公开(公告)号：WO0239802A3

公开(公告)日：2003-04-03

申请号：PCT/US0147517

申请日：2001-11-07

Applicant: UNITIVE ELECTRONICS INC ,  RINNE GLENN A

Inventor： RINNE GLENN A

IPC: B23K3/06 ,  G02B6/35 ,  G02B6/42 ,  H05K1/02 ,  H05K3/32 ,  H05K3/34 ,  B23K313/06 ,  G01F23/292

CPC classification number: G02B6/4219 ,  B23K3/0623 ,  B23K2201/40 ,  G02B6/3502 ,  G02B6/3512 ,  G02B6/3538 ,  G02B6/3568 ,  G02B6/3574 ,  G02B6/3594 ,  G02B6/3652 ,  G02B6/4232 ,  G02B6/4238 ,  G02B6/4239 ,  H01L2224/75251 ,  H01L2924/01019 ,  H01L2924/12041 ,  H05K1/0212 ,  H05K3/303 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3457 ,  H05K2201/09427 ,  H05K2201/09781 ,  H05K2203/048 ,  H05K2203/0776 ,  H05K2203/167 ,  Y02P70/613

Abstract: A liquid prime mover can be used to position a component on a substrate. For example, a liquid material can be provided on the substrate adjacent the component such that the component has a first position relative to the substrate. A property of the liquid material can then be changed to move the component from the first position relative to the substrate to a second position relative to the substrate. Related structures are also discussed.

Abstract translation: 可以使用液体原动机将组件定位在基板上。 例如，液体材料可以设置在邻近部件的基板上，使得部件相对于基板具有第一位置。 然后可以改变液体材料的性质，以使组件相对于衬底从第一位置移动到相对于衬底的第二位置。 还讨论了相关结构。

公开(公告)号：WO0239463A9

公开(公告)日：2003-02-13

申请号：PCT/US0143948

申请日：2001-11-05

Applicant: UNITIVE ELECTRONICS INC

Inventor： RINNE GLENN A

IPC: B23K1/00 ,  B23K35/00 ,  B23K35/26 ,  H01L21/60 ,  H01L23/485 ,  H05K3/34 ,  H01B

CPC classification number: H01L24/10 ,  B23K1/0004 ,  B23K35/001 ,  B23K35/26 ,  B23K2201/40 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13155 ,  H01L2224/13609 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2203/1476 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A first substrate is attached to a second substrate by providing solder structures that include a first portion adjacent the second substrate that has a first melting point, and a second portion adjacent the first substrate that has a second melting point that is lower than the first melting point. The solder structures then are heated to a first temperature that is at or above the second melting point but below the first melting point, to melt the second portions. Simultaneous with the heating of the solder structures to the first temperature, the first substrate is attached to the second substrate while the second portions are melted. Finally, the solder structures are heated to a second temperature that is above the first temperature, to alloy at least some of the first portions and the second portions. Accordingly, low temperature joining and/or positioning of the first substrate relative to the second substrate may be performed, followed by conversion of at least part of the solder structures to a higher melting point alloy, thereby allowing a reduced creep rate.

Abstract translation: 第一衬底通过提供焊料结构附着到第二衬底，该焊料结构包括邻近具有第一熔点的第二衬底的第一部分，以及与第一衬底相邻的第二部分，第二部分具有低于第一熔化的第二熔点 点。 然后将焊料结构加热到等于或高于第二熔点但低于第一熔点的第一温度，以熔化第二部分。 在将焊料结构加热到第一温度的同时，第一基板在第二部分熔化时附着到第二基板。 最后，将焊料结构加热至高于第一温度的第二温度，以合金至少部分第一部分和第二部分。 因此，可以执行第一衬底相对于第二衬底的低温接合和/或定位，随后将至少部分焊料结构转化为较高熔点的合金，由此允许降低的蠕变速率。

公开(公告)号：WO0191176A3

公开(公告)日：2002-04-18

申请号：PCT/US0114674

申请日：2001-05-07

Applicant: UNITIVE ELECTRONICS INC ,  RINNE GLENN A

Inventor： RINNE GLENN A

IPC: H01L21/48 ,  H01L21/60 ,  H05K3/34 ,  H01L23/485

CPC classification number: H01L24/12 ,  H01L21/4853 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11901 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3463 ,  H05K3/3473 ,  H05K2201/10992 ,  H01L2224/13099 ,  H01L2924/00

Abstract: Solder bumps are fabricated by plating a first solder layer (150) on an underbump metallurgy (130), plating a second solder layer (160) having higher melting point than the first solder layer on the first solder layer and plating a third solder layer (170) having lower melting point than the second solder layer on the second solder layer. The structure then is heated to below the melting point of the second solder layer but above the melting point of the first solder layer and the third solder layer, to alloy at least some of the first solder layer with at least some of the underbump metallurgy and to round the third solder layer. Accordingly, a trilayer solder bump may be fabricated wherein the first and third layers melt at lower temperatures than the second solder layer, to thereby round the outer surface of the solder bump and alloy the base of the solder bump to the underbump metallurgy, while allowing the structure of the intermediate layer to be preserved. Solder bump fabrication as described above may be particularly useful with lead-tin solder wherein the first solder layer is eutectic lead-tin solder, the second solder layer is lead-tin solder having higher lead content than eutectic lead-tin solder and the third solder layer is eutectic lead-tin solder. In yet other embodiments, the thickness and/or composition of the outer underbump metallurgy layer and/or of the first solder layer may be selected so that upon heating, sufficient tin from the first solder layer is alloyed with at least some of the outer underbump metallurgy layer, such that the first solder layer is converted to a fourth solder layer having the same lead content as the second solder layer. Bilayer solder bumps thereby may be provided.

Abstract translation: 通过在第一焊料层上电镀第一焊料层（150），在第一焊料层上电镀具有比第一焊料层更高的熔点的第二焊料层（160）并镀覆第三焊料层（ 170），其熔点低于第二焊料层上的第二焊料层。 然后将该结构加热到低于第二焊料层的熔点但高于第一焊料层和第三焊料层的熔点，以使第一焊料层中的至少一些与至少一些下焊管冶金和 绕第三焊料层。 因此，可以制造三层焊料凸块，其中第一和第三层在比第二焊料层更低的温度下熔化，从而使焊料凸块的外表面圆周化，并将焊料凸块的基底合金到底部焊接冶金，同时允许 待保存的中间层的结构。 如上所述的焊料凸块制造对于铅锡焊料尤其有用，其中第一焊料层是共晶铅锡焊料，第二焊料层是比共晶铅锡焊料具有更高铅含量的铅锡焊料，而第三焊料 层是共晶铅锡焊料。 在另外的其它实施例中，可以选择外部底部基质金属层和/或第一焊料层的厚度和/或组成，使得在加热时，来自第一焊料层的足够的锡与至少一些外部底部基底 使得第一焊料层被转换成具有与第二焊料层相同的铅含量的第四焊料层。 可以提供双层焊料凸块。