density and thinner circuits are necessitated.

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