公开(公告)号：EP2888384A4

公开(公告)日：2015-08-26

申请号：EP13831687

申请日：2013-06-28

Applicant: UNITED TECHNOLOGIES CORP

Inventor： DEMICHAEL THOMAS ,  DAS GOPAL ,  MOULIN MICHAEL A

IPC: C22F1/18 ,  C21D1/62 ,  C22C14/00 ,  C22C21/00

CPC classification number: C22F1/183 ,  C21D1/62 ,  C21D2221/00 ,  C22C14/00 ,  C22C21/00 ,  C22F1/18

Abstract: A method for forming a part having a dual property microstructure includes the steps of: forming a blank having a narrow top portion and a wide base portion; heating the blank to an elevated temperature; and forming a dual property microstructure in the blank by cooling different portions of the blank at different cooling rates.